Description
MD-130 Lord Thermoset Syringe Electrically Insulating Die-Attach Adhesive
LORD Thermoset MD-130 adhesive is a one-component, microelectronic grade adhesive designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.
Volume Resistivity, ohm-cm @ 25C:1 x 1015
Thermal Conductivity, W/mK @ 25C:0.42
Coefficient of Linear Thermal Expansion, ppm/C
below Tg:35
Glass Transition Temperature (Tg), C:140
Hardness, Shore D:88
Die Shear Strength, psi:8200
Elongation at Break, %:1.7
Storage Modulus, MPa @ 25C:1706
Dielectric Constant:4.2
Dissipation Factor:0.008
Manufacturer: Electronic Components
MFG Part #: MD-130
