MLC

Capacitors

Introduction to Knowles Capacitors 

At Knowles Capacitors, we make Single Layer, Multilayer, 

High Reliability and Precision Variable Capacitors; EMI 

Filters; and Thin Film Devices.

Our business was formed by combining Dielectric 

Laboratories, Johanson Manufacturing, Novacap, Syfer 

Technology and Voltronics into a single organization — each 

well-established specialty capacitor makers with a combined 

history of more than 175 years.

 

Our expertise is the design and manufacture of components 

important to engineers in applications where function and 

reliability are key. The markets we serve include medical 

implantable and medical equipment, military, aerospace/

avionics, EMI and connector filtering, oil exploration, 

instrumentation, industrial electronics, optical networks, 

telecom and automotive.

We aim to be a leader in every market we serve, to the benefit 

of our customers and our mutual long-term success. 

We achieve this by:

•  Understanding our customers’ real needs and providing   
    products and services to meet and exceed them.

•  Providing better products and services than competitors.

•  Investing in product development, manufacturing
    processes and people.

•  Insisting on the highest ethical standards and a business    
    culture of trust, respect and open communication.

Products in this catalog form the basis of our ranges for

"new designs." However, there are legacy products from

our five brands that will still be available — we ask that 

you contact your local Knowles Precision Devices Sales 

Office for details and ordering.

3

Introduction to Knowles Capacitors 

Table of Contents

INTRODUCTION TO KNOWLES CAPACITORS 
Product Selector  ............................................................................................................................................................... 4-5
Dielectric Characteristics  ................................................................................................................................................ 6-8
Dielectric Termination Combinations .............................................................................................................................. 9
FlexiCap™ Overview  ......................................................................................................................................................... 10
Manufacturing Processes  ................................................................................................................................................ 11
Testing  ............................................................................................................................................................................... 12
IECQ-CECC and AEC-Q200 

—

 Periodic Tests  ............................................................................................................... 13

High Reliability Testing  .................................................................................................................................................... 14
Regulations and Compliance  .......................................................................................................................................... 15
Explanation of Aging of MLC  .......................................................................................................................................... 16
Mounting, Soldering, Storage and Mechanical Precautions  ....................................................................................... 17-19
Chip Marking System ........................................................................................................................................................ 20
Ceramic Chip Capacitors 

—

 Packaging Information  .................................................................................................... 21-22

Chip Dimensions  .............................................................................................................................................................. 23

MLCC ORDERING INFORMATION 

Chip Ordering Information  .............................................................................................................................................. 24-26

MLC CAPACITORS 
C0G/NP0 (1B) — AEC-Q200 and Standard Ranges ....................................................................................................... 27-29
X7R (2R1) — AEC-Q200 and Standard Ranges ............................................................................................................... 30-32
Ordering Information — AEC-Q200 and Standard Ranges........................................................................................... 33
Novacap Range (Lead-Containing) .................................................................................................................................. 34-35
Standard Chip — BX  ......................................................................................................................................................... 36
Improved ESR Capacitors — BX and X7R ....................................................................................................................... 37
High Q Capacitors — Q and U Ranges ........................................................................................................................... 38-40
Ultra-Low ESR High Q MLCCs — X8G Range ................................................................................................................. 41-42
High Q Capacitors, High Power RF — Surface Mount and Ribbon Leaded ................................................................ 43-44
High Q Porcelain Capacitors — CF Series ...................................................................................................................... 45-47
High Q Porcelain Capacitors — AH Series ..................................................................................................................... 48-50
UL Series — Ultra Low ESR Ceramic Capacitors ........................................................................................................... 51-54
VC1 Residual Capacitors — X7R ...................................................................................................................................... 55
TCC/VCC Capacitors — (BX and BZ) X7R ....................................................................................................................... 56-57
Open Mode Capcitors — C0G/NP0 (1B) and X7R (2R1) ................................................................................................. 58
Tandem Capacitors — X7R (2R1) ...................................................................................................................................... 59
IECQ-CECC Range — Specialty High Reliability and Approved Parts ......................................................................... 60
High Capacitance Chip — X7R and X5R ......................................................................................................................... 61-62
StackiCap

TM

 Capacitors — AEC-Q200 and Standard Ranges ....................................................................................... 63

250Vac Rated 50/60Hz AC Capacitors — C0G/NP0 and X7R ....................................................................................................................64
Safety Certified AC Capacitors ........................................................................................................................................ 65
Enhanced 250Vac and 305Vac Safety Certified AC Capacitors .................................................................................. 66-69
Legacy 250Vac Safety Certified AC Capacitors ............................................................................................................ 70-72
Non-Magnetic Capacitors — High Q, C0G/NP0, X5R and X7R — 16V to 7.2kV .......................................................... 73-74
Non-Magnetic Capacitors, High Power RF — Porcelain High Q .................................................................................. 75-76
115Vac 400Hz Capacitors ................................................................................................................................................. 77
DWV Chip Range — C0G/NP0 and X7R .......................................................................................................................... 78
X8R High Temperature Capacitors 

—

 up to 150

ºC ........................................................................................................ 79

High Temperature Capacitors — 160ºC and 200ºC ...................................................................................................... 80
High Temperature HiT Range — 200ºC — C0G/NP0 and X7R ..................................................................................... 81
High Temperature HiT250 Range — 250°C — C0G/NP0 and X7R .............................................................................. 82
Capacitor Assemblies — ST and SM — C0G/NP0 and X7R .........................................................................................................................83-88
Capacitor Assemblies — "Cap-Rack" Arrays .................................................................................................................. 89
Capacitor Assemblies SV2220 ........................................................................................................................................ 90-92

MLC RADIAL LEADED CAPACITORS
Radial Leaded Capacitors — Ordering Information  ...................................................................................................... 93
Standard Radial Leaded Capacitors — 50V to 5kV ....................................................................................................... 94
Standard Radial Leaded Capacitors — 500V to 10kV ................................................................................................... 95
Standard Radial Leaded Capacitors — C0G/NP0 and X7R ........................................................................................... 96
Standard Radial Leaded Capacitors — Packaging Information .................................................................................... 97
Radial Leaded Capacitors — Packaging Information .................................................................................................... 98-99
High Temperature Radial Leaded Capacitors — Epoxy Coated ................................................................................... 100
High Temperature Radial Leaded Capacitors — Encapsulated .................................................................................... 101

SM EMI FILTERS
Surface Mount EMI Filters — E01 and E07 Ranges ........................................................................................................ 102-103
Surface Mount EMI Filters — E03 X2Y Integrated Passive Components .................................................................... 104-105

Product Selector 

4

Medical

Modem/Tip and Ring

High Speed Decoupling

High Frequency

Snubber

AC Noise Removal

Automotive

RF

Decoupling/Smoothing

Feedthrough Filtering

Frequency Control/Tuning,

Impedance Matching

High Voltage Circuitry

Harsh Environments

Mil/Aero

Capacitors

and Filters

SM and Leaded

is particularly recommended 
for these applications where 
possible.

