Allegro MicroSystems Identifier (the letter 'A')
ATS = Allegro geartooth sensor module
ACS = Allegro current sensor

IC Part Numbering System

Allegro MicroSystems New Part Numbers

A        1234       E     A                F-1

Device Type (four digits)

Operating Temperature Range
C = Commercial (0°C to +70°C)
S = Standard (-20°C to +85°C)
E = Extended automotive/industrial (-40°C to +85°C)
F = Extended automotive/industrial (-40°C to +95°C)
G = Extended industrial (-40°C to +105°C)
K = Extended industrial/military (-40°C to +125°C or +135°C)
L = Automotive/military (-40°C to +150°C)

Package Designation
A = Dual in-line (MS-001, MS-010, MS-011)
B = Dual in-line with heat-sink semi-tabs (MS-001, MS-010)
CA = Current sensor, plated power lead frame (130 uOhm resistance)
CB = Current sensor, plated power lead frame (100 uOhm resistance)
EA = Sq. J-leaded chip carrier with 1 heat-sink

 semi-tab (MS-018)

EB = Sq. J-leaded chip carrier with 2 heat-sink semi-tabs (MS-018)
ED = Sq. J-leaded chip carrier with 4 heat-sink semi-tabs (MS-018)
EF = Current-sensing, leadless 1.27 mm pitch, dual very-thin chip carrier
EH = Rectangular leadless (exposed pad) 0.50 mm pitch, dual very-very-thin chip carrier (MO-229)
EK = Square leadless (exposed pad) 0.95 mm pitch, dual very-very-thin chip carrier (MO-229)
EP = Sq. J-leaded chip carrier (MO-047, MS-007, MS-018)
EQ = Rect. J-leaded chip carrier (MS-016)
JP = Low-profile QFP (exposed pad) (MS-026)
JT = Low-profile QFP with gull-wing leads (MS-026)
K = Mini-SIP, four leads
KA = Mini-SIP, five leads
KB = Mini-SIP, three leads
KC = Mini-SIP, three leads
L = Narrow-body SOIC (MS-012)
LB = Wide-body SOIC with heat-sink semi-tabs (MS-013)
LD = TSSOP, 0.50 mm pitch (MO-153)
LE = TSSOP, 0.65 mm pitch (MO-153)
LH = Low-profile, three-terminal surface mount (SOT23W)
LM = Low-profile, five-terminal surface mount
LP = TSSOP (exposed pad), 0.65 mm pitch (MO-153)
LQ = SOP, 0.80 mm pitch
LT = SOT, three leads (SOT89/TO-243AA)
LU = SOT, six leads (similar to SOT89)
LW = Wide-body SOIC (MS-013)
LZ = Narrow-body TSSOP, 0.50 mm pitch
M = Eight-pin mini-DIP (MS-001BA)
SA = Module, 9 mm length
SB = Module, 7 mm length
SE = Module
SG = Module
SH = Module, two-wire
U = Three-lead mini-SIP (not for new design)
UA = Three-lead short, thin mini-SIP

Instructions (see next page)

Allegro MicroSystems New Part Numbers

F-1

Instructions (optional; in the order listed)
A or –A = Revision, see detail specification
F = Active pull-down device (BiMOS only)
-R = Internal pull-up resistor
-1 = Selected version, see detail specification
-LN = Low on tooth
-LT = Low on tooth/TPOS
LT = Tape and reel, low-profile SOT23 (TO-236AB)
-I1, I2, I3 = Two-wire current level
-FP = Factory programmed
LC = Radial lead form
LF = Lead form per customer drawing
TL = Surface-mount lead form
TA = Tape and reel, style A
TC = Tape and reel, style C
TI = Tape and reel, no lead form
TK = Tape and reel, SOT89, 4000 pieces per reel
TN = Pocket tape and reel: SG, SH, SE packages
TR = Tape and reel
-T = Lead free
-PSF = Plated, straight power leads, formed signal leads
-PFF = Plated, formed power leads, formed signal leads
TS = Surface-mount lead form in pocket tape

Original Sprague Semiconductor Group Part Numbers

Family (UC, UD, UG, or UL)

Operating Temperature Range
L = Limited (0°C to +50°C)
K = Extended automotive/industrial (-40°C to +125°C, Typ.)
N = Commercial/industrial (-20°C to +85°C, Typ.)
Q = Automotive/industrial (-40°C to +85°C, Typ.)

Device Type (four digits)

Package Designation
Same as Allegro New Part Number System

Instructions
Same as Allegro New Part Number System

UC

N

5810

A

F-1