Mechanical Components > Bergquist Henkel
The Bergquist Company | Henkel Corporation
Bergquist, based in Chanhassen, MN, USA, supplies thermal-management solutions for electronic applications, serving a variety of industries ranging from automotive to consumer and industrial electronics as well as LED lighting, in North America, Asia-Pacific and Europe.
Sep 18, 2014 : Henkel acquired The Bergquist Company
Electronics Group of Henkel
Innovation, performance and customer satisfaction are Henkel’s guiding principles. Today, Henkel supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates.
Products
Gap Pad HC 5.0
A soft and compliant gap filling material, Bergquist’s Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.
Publish Date: 2016-08-11
TCF 4000 PXF Bridgelux Qualified Thermal Pads
Bergquist’s TCF 4000 PXF phase-change thermal interface material is a reworkable material suitable for use between heat-sinks and other heat dissipating components.
Sil-Pad® 900S
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.
Q-Pad® 3
Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.
Gap Pad® 1500
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
Sil-Pad® K-10
The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.
Gap Pad® VO Ultra Soft
Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.
Gap Pad® VO Ultimate
Gap Pad® VO Ultimate for both small and large gap designs features thermal conductivity of 1.3 W/m-K and ultra conformability.
Bergquist Selection Guides
Bergquist Comprehensive Sil-Pad Selection Guide
Bergquist Comprehensive Thermal Clad Selection Guide
Bergquist Thermal Solutions Selection Guide
Bergquist LED Thermal Solutions Brochure
Bergquist HeatSeal Membrane Switch Catalog
Bergquist is renowned in the industry for its innovation, performance and customer satisfaction. Today, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates.
Bergquist’s Thermal Products Group is the world leading developer and manufacturer of thermal management materials. We provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Sil-Pad products are used by many of the world’s largest OEMs in various industries including automotive, computer, power supply, military and motor control.
Materials Offered
- Sil-Pad
- Gap Pad
- Bond-Ply
- Hi-Flow Phase Change
- Liquid Dispensed Materials
- Thermal Properties and Testing
Thermal Materials Markets Served
- Aerospace/Military
- Automotive
- Computer & Peripherals
- Consumer Electronics
- Motor Control
- Power Conversion
- Telecommunications
Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Now covering nearly all phases of semiconductor packaging, electronics assembly, thermal management and structural assembly, Henkel is unmatched in its ability to provide top electronics companies with comprehensive material solutions.