5

MRI/Non-Magnetic

X7R, C0G/NP0, High Q and Ultra-Low ESR

0402 to 4040 Non-Magnetic Termination

0.1pF to 6.8μF - 16V to 3kV

C0G/NP0 Range

0402 to 8060

0.47pF to 1μF - 10V to 12kV

X7R

1812/2220/2225

100nF to 1μF - 250Vdc

X7R, C0G/NP0 Y2/X1, X2

Safety Certified Ranges UL/TÜV

1808/1812/2211/2215/2220

X7R Range

0603 to 8060

100pF to 22μF - 16V to 12kV

X7R, E03 X2Y IPCs

0603 to 1812

150pF to 1.2μF - 16V to 1kV

X7R, C0G/NP0, Y2/X1, X2

Safety Certified Ranges UL/TÜV

1808/1812/2211/2215/2220

X7R, C0G/NP0 Ranges

250Vac Rated 50/60Hz AC

0505/1111/1825 Ranges

X7R, C0G/NP0, High Q

X7R and C0G/NP0, E03 X2Y IPCs

0603 to 2220

10pF to 1.2μF

E01/E07/SBSGC/SBSMC

X7R, C0G/NP0

0805 to 2220 - 1A to 20A

SBSP/SBSG/SBSM

X7R, C0G/NP0 1206 to 2220

22pF to 470nF - 1A to 10A

AEC-Q200 E03 X2Y IPCs

X7R and C0G/NP0 AEC-Q200 E01/E07

Feedthrough Capacitors

Open Mode and Tandem

FlexiCap™ Capacitors

With Extra Safe Electrode Design

X8R Range

Operational Temperature up to 150°C

Class I and II High Temperature

160°C, 200°C and 250°C

X7R, C0G/NP0

4.7pF to 22μF - 50V to 12kV

115Vac 400Hz Range

S02A/IECQ-CECC/MIL-PRF/Burn in

Hi Rel X2Y IPCs

AEC-Q200 Ranges

X7R, C0G/NP0

StackiCap™

Pages 73-76

Pages 38-54

Pages 27-29 and 34

Pages 30-32 and 35

Pages 65-72

Pages 30-32 and 35

Pages 104-105

Pages 65-72

Pages 38-54

Page 64

Pages 104-105

See EMI Filters Catalog

Pages 27-32

Pages 93-101

Page 63

Pages 102-103 and

See EMI Filters Catalog

Pages 58-59

Pages 80-82

Pages 102-105

Page 79

Pages 60, 77 and 104-105

High Q, C0G/NP0 & Porcelain Range

Ultra-Low ESR

Safety Certified

Class 1 Dielectrics

Low DF/ESR

250Vac Range

Class 1 Dielectrics

PCB Space Saving

High Capacitance

Low Inductance Capacitors

Safety Certified

Capacitive

MLCC

High Capacitance

Capacitive/Inductive Pi

High Temperature

Balanced Line Capacitors

Filtering

Dipped Radial Leaded

Capacitors

High Reliability

Capacitors and Filters

Dielectric Characteristics

 

6

CLASS I DIELECTRICS

CLASS I DIELECTRICS

Multilayer Ceramic Capacitors are generally divided into classes, 
which are defined by the capacitance temperature characteristics 
over specified temperature ranges. These are designated by alpha-
numeric codes. Code definitions are summarized below and are also
available in the relevant national and international specifications. 

Capacitors within this class have a dielectric constant range from 10 
to 100. They are used in applications that require ultra stable 

dielectric characteristics with negligible dependence of 
capacitance and dissipation factor with time, voltage and 
frequency. They exhibit the following characteristics:

a) Time does not significantly affect capacitance and dissipation   
     factor (Tan δ) – no aging. 
b) Capacitance and dissipation factor are not affected by voltage. 
c) Linear temperature coefficient.

C0G/NP0 (1B) (Porcelain)

P90 (Porcelain)

C0G/NP0 (1B)

X8G

Class I High Temperature

Dielectric

classifications

-

Ultra Stable

Ultra Stable

Ultra Stable

Ultra Stable

Ultra Stable

IECQ-CECC

-

-

1B/CG

-

-

-

EIA

C0G/NP0 (1B)

P90

C0G/NP0 (1B)

X8G

-

-

MIL

-

-

CG (BP)

-

-

-

Ordering code

DLI

CF

AH

-

-

-

-

-

Novacap

-

-

-

N, RN

-

F

D, RD

Syfer

-

-

Q, U

C

H

-

G

Voltronics

F

H

Q

-

-

-

-

Rated

temperature range

-

-55ºC to +125ºC

-55ºC to +125ºC

-55ºC to +125ºC

-55ºC to +125ºC

-55ºC to +150ºC

-55ºC to +160ºC

-55ºC to +200ºC

Maximum

capacitance 

change over

temperature range

No DC 

voltage applied

0 ± 15 ppm/ºC

+90 ± 20 ppm/ºC

0 ± 30 ppm/ºC

0 ± 30 ppm/ºC

0 ± 30 ppm/ºC

0 ± 30 ppm/ºC

0 ± 30 ppm/ºC

Rated DC

voltage applied

-

Tangent of loss

angle (tan ð)

-

≤0.0005 @1MHz

≤0.0005 @1MHz

>50pF ≤0.0015

≤50pF

0.0015 (15/Cr + 0.7)

≤0.0005 @1MHz

≤0.001

Insulation

resistance (Ri)

Time constant

(Ri x Cr)

@25ºC = 10

6

 MΩ min

@125ºC = 10

5

 MΩ min

100GΩ or 1000s

(whichever is the least)

@25ºC = 100GΩ or 1000ΩF

@160ºC & 200ºC = 1GΩ or

10ΩF (whichever is the least)

Capacitance

tolerance

Cr <4.7pF

±0.05pF, ±0.10pF, ±0.25pF, ±0.5pF

Cr≥ 4.7 to <10pF

±0.10pF, ±0.25pF, ±0.5pF

Cr ≥ 10pF

±1%, ±2%, ±5%, ±10%

Dielectric strength.

Voltage applied

for 5 seconds.

Charging

current limited

to 50mA maximum.

≤200V

2.5 times

2.5 times

2.5 times

>200V to <500V

Rated voltage +250V

500V to ≤ 1kV

1.5 times

>1kV to ≤ 1.2kV

N/A

1.25 times

>1.2kV

1.2 times

Climatic

category (IEC)

Chip

-

-

55/125/56

-

-

Dipped

-

-

-

55/125/21

-

-

Discoidal

-

-

-

55/125/56

-

-

Aging

characteristic 

(Typical)

-

Zero

Approvals

Syfer Chip

-

-

-

QC-32100

-

-

Dielectric Characteristics

7

CLASS II DIELECTRICS

CLASS II DIELECTRICS

Capacitors of this type have a dielectric constant range of 1000-
4000 and also have a nonlinear temperature characteristic that
exhibits a dielectric constant variation of less than ±15% (2R1)
from its room temperature value, over the specified temperature
range. Generally used for bypassing (decoupling), coupling,
filtering, frequency discrimination, DC blocking and voltage transient
suppression with greater volumetric efficiency than Class I units,
while maintaining stability within defined limits. 

