KEC-Presentation-html.html

1. Company Overview

Company Name

KEC CORPORATION

5, Mabang-ro, 10-gil, Seocho-gu, Seoul, Korea

Sep. 9th. 1969 (Spin off in 2006)

US$ 39Mil.

US$ 192Mil. (2016)

Chang-sup,Hwang

638people (as the end of 2016)

Non-memory semiconductor (Transistor, Diode, IC, MOS…etc)

Location

Founded

Capital

Revenue

President

Head Count

Product

2/13

The Best Technology

Will be constantly challenged.

2. VISION & Management Philosophy

Creating electronic technologies is

Our Business

Always thinking from an international perspective and working

To develop ourselves to our full potential,

we strive to providing

the finest products as well as help Improve the quality of life for all.

We share this joy with the society.

We would be a global leader moving forward all around

The world.

KEC will always stay in progress toward advanced technology and

know-how.

Our challenge will never stop to be “worldwide No.1 in semiconductor”

VISION

Worldwide No.1

In Semiconductor

Achieve US$600Mil. In 2020 (SSTR worldwide No.1)

ㆍMore Products for SMALL SIGNAL TR, DIODE, Complex discrete
ㆍEnlarge POWER (MOSFER, Power Module)

Main Strategy

3/13

Worldwide No.1 semiconductor expert company

3. Craftsmanship’s KEC

Craftsmanship’s KEC

We pursue only one goal which’s semiconductor from the time of

Foundation 1969. KEC got acknowledged for faithful quality and superb

Technology by worldwide electronic companies, which were achieved by

Its ceaseless development in technology and innovation in management.

Semiconductor expert’s KEC

By the year 2000, KEC got worldwide competitiveness in its major business

Territory, SSTR and now expanding the market by challenging POWER

Semiconductor for the goal to be No.1 at SSTR market in 2017 with the

Total revenue of U$ 600Mil.

World’s smallest package’s KEC

KEC will create our better future by going forward the most compact SMD

Packages, Ultra-power-saving discrete, the most efficient Rf discrete… etc

Thank you.

4/13

Our challenges to be

“worldwide No.1 in semiconductor” will never stop.

chairman

4. History

1969 (Sep)

1970 (Mar)

1974 (Mar)

1975 (Jun)

1979 (Oct)

1988 (Jul)

1990 (Oct)

1995 (Ma)

1995 (Sep)

2000 (Mar)

2000 (May)

5/13

– Established as Korea Toshiba Co., Ltd

– Started Transistor Production

– Renamed to Korea Electronics Co.,Ltd.

– Started IC Production

– IPO (Initial Public Offering) Started

Fabrication for semiconductor Devices

– Established KEC Hong Kong (KEC-H)

Sales Branch

–

Established KEC Thailand (KEC-T)

Assembly Plant.

– Established KEC Wuxi Assembly Plant

– Moved HQ to Yangiae-Dong, Seoul

– Implementation of ERP System

– Renamed to KEC CORPORATION

2001 (Jun)

2003 (Dec)

2004 (Aug)

2005 (Sep)

2006 (Mar)

2007 (May)

2008 (Aug)

2009 (Aug)

2009 (Nov)

– Awarded Grand Prize of “2001 Korea’s Best company of Value

Management”

– Received a “Best Product-SSTR” Award from Korea Dept. of Commerce.

– Declaration of MOS Business

– Started 6” Wafer Production in China FAB plant

– Opened MOS FAB Plant in Korea

–

Achieved 30M$ of monthly turnover

– Started Sensor, Module, IGBT Production

– MOU with Seoul Metropolitan Rapid Transit Corp. on developing IGBT

Modules

– Developed “Ultra Fast Recovery Diode” for Flat Panel display TV

(First time in Korea)

2009 (Dec)

2010 (Apr)

2011 (Jan)

2011 (Apr)

2012 (Dec)

2013 (Nov)

2013 (Dec)

2014 (Aug)

2015 (Feb)

2016 (Jul)

– Long-term supply contract of LED Chip with LG innotek

– Long-term supply contract of LED Package with LG innotek

– Joint development contract with Hyundai Mobis for Power Module of Hybrid car

– Selected as “Best partner of LG innotek”

– Launched new product “power Module for Electric Vehicles” product

“High Power IGBT Chips” for the first time in Korea

– Received UL Certification of the General Purpose Power Module

–

11 Obtained the patent on the Green Die-bonding technology

– 2013. 12 Received SQ Certification from HYUNDAI-KIA Motors

- Developed Low VF SBD applying Trench Process

- Developed and produced Ultra-Low Current consumption Detector, Reset IC certifying AEC-Q100

