3D PLUS

3D PLUS is a leading supplier of high-performance microelectronic components for the defense and space markets. In the defense sector, they provide advanced 3D stacked memory modules, radiation-hardened components, and high-density packaging solutions that meet stringent military standards for reliability and durability. For space applications, 3D PLUS offers space-grade memory, data processing units, and power management systems essential for satellite and spacecraft missions. Their innovative 3D packaging technology ensures compact, lightweight, and robust solutions, making them the preferred choice for critical applications in these demanding environments.

As of 2024, with over 210,000 modules in space and more than 25 years of flight heritage with zero failures, 3D PLUS stands as Europe’s largest manufacturer of hybrid space-qualified catalog products and custom system-in-packages (SiPs).

For more than 25 years, 3D PLUS has been recognized for its innovation in designing and manufacturing miniaturized 3D modules. Their technology enables stacking heterogeneous active, passive, and opto-electronic devices in a single, highly miniaturized package.

3D PLUS offers high-reliability and high-performance products thanks to their expertise in designing complex electronic modules and their technical capabilities in areas such as digital, analog, and IP cores. Combined with strong space radiation expertise, these capabilities enable them to deliver key advantages for all kinds of space missions with a high level of reliability.

3D PLUS’s standard products and custom solutions bring breakthrough advantages to their customers’ electronic designs. They are used in various computer boards, data recorder boards, and custom applications for buses and payloads. Their flight heritage continues to expand, with products launched into space every month in GEO, MEO, and LEO orbits, for deep space exploration missions, satellite constellation fleets, and governmental missions.