Capacitance and dissipation factors are affected by:

a) Time (Aging)
b) Voltage (AC or DC)
c) Frequency

* Refer to the MLC Capacitors catalog for details of Dissipation Factor.

X5R

   X7R (2R1)

X8R

Class II High Temperature

Stable

Stable

Stable

Stable

-

Dielectric

classifications

-

2C1

2R1

2X1

-

-

IECQ-CECC

X5R

-

X7R (2R1)

-

X8R

-

EIA

-

BZ

-

BX

-

-

MIL

-

-

-

-

DLI

Ordering code

BW

-

B, RB

X

S

G

E, RE

Novacap

P

R

X

B

N

-

X

Syfer

-

-

X

-

-

-

-

Voltronics

-55ºC to +85ºC

-55ºC to +125ºC

-55ºC to +150ºC

-55ºC to +160ºC

-55ºC to +200ºC

-

Rated

temperature range

±15%

±15%

±15%

±15%

±15%

+15 -40%

+15 -65%

No DC voltage applied

Maximum capacitance

change over

temperature range

-

+15 -45%

-

+15 -25%

-

-

Rated DC 

voltage applied

≤ 0.025 Typical*

>25V ≤0.025 
≤25V ≤0.035

≤0.025

≤0.025

-

Tangent of loss

angle (tan ð)

100GΩ or 1000s (whichever is the least)

Time constant (Ri x Cr)

Insulation resistance (Ri)

±5%, ±10%, ±20%

-

Capacitance tolerance

2.5 times

≤200V

Dielectric strength.

Voltage applied

for 5 seconds.

Charging current limited 

to 50mA

maximum.

Rated voltage +250V

>200V to <500V

1.5 times

500V to <1kV

1.2 times

≥1kV

55/85/56

55/125/56

55/150/56

-

Chip

Climatic category (IEC)

-

55/125/21

-

-

Dipped

-

55/125/56

-

-

Discoidal

5% Typical

<2% per time decade

-

Aging

characteristic (Typical)

-

QC-32100

-

-

QC-32100

-

Syfer chip

Approvals

Dielectric Characteristics

100000000

10000000

1000000

100000

10000

1000

100

10

1

0.1

0.01

0.001

0.01

0.1

1

10

100

1000

10000

Impedance (Ohms)

Frequency (MHz)

10pF

100pF

1nF

10nF

Ultra Stable C0G/NP0 Dielectric

ESR (Ohms)

Frequency (MHz)

0.1

0.01

0.001

1

10

100

1000

100pF
1nF
10nF

0.001

0.01

0.1

1

10

100

1000

10000

Stable X7R Dielectric

1000000

100000

1000

10000

100

10

1

0.1

0.01

0.001

0.01

0.1

1

10

100

1000

10000

Impedance (Ohms)

Frequency (MHz)

10nF

1nF

100nF

1µF

Stable X7R Dielectric

ESR (Ohms)

Frequency (MHz)

0.1

0.01

0.001

0.0001

1

10

100

1000

10000

1nF

10nF
100nF

1µF

0.001

0.01

0.1

1

10

100

1000

10000

Stable X7R Dielectric 

—

 10nF

100000

1000

10000

100

10

1

0.1

0.01

0.001

0.01

0.1

1

10

100

1000

10000

Impedance (Ohms)

Frequency (MHz)

Stable X7R dielectric 10nF

1808

0805

1206

1210

Impedance (Ohms)

Frequency (MHz)

20

4,000

15

2,000

10

-2,000

5

-4,000

0

0

-5

-15

-10

-20

Capacitance Change %

Capacitance Change ppm/ºC

-55

-55

-35

-25

25

50

105

-15

0

45

75

125

Temperature 

°

C

Temperature 

°

C

Temperature 

°

C

65

100

5

25

85

125

 ppm/°C

10,000

12,500

7,500

5,000

2,500

0

-2,500

-7,500

-5,000

-10,000

-55

-40

20

100

-20

40

125

60

0

80

Upper Limit

Typical Limit

Lower Limit

Porcelain C0G/NP0 (1B) and P90

C0G/NP0 (1B)

X7R (2R1)

Typical specification limit

Typical specification limit

Typical capacitance change curves will 

lie within the band shown

C0G/NP0 (1B) Porcelain
P90 Porcelain

TYPICAL DIELECTRIC 

TEMPERATURE CHARACTERISTICS

IMPEDANCE vs. FREQUENCY

Ultra Stable C0G/NP0 (1B) Dielectric

Family

Dielectric Characteristics

Temperature Range

AH

P90 +90/ 

± 

20

-55

ºC/+125ºC

CF

C0G/NP0 0 

± 

15

-55

ºC/+125ºC

UL

C0G/NP0 0 

± 

30

-55

ºC/+125ºC

ESR vs. FREQUENCY 

—

 CHIPS

8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RoHS RoHS  

RoHS RoHS

 

RoHS

 

 

RoHS

 

 

RoHS RoHS

 

RoHS

RoHS

 

NP0 Porcelain - Hi Q

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NP0 Porcelain - Hi Q

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Termination

ordering code

DLI

-

P

Z

U

S

Q

Y

M

-

-

W

-

V

-

-

T

E

H

R

Novacap

P

PR

N

Y

NG

C

D

-

-

-

B

-

E

S

K

-

-

-

-

Syfer

-

F

J

A

-

Y

H

3

-

5

2

-

4

-

-

-

-

-

-

Voltronics

-

S

-

-

-

-

-

3

M

-

2

W

-

-

-

-

-

-

-

Dielectric

Code

NP0 Porcelain - Hi Q

DLI - CF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P90 Porcelain - Hi Q

DLI - AH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G - Hi Q/Low ESR

Syfer - Q, U

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G - Hi Q/Low ESR BME

Syfer - H

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G/NP0

Novacap - N/RN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - 

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - C, 

F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G/NP0 - BME

Syfer - G, 

K

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G/NP0 -

Non-Mag

Novacap - M

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - C, Q

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Voltronics - Q

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X5R

Syfer - P

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Novacap - BW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X7R

Novacap - B/RB  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer -

 E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - X, 

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X7R - BME

Novacap - BB

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - J

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - 

S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BX

Novacap - X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BZ

Syfer - R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X7R - Non-Mag

Novacap - C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Voltronics - X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X8R

Novacap - S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - N

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer -

 

T

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G/NP0 (160ºC)

Novacap - F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G/NP0 (200ºC)

Novacap - D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0G/NP0 (200ºC)

Novacap - RD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Class II (160ºC)

Novacap - G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Class II (200ºC)

Novacap - E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Novacap - RE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Syfer - X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Palladium Silver