- Developed the next generation Synchronous Rectification MOSFET

5. Global Network –

Production & Supply Network

GUMI

THAILAND

WUXI

ASSEMBLY
FAB

TIANJIN

SHENZHEN

BANGKOK

SINGAPORE

HONGKONG

TAIWAN

SHANGHAI

OSAKA

TOKYO

Sales Branch
Sales Office



Production



Supply

NETWORK

① Sales Site : 11 (Korea :2 Sales Offices / Oversees : 5 Branches and 4 office)

② Production Site : 54 (Korea : FAB 1, Assembly 1 / Oversees : Assembly 2)

③ R&D : 2개 (Korea 1 / Japan1)

Globalization

6/13

7/13

6. Organization

KEC-J

KEC- CN

KEC-TWN

KEC-A

Strategic

business

Group

Product

technology

Group

NEW BUSINESS

PROMOTION

OFFICE

MANAGEMENT

SUPPORT TEAM

PRESIDENT

MANAGEMENT

PLANNING

OFFICE

Planning

Group

Funds Group

Human

Resources

Group

Purchasing

Group

Customer satisfaction

Group

QUALITY ASSURANCE

OFFICE

Quality Assurance

Group

LABORATORY

MARKETING HEADQUARTERS

MANUFACTURING

HEADQUARTERS

Manufacturing Support

Group

Process

Technology Group

Manufacturing

Department 1

Manufacturing

Department 2

Marketing

Planning Group

LG-G

SS-G

BUSINESS HEADQUARTERS

Business

Planning

Group

Application

Engineering

Group

Outsourcing

Group

Supply Chain

Management

Group

7. Main Product Line up –

ⓐ Grouped by characteristics



General Purpose Transistor



General Purpose BRTs



Small Signal Junction Field Effect Transistor



RF/VHF/UHF Transistor



High hFE Transistor



Low VCE(sat) Transistor



Low Noise Transistor



Darlington Transistor



High Voltage Transistor



Small signal Switching Diode



Schottky Barrier Diode(SBDs)



Zener Diode



TVS Diode



Varactor Diode(AFC Application for FM, AM Tuning, …)



Fast Recovery Diode(FRDs)



Band Switching Diode



PIN Diode



Transistor Array & Interface Driver



Voltage Detector



OP Amp & Comparator



Logics MOS



Voltage Stabilizer



Voltage Regulator



Power Supply Controllers



High Voltage MOSFETs



Low Voltage MOSFETs



RF MOSFETs



S MOSFETS



Alternator Diode



Surge Absorber

BJT

POWER MODULE

AUTOMOTIVE DECIVE

DIODE

INTERGRATED CIRCUIT

MOSFET

IGBT

8/13

TO-92

4.8x4.7x3.7

IPAK

6.6x6.1x2.3

TO-126

8.3x11.0x3.4

TO-220AB

10.0x15.0x4.7

TO-220IS

10.0x15.0x4.5

SMF

2.6x1.6x0.98

SMA

4.5x2.6x2.0

TO-3P(H)IS

16.3x20.0x5.5

SOT-223

6.5x3.5x1.8

DPAK/5

6.6x6.1x2.3

TO-247

16.3x20.8x5.0

FLP-16

9.9x3.9x1.6

USC

(SOD-323)

1.7x1.25x0.9

VSM

(SOT-23)

1.2x0.8x0.5

FLP-8

4.8x3.9x1.6

ESC

(SOD-523)

1.2x0.8x0.6

TFSC

0.8x0.6x0.38

ELP-2

0.6x0.3x0.28

D2PAK/5

9.8x8.8x4.0

VSC

(SOD-723)

1.0x0.6x0.5

ULP-2

1.0*0.6*0.38

USQ/V/6

(SOT-353)

2.0x1.25x0.9

T(E)SQ/V/6

2.9x1.6x0.7

ULP-10

2.5x1.0x0.58

UDFN2020-3

2.0x2.0x0.6

PDFN56

5.1x6.05x1.1

UDFN1608-2

1.6x0.8x0.37

SOT-89

4.7x2.5x1.5

TO-3P(N)

15.9x20.0x4.8

SOT-23

2.93x1.3x1.0

USM

(SOT-323)

2.0x1.25x0.9

USF

1.9x1.25x06

DIP-8

9.6x6.45x3.8

DIP-16

25.1x6.4x3.3

SMD

THD

9/13

7. Main Product Line up –

ⓑ Product Line up by Package