Palladium Silver

Nick

el Barrier (100% matte 

tin plating) L

ead free

Nick

el Barrier 90/10% tin/lead

FlexiCap

™ with Nick

el 

Barrier 100% tin

Nick

el Barrier Gold flash

FlexiCap

™ with Nick

el 

Barrier 90/10% tin/lead

FlexiCap

™ with Copper 

Barrier 100% tin

FlexiCap

™ Ag L

ayer

, 400-u-in 

Cu Barrier 200-u-in Sn Plate

FlexiCap

™ with Copper 

Barrier 90/10% tin/lead

Copper Barrier 100% tin

Ag L

ayer

, 400-500u-in Cu Barrier

, 

200-u-in 90/10 Sn Plate

Copper Barrier 90/10%  tin/lead

Solderable Silver

Solderable P

alladium 

Silver

Ag termination, Ni Barrier

, 

Heavy SnPb Plated Solder

Ag termination, Enhanced Ni Barrier

, Sn Plated Solder

Ag termination, Enhanced Cu  Barrier

, Sn Plated Solder

Ag T

ermination, Cu Barrier L

ayer

, 

Heavy SnPb Plated Solder

Dielectric Termination Combinations

Dielectric codes in Red 

—

 AEC-Q200 qualified.

 

Dielectric codes in Green 

—

 IECQ-CECC.

9

FlexiCap™ Overview 

FLEXICAP™ TERMINATION

MLCCs are widely used in electronic circuit design for a multitude of
applications. Their small package size, technical performance and suitability for 
automated assembly make them the component of choice for the specifier.

However, despite the technical benefits, ceramic components are brittle and 
need careful handling on the production floor. In some circumstances they 
may be prone to mechanical stress damage if not used in an appropriate 
manner. Board flexing, depanelization, mounting through hole components, 
poor storage and automatic testing may all result in cracking.

Careful process control is important at all stages of circuit board assembly 
and transportation 

—

 from component placement to test and packaging. Any 

significant board flexing may result in stress fractures in ceramic devices that 
may not always be evident during the board assembly process. Sometimes it 
may be the end customer who finds out 

—

 when equipment fails!

KNOWLES HAS THE SOLUTION — 

FLEXICAP™

FlexiCap™ has been developed as a result of listening to customers’ 
experiences of stress damage to MLCCs from many manufacturers, often 
caused by variations in production processes. Our answer is a proprietary 
flexible epoxy polymer termination material that is applied to the device 
under the usual nickel barrier finish. FlexiCap™ will accommodate a greater 
degree of board bending than conventional capacitors.

FLEXICAP™ TERMINATION

Ranges are available with FlexiCap™ termination material offering increased 
reliability and superior mechanical performance (board flex and temperature 
cycling) when compared with standard termination materials. Refer to 
Knowles application note reference AN0001. FlexiCap™ capacitors enable the 
board to be bent almost twice as much before mechanical cracking occurs. 
Refer to application note AN0002. FlexiCap™ is also suitable for Space 
applications having passed thermal vacuum outgassing tests. Refer to Syfer 
application note reference AN0026.

FLEXICAP™ BENEFITS

With traditional termination materials and assembly, the chain of 
materials from bare PCB to soldered termination provides no flexibility. In 
circumstances where excessive stress is applied, the weakest link fails. This 
means the ceramic itself, which may fail short-circuit.

SUMMARY OF PCB BEND TEST RESULTS

The bend tests conducted on X7R have proven that the FlexiCap™
termination withstands a greater level of mechanical stress before
mechanical cracking occurs. The AEC-Q200 test for X7R requires a bend 
level of 2mm minimum and a cap change of less than 10%. Knowles tests to 
a minimum bend of 5mm for X7R with FlexiCap™ termination and for COG 
with either FlexiCap™ or standard termination.

APPLICATION NOTES

FlexiCap™ may be handled, stored and transported in the same manner 
as standard terminated capacitors. The requirements for mounting and 
soldering FlexiCap™ are the same as for standard SMD capacitors. For 
customers currently using standard terminated capacitors, there should 
be no requirement to change the assembly process when converting to 
FlexiCap™. Based upon board bend tests in accordance with IEC 60384-1,
the amount of board bending required to mechanically crack a FlexiCap™ 
terminated capacitor is significantly increased compared with standard 
terminated capacitors. It must be stressed, however, that capacitor users 
must not assume that the use of FlexiCap™ 
terminated capacitors will totally eliminate 
mechanical cracking. Good process controls are 
still required for this objective to be achieved.

●  Picture taken at 1,000x
     magnification using a SEM
     to demonstrate the fibrous
     nature of the FlexiCap™
     termination that absorbs
     increased levels of
     mechanical stress.

AVAILABLE ON THE FOLLOWING:

● All High Reliability Ranges

● Standard and High Voltage Capacitors

● Open Mode and Tandem Capacitors

● Safety Certified Capacitors

● Non-Magnetic Capacitors

● 3-terminal EMI Chips

● X2Y Integrated Passive Components

● X8R High Temperature Capacitors

The benefit to the user is to facilitate a wider process window 

—

giving a greater safety margin and substantially reducing the typical
root causes of mechanical stress cracking. FlexiCap™ may be soldered 
using your traditional wave or reflow solder techniques including, 
lead free, and needs no adjustment to equipment or current processes.

Knowles has delivered millions of FlexiCap™ components, and during 
that time has collected substantial test and reliability data, working in 
partnership with customers worldwide, to eliminate mechanical cracking. 
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature 
cycling -55ºC to +125ºC in excess of 1,000 times without cracking. FlexiCap™ 
termination has no adverse effect on any electrical parameters, nor affects 
the operation of the MLCC in any way.

Fired ceramic

dielectric

Tin outer

layer

Metal

electrodes

FlexiCap™ MLCC cross section

termination

base

Intermediate nickel 

or copper layer

Fired ceramic

dielectric

Tin outer

layer

Metal

electrodes

FlexiCap™ MLCC cross section

termination

base

Intermediate nickel 

or copper layer

Product X7R (2R1)

Typical bend performance under AEC-Q200 test conditions

Standard termination

2mm to 3mm

FlexiCap™

Typically 8mm to 10mm

10

● Non-Magnetic Capacitors

● 3-terminal EMI Chips

● X2Y Integrated Passive Components

● X8R High Temperature Capacitors

Manufacturing Processes

Notes:
1) Space grade tested in accordance with ESCC3009 (refer to Knowles Spec 
S02A 0100) or MIL Grade (in accordance with MIL-PRF-123, MIL-PRF-55681).

2) IECQ-CECC. The International Electrotechnical Commission (IEC) Quality
Assessment System for Electronic Components. This is an internationally
recognized product quality certification that provides customers with
assurance that the product supplied meets high-quality standards. 
View Knowles IECQ-CECC approvals at iecq.org or at knowlescapacitors.com

3) AEC-Q200. Automotive Electronics Council Stress Test Qualification For 
Passive Components. Refer to Knowles application note reference AN0009.

Notes:
1) “Tandem” construction capacitors, i.e., internally having the equivalent 
of 2 series capacitors. If one of these should fail short-circuit, there is 
still capacitance end to end and the chip will still function as a capacitor, 
although capacitance may be affected. Refer to application note AN0021. 
Also available qualified to AEC-Q200.

2) “Open Mode” capacitors with FlexiCap

TM

 termination also reduce the 

possibility of a short-circuit by utilizing inset electrode margins. Refer to 
application note AN0022. Also available qualified to AEC-Q200.

3) Multilayer capacitors with Knowles FlexiCap

TM

 termination. By using

FlexiCap

TM

 termination, there is a reduced possibility of the mechanical

cracking occurring.

4) “Standard” capacitors include MLCCs with tin finish over nickel but no
FlexiCap

TM

.

KNOWLES RELIABILITY GRADES

PRODUCTION PROCESS FLOWCHART

KNOWLES RELIABILITY SURFACE 

MOUNT PRODUCT GROUPS

Standard components

IECQ-CECC

(2)

AEC-Q200

(3)

Space Grade
ESCC 3009

(1)

MIL Grade

Standard MLC capacitors

(4)

Standard FlexiCap

TM

capacitors

(3)

Open Mode

FlexiCap

TM

 capacitors

(2)

Tandem

FlexiCap

TM

capacitors

(1)

Standard reliability

High reliability
(space quality)

Standard reliability

High reliability

Multilayer build

Fire

Rumble

DPA inspection

Electrical test

Termination

Test verification

QC inspection

Packaging

Finished goods store

Additional Hi Rel activities

(S02A 100% burn-in, QC insp)

Additional sample

Rel tests (if specified)

Ceramic powder

preparation

Plating

(if specified)

Printing

(if specified)

Electrode ink

material

11

Testing

TESTS CONDUCTED DURING BATCH MANUFACTURE

Standard SM capacitors

IECQ-CECC/MIL grade

AEC-Q200

S (Space grade)

High Rel S02A ESCC 3009

MIL-PRF-123

Solderability

 

 

 

 

Resistance to soldering heat

 

 

 

 

Plating thickness verification (if plated)

 

 

 

 

Destructive Physical Analysis (DPA)

 

 

 

 

Voltage proof test (DWV/Flash)

 

 

 

 

Insulation resistance

 

 

 

 

Capacitance test

 

 

 

 

Dissipation factor test

 

 

 

 

100% visual inspection

 

 

 

 

100% burn-in (2xRV @125ºC for 168 hours)

 

 

 

 

Load sample test @ 125ºC

 

 

 

LAT1 & LAT2 (1,000-hours)

Humidity sample test @ 85ºC/85% RH

 

 

 

240 hours

Hot IR sample test

 

 

 

 

Axial pull sample test (MIL-STD-123)

 

 

 

 

Breakdown voltage sample test

 

 

 

 

Deflection (bend) sample test

 

 

 

 

Scanning Acoustic Microscop (SAM)

 

 

 

 

LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and LAT3)

 -

- 

- 

 

LAT2 (20 x 1,000-hour life test + LAT3)

 -

 -

 -

 

LAT3 (6 x TC and 4 x solderability)

 -

 -

- 

 

● 

Test conducted as standard.

● 

Optional test. Please discuss with the Sales Office.

KNOWLES RELIABILITY SM PRODUCT GROUP

12

IECQ-CECC and AEC-Q200 

—

 Periodic Tests

PERIODIC TESTS CONDUCTED FOR IECQ-CECC AND AEC-Q200

Test ref

Test

Termination type

Additional requirements

Sample acceptance

Reference

P

N

C

P1

High temperature

exposure (storage)

All types

Unpowered. 1,000 hours @ T=150ºC

Measurement at 24 ± 2 hours after test conclusion

12

77

0

MIL-STD-202

Method 108

P2

Temperature cycling

C0G/NP0: All types

X7R: Y and H only

1,000 cycles -55ºC to +125ºC

Measurement at 24 ± 2 hours after test conclusion

12

77

0

JESD22

Method JA-104

P3

Moisture resistance

All types

T = 24 hours/cycle. Note: Steps 7a and 7b not 

required. Unpowered.

Measurement at 24 ± 2 hours after test conclusion

12

77

0

MIL-STD-202

Method 106

P4

Biased humidity

All types

1,000 hours 85ºC/85% RH. Rated voltage or 50V, 

whichever is the least and 1.5V.

Measurement at 24 ± 2 hours after test conclusion

12

77

0

MIL-STD-202

Method 103

P5

Operational life

All types

Condition D steady state TA=125°C at a load 

test voltage of 1.5xRV for RV<500Vdc, RV for 

RV≥500Vdc.

Safety rated capacitors tested IAW IEC/EN60384-14.

Measurement at 24 ± 2 hours after test conclusion. 

12

77

0

MIL-STD-202

Method 108

P6

Resistance
to solvents

All types

Note: Add aqueous wash chemical

Do not use banned solvents

12

5

0

MIL-STD-202

Method 215

P7

Mechanical shock

C0G/NP0: All types

X7R: Y and H only

Figure 1 of Method 213. Condition F

12

30

0

MIL-STD-202

Method 213

P8

Vibration

C0G/NP0: All types

X7R: Y and H only

5g’s for 20 minutes, 12 cycles each of 3 

orientations. Note: Use 8" x 5" PCB 0.031" 

thick 7 secure points on one long side and 2 

secure points at corners of opposite sides. Parts 

mounted within 2" from any secure point. 

Test from 10-2,000Hz.

12

30

0

MIL-STD-202

Method 204

P9

Resistance to

soldering heat

All types

Condition B, no pre-heat of samples:

Single wave solder 

—

 Procedure 2

3

12

0

MIL-STD-202

Method 210

P10

Thermal shock

C0G/NP0: All types

X7R: Y and H only

-55ºC/+125ºC, 300 cycles

Maximum transfer time 

—

 20 seconds,

dwell time 

—

 15 minutes. Air-Air

12

30

0

MIL-STD-202

Method 107

P11

Adhesion, rapid 

temp change and

climatic sequence

X7R: A, F and

J only

5N force applied for 10s, -55ºC/+125ºC for 5 

cycles, damp heat cycles

12

27

0

BS EN132100

Clause 4.8, 4.12

and 4.13

P12

Board flex

C0G/NP0: All types

X7R: Y and H only

3mm deflection Class I

2mm deflection Class II

12

30

0

AEC-Q200-005

P13

Board flex

X7R: A, F and J only

1mm deflection

12

12

0

BS EN132100

Clause 4.9

P14

Terminal strength

All types

Force of 1.8kg for 60 seconds

12

30

0

AEC-Q200-006

P15

Beam load test

All types

-

12

30

0

AEC-Q200-003

P16

Damp heat 

steady state

All types

56 days, 40ºC/93% RH 15x no volts, 15x 5Vdc,

15x rated voltage or 50V, whichever is the least

12

45

0

BS EN132100

Clause 4.14

Test results are available on request.
P = Period in months.
N = Sample size.
C = Acceptance criteria.

13

High Reliability Testing

Our High Rel products are designed for optimum reliability 

and are burned in at elevated voltage and temperature 

levels. They are 100% electrically inspected to ascertain 

conformance to a strict performance criteria.

Applications for High Reliability products include medical 

implanted devices, aerospace, airborne, various military 

applications and consumer uses requiring safety margins 

not attainable with conventional product.

We have the ability to test surface mount and leaded 

capacitors to High Reliability standards as detailed below, 

or to customer SCD. Military performance specifications 

are designed and written for the voltage/capacitance 

ratings of the individual product slash numbers associated 

with the specification.

Some of the requirements of the military document may 

not apply to the High Reliability product. The following 

details the intent of the individual military specifications 

available for test and the deviations that may apply.

Product voltage ratings outside of the intended military 

specification will follow the voltage test potential outlined.

Contact the Sales Office with any requirements or 

deviations that are not covered here.

We also have the capability to perform all the 

Environmental Group B, Group C and Qualification 

testing to the referenced military specifications.

Testing abilities include the following:

• Nondestructive internal examination
• Destructive physical analysis
• Radiographic inspection
• Terminal strength
• Resistance to soldering heat
• Voltage-temperature limits
• Temperature coefficient
• Moisture resistance
• Humidity, steady state, low voltage
• Vibration
• Resistance to solvents
• Life
• Thermal shock and immersion
• Low temperature storage
• Barometric pressure
• Shock, specified pulse
• Mechanical shock
• Constant acceleration
• Wire bond evaluation
• Partial discharge (corona)
• 200°C Voltage Conditioning

General purpose military high 

reliability specification for surface 

mount sizes 0805 through 2225 in 
50V and 100V.

• VOLTAGE CONDITIONING
• 100 HRS, 2X VDCW, 125°C
• DWV, IR, 125°C IR, CAP, DF TEST
• VISUAL & MECH. INSPECTION
  (AQL SAMPLE PLAN)
• SOLDERABILITY, SAMPLE 13(0)
• 8% PDA MAXIMUM

The specification covers general 

military purpose radial/axial leaded 

and encapsulated products in 50V, 
100V and 200V ratings.

• THERMAL SHOCK, 5 CYCLES
• VOLTAGE CONDITIONING 96 HRS,
  2X VDCW, 125°C
• DWV, IR, 125°C IR, CAP, DF TEST
• VISUAL & MECH. INSPECTION
  (AQL SAMPLE PLAN)
• SOLDERABILITY, SAMPLE 13(0)
• 8% PDA MAXIMUM

General purpose military high reliability 

specification for stacked and leaded 

capacitors for switch mode power 

supplies. The specification covers sizes 

2225 through 120200 in 50V, 100V, 
200V and 500V ratings.

• THERMAL SHOCK, 5 CYCLES
• VOLTAGE CONDITIONING 96 HRS,
  2X VDCW

(4)

, 125°C

• DWV, IR, 125°C IR, CAP, DF TEST
• VISUAL & MECH. INSPECTION SAMPLE 13(0)
• SOLDERABILITY, SAMPLE 5(0)
• 10% PDA MAXIMUM

The specification affords an increased 

reliability level over MIL-PRF-55681 

for space, missile and other high 

reliability applications such as medical 

implantable or life support equipment. 

The specification covers surface mount 

sizes 0805 through 2225 in 50V rating 

and various radial/axial leaded products in 
50V, 100V and 200V ratings.

• THERMAL SHOCK, 20 CYCLES
• VOLTAGE CONDITIONING 168/264   
  HRS, 2X VDCW, 125°C
• DWV, IR, 125°C IR, CAP, DF TEST
• VISUAL & MECH. INSPECTION SAMPLE 20(0)
• DPA

(1)

• PDA, 3% (0.1%), 5% (0.2%) MAX

(2)

General purpose military high reliability 

specification for radial leaded epoxy 

coated products. The specification 

covers sizes 1515 through 13060 with 
600V, 1kV, 2kV, 3kV, 4kV and 5kV ratings.

• THERMAL SHOCK, 5 CYCLES
• VOLTAGE CONDITIONING 96 HRS,
  RATED VDCW, 125°C
• PARTIAL DISCHARGE (OPTION)

(3)

• DWV, IR, 125°C IR, CAP, DF TEST
• VISUAL & MECH. INSPECTION SAMPLE 13(0)
• SOLDERABILITY, SAMPLE 5(0)
• 10% PDA MAXIMUM

Specification for Hybrid Microcircuits 

with a section for Element Evaluation 

on passive components. There are two 

classification levels of reliability. Class 

H is for a standard military quality level. 

Class K is for the highest reliability level 

intended for space application. Knowles 

will perform a 100-hour burn-in on all 

Class K products and assumes Class K 

Subgroup 3 samples will be unmounted 

and Subgroup 4 (wirebond) shall not 

apply unless otherwise stated.

TEST VOLTAGE (VDC)

This test potential shall be used on all High 

Reliability Testing unless otherwise specified.

WVDC

<200

250

300

400

500

600

>700

DWV

2.5X Rated

500V

500V

600V

750V

750V

1.2X Rated

V/C*

2.0X Rated

400V

400V

500V

600V

600V

1.0X Rated

ENVIRONMENTAL TESTING

MIL-PRF-55681 (GROUP A)

MILITARY PERFORMANCE SPECIFICATIONS

MIL-PRF-39014 (GROUP A)

MIL-PRF-49470 (DSCC 87106) 

(GROUP A)

MIL-PRF-123 (GROUP A)

MIL-PRF-49467 (GROUP A)

MIL-PRF-38534 (GROUP A)

*V/C Is Voltage Conditioning.

Notes:

1.  MIL-PRF-123 DPA shall be per TABLE XIV AQL requirements unless otherwisespecified.

2. MIL-PRF-123 allowable PDA shall be 3% overall and 0.1% in the last 48 hours forcapacitance/voltage  

    values listed in MIL-PRF-123, and be 5% overall and 0.2% in the last 48 hours for capacitance/voltage 

    values beyond MIL-PRF-123.

3. MIL-PRF-49467 standard Group A is without Partial Discharge. Partial Dicharge test is optional and 

    must be specified.

4. MIL-PRF-49470 (DSCC 87106) 500V rated product has Voltage Conditioning at 1.2X VDCW.

14

Regulations and Compliance

RELEASE DOCUMENTATION

Knowles reliability SM product group

 Standard SM capacitors IECQ-CECC   AEC-Q200 MIL grade  S (Space grade) High Rel S02A

Certificate of conformance

 

 -

 

 

IECQ-CECC Release certificate of conformity

- 

 

 -

- 

Batch electrical test report

 

 

 

Included in data pack 

S (space grade) data documentation package

- 

 -

 -

 

PERIODIC TESTS CONDUCTED AND 

RELIABILITY DATA AVAILABILITY

Components are randomly selected on a sample basis and the
following routine tests are conducted:
• Load Test. 1,000 hours @125ºC (150ºC for X8R). Applied voltage depends  

  on components tested.
• Humidity Test. 168 hours @ 85ºC/85% RH.
• Board Deflection (bend test).
Test results are available on request.

From

To

Operation

FITS

MTBF (hours)

10⁹ ÷ FITS

FITS

MTBF (years)

10⁹ ÷ (FITS x 8760)

● 

Release documentation supplied as standard.

● 

Original documentation.

Component type: 0805 (C0G/NP0 and X7R).
Testing location: Knowles reliability test department.
Results based on: 16,622,000 component test hours.

FITS = Failures in 10⁹ hours.
MTBF = Mean time between failures.

STANDARD SURFACE MOUNT CAPACITORS

CONVERSION FACTORS

EXAMPLE OF FIT (FAILURE IN TIME) 
DATA AVAILABLE:

REGISTRATION, EVALUATION, 

AUTHORIZATION AND RESTRICTION OF 

CHEMICALS (REACH)

The main purpose of REACH is to improve the protection of human health and the 
environment from the risks arising from the use of chemicals. Knowles maintains 
both ISO14001 Environmental Management System and OHSAS 18001 Health and 
Safety Management System approvals that require and ensure compliance with 
corresponding legislation such as REACH. For further information, please contact 
the Knowles Precision Devices Sales Office at knowlescapacitors.com

EXPORT CONTROLS AND DUAL-USE 

REGULATIONS

Certain Knowles catalog components are defined as "dual-use" items under 
international export controls 

—

 those that can be used for civil or military purposes 

which meet certain specified technical standards. The defining criteria for a dual-use 
component with respect to Knowles Capacitor products is one with a voltage rating 
of >750Vdc and a capacitance value of >250nF when measured at 750Vdc and a 
series inductance <10nH. Components defined as dual-use under the above criteria 
may require a licence for export across international borders. Please contact the 
Sales Office for further information on specific part numbers.

ROHS COMPLIANCE

Knowles routinely monitors worldwide material restrictions (e.g., EU/China and 
Korea RoHS mandates) and is actively involved in shaping future legislation. All 
standard C0G/NP0, X7R, X5R and High Q Knowles MLCC products are compliant 
with the EU RoHS directive (see below for special exceptions) and those with plated 
terminations are suitable for soldering using common lead-free solder alloys (refer 
to "Soldering Information" for more details on soldering limitations). Compliance 
with the EU RoHS directive automatically signifies compliance with some other 
legislation (e.g., China and Korea RoHS). Please refer to the Knowles Precision 
Devices Sales Office for details of compliance with other materials legislation. 

Breakdown of material content, SGS analysis reports and tin whisker test results 
are available on request. Most Knowles MLCC components are available with 
non-RoHS compliant tin lead (SnPb) solderable termination finish for exempt 
applications and where pure tin is not acceptable. Other tin-free termination 
finishes may also be available – please refer to the Knowles Precision Devices 
Sales Office for further details. Radial components have tin plated leads as 
standard, but tin/lead is available as a special option. Please refer to the radial 
section of the catalog for further details.

X8R ranges <250Vdc are not RoHS 2011/65/EU compliant. Check
the website, knowlescapacitors.com for latest RoHS update.

25ºC

50ºC

75ºC

100ºC

125ºC

10000

0.01

10

0.00001

FIT

50% of RV

RV

25% of RV

10% of RV

●

●

●

●

●

●

●

●

15

Explanation of Aging of MLC

AGING

Capacitor aging is a term used to describe the negative, logarithmic 
capacitance change that takes place in ceramic capacitors with time. 
The crystalline structure for barium titanate based ceramics changes 
on passing through its Curie temperature (known as the Curie Point) 
at about 125°C. This domain structure relaxes with time and in doing 
so, the dielectric constant reduces logarithmically; this is known as 
the aging mechanism of the dielectric constant. The more stable 
dielectrics have the lowest aging rates.

The aging process is reversible and repeatable. Whenever the 
capacitor is heated to a temperature above the Curie Point, the aging 
process starts again from zero.

The aging constant, or aging rate, is defined as the percentage loss 
of capacitance due to the aging process of the dielectric that occurs 
during a decade of time (a tenfold increase in age) and is expressed 
as percent per logarithmic decade of hours. As the law of decrease of 
capacitance is logarithmic, this means that in a capacitor with an aging 
rate of 1% per decade of time, the capacitance will decrease at a rate of:

a) 1% between 1 and 10 hours
b) An additional 1% between the following 10 and 100 hours
c) An additional 1% between the following 100 and 1,000 hours
d) An additional 1% between the following 1,000 and 10,000 hours, etc.
e) The aging rate continues in this manner throughout the capacitor’s life

CAPACITANCE MEASUREMENTS

Because of aging it is necessary to specify an age for reference
measurements at which the capacitance shall be within the prescribed 
tolerance. This is fixed at 1,000 hours, since for practical purposes there 
is not much further loss of capacitance after this time.

All capacitors shipped are within their specified tolerance at the
standard reference age of 1,000 hours after having cooled through
their Curie temperature.

The aging curve for any ceramic dielectric is a straight line when
plotted on semi-log paper. 

CAPACITANCE VS. TIME

(Aging X7R @ <2% per decade)

TIGHT TOLERANCE

One of the advantages of Knowles’ unique "wet process" of
manufacture is the ability to offer capacitors with exceptionally tight
capacitance tolerances.

The accuracy of the printing screens used in the fully automated,
computer controlled manufacturing process allows for tolerance 
as close as +/-1% on C0G/NP0 parts greater than or equal to 10pF.
For capacitance values below <4.7pF, tolerances can be as tight 
as +/-0.05pF.

Dielectric class

Typical values

Ultra Stable C0G/NP0

Negligible capacitance loss through aging

Stable X7R

<2% per decade of time

Typical values of the aging constant for our Multilayer Ceramic
Capacitors are:

∆

c %

Age (Hours)

1

10

100

10,000

1,000

C0G/NP0 (1B)

X7R (2R1)

16

Mounting, Soldering, Storage and Mechanical Precautions

Detailed application notes intended to guide and assist our customers 
in using multilayer ceramic capacitors in surface mount technology 
are available on the Knowles website at knowlescapacitors.com
The information concentrates on the handling, mounting, connection, 
cleaning, test and rework requirements particular to MLCs for SMD 
technology, to ensure a suitable match between component capability 
and user expectation. Some extracts are given below.

MECHANICAL CONSIDERATIONS FOR MOUNTED 
CERAMIC CHIP CAPACITORS

Due to their brittle nature, ceramic chip capacitors are more prone
to excesses of mechanical stress than other components used in
surface mounting. One of the most common causes of failure is 
directly attributable to bending the printed circuit board after solder 
attachment. The excessive or sudden movement of the flexible 
circuit board stresses the inflexible ceramic block, causing a crack 
to appear at the weakest point, usually the ceramic/termination 
interface. The crack may initially be quite small and not penetrate 
into the inner electrodes; however, subsequent handling and rapid 
changes in temperature may cause the crack to enlarge.

This mode of failure is often invisible to normal inspection
techniques as the resultant cracks usually lie under the capacitor
terminations, but if left, can lead to catastrophic failure. More
importantly, mechanical cracks, unless they are severe, may not be
detected by normal electrical testing of the completed circuit, failure
only occurring at some later stage after moisture ingression.

The degree of mechanical stress generated on the printed circuit
board is dependent upon several factors, including the board
material and thickness, the amount of solder and land pattern. The 
amount of solder applied is important, as an excessive amount
reduces the chip’s resistance to cracking.

It is Knowles’ experience that more than 90% are due to board
depanelization, a process where two or more circuit boards are
separated after soldering is complete. Other manufacturing stages
that should be reviewed include:

1) Attaching rigid components such as connectors, relays, display panels, 
    heat sinks etc.,
2) Fitting conventional leaded components. Special care must be exercised 
     when rigid terminals, as found on large can electrolytic capacitors, are inserted.
3) Storage of boards in such a manner that allows warping.
4) Automatic test equipment, particularly the type employing “bed of nails” 
    and support pillars.
5) Positioning the circuit board in its enclosure, especially where this is a “snap-fit.”

Knowles was the first MLCC manufacturer to launch a flexible
termination to significantly reduce the instances of mechanical
cracking. FlexiCap™ termination introduces a certain amount of give
into the termination layer, absorbing damaging stress. Unlike similar
systems, FlexiCap™ does not tear under tension, but absorbs the
stress, so maintaining the characteristics of the MLCC.

ALTERNATIVE PRINTED WIRE BOARD LAND PATTERNS

Printed Wire Board land pattern design for chip components is
critical to ensure a reliable solder fillet, and to reduce nuisance
type manufacturing problems such as component swimming and
tombstoning. The land pattern suggested can be used for reflow
and wave solder operations as noted. Land patterns constructed
with these dimensions will yield optimized solder fillet formation 
and thus reduce the possibility of early failure.

1

SM PAD DESIGN

Knowles conventional 2-terminal chip capacitors can generally
be mounted using pad designs in accordance with IPC-7351,
Generic Requirements for Surface Mount Design and Land Pattern
Standards, but there are some other factors that have been shown
to reduce mechanical stress, such as reducing the pad width to 
less than the chip width. In addition, the position of the chip on the
board should also be considered.
3-Terminal components are not specifically covered by IPC-7351,
but recommended pad dimensions are included in the Knowles
catalogue / website for these components.

MLC ORIENTATION 

—

 HORIZONTAL AND VERTICAL MOUNTING

The orientation of the MLC relative to the ground plane affects the
device’s impedance. When the internal electrodes are parallel to
the ground plane (horizontal mounting), the impedance of the MLC
resembles a folded transmission line driven from one end.

The graphs below show the modeled insertion loss and parallel
resonances of Knowles product C17AH101K-7UN-X0T with
horizontal mounting (modeling can be done in CapCad). When the
internal electrodes are perpendicular to the ground plane (vertical
mounting, bottom graph), the MLC impedance resembles a folded
transmission line driven from the center, reducing resonance effects.

A = (Max Length) + 0.030" (.762mm)*
B = (Max Width) + 0.010" (.254mm)**
C = (Min Length) – 2 (Nominal Band)***

For C04 "C" to be no less than 0.01".

* Add 0.030

"

 for Wave Solder operations.

** Replace "Max Width" with "Max Thickness" for vertical mounting.
*** "C" to be no less than 0.02

"

, change "A" to (Max Length) + 0.020

"

.

Horizontal Orientation

C17AH101K-7UN-X0T 100.0pF Temp = 25°C

Frequency (GHz)

S21 (dB)

0

-1

-2

-3

-4

-5

-6

0

1

2

3

4

5

6

7

8

9

10

Vertical Orientation

C17AH101K-7UN-X0T 100.0pF Temp = 25°C

Frequency (GHz)

S21 (dB)

0

-1

-2

-3

-4

-5

-6

0

1

2

3

4

5

6

7

8

9

10

1. 

Frances Classon, James Root, Martin Marietta Orlando Aerospace, “Electronics 

Packaging and Interconnection Handbook”.

17

Mounting, Soldering, Storage and Mechanical Precautions

Knowles MLCCs are compatible with all recognized soldering/

mounting methods for chip capacitors. Specific application notes on 

mounting and soldering Knowles components are included on the 

website for each brand.

• For DLI brand components, please see DLI application note  

   “Recommended Solder Attachment Techniques for MLC Chip and 

   Pre-Tinned Capacitors” located at: 

knowlescapacitors.com

• For Syfer brand components, please see Syfer application note  

  AN0028 “Soldering/Mounting Chip Capacitors, Radial Leaded   

  Capacitors and EMI Filters” located at: 

knowlescapacitors.com

• For Novacap brand products, please refer to the appropriate

   application note located at: 

knowlescapacitors.com

The volume of solder applied to the chip capacitor can influence

the reliability of the device. Excessive solder can create thermal

and tensile stresses on the component, which can lead to fracturing

of the chip or the solder joint itself. Insufficient or uneven solder

application can result in weak bonds, rotation of the device off line

or lifting of one terminal off the pad (tombstoning). The volume of

solder is process and board pad size dependent. Soldering methods 

commonly used in industry are Reflow Soldering, Wave Soldering and, 

to a lesser extent, Vapor Phase Soldering. All these methods involve 

thermal cycling of the components and therefore the rate of heating and 

cooling must be controlled to preclude thermal shocking of the devices.

Without mechanical restriction, thermally induced stresses are released 

once the capacitor attains a steady state condition. Capacitors bonded 

to substrates, however, will retain some stress, due primarily to the 

mismatch of expansion of the component to the substrate; the residual 

stress on the chip is also influenced by the ductility and hence the 

ability of the bonding medium to relieve the stress. Unfortunately, the 

thermal expansion of chip capacitors differs significantly from those of 

most substrate materials. Large chips are more prone to thermal shock 

as their greater bulk will result in sharper thermal gradients within the 

device during thermal cycling. Large units experience excessive stress 

if processed through the fast cycles typical of solder wave or vapor 

phase operations.

WAVE SOLDERING SURFACE MOUNT CHIP CAPACITORS

Wave soldering is generally acceptable, but the thermal stresses caused by
the wave have been shown to lead to potential problems with larger or thicker 
chips. Particular care should be taken when soldering SM chips larger than 
size 1210 and with a thickness greater than 1.0mm for this reason. 0402 size 
components are not suitable for wave soldering. 0402 size components can also 
be susceptible to termination leaching, and reflow soldering is recommended for 
this size MLCC.

Wave soldering exposes the devices to a large solder volume, hence the 
pad size area must be restricted to accept an amount of solder that is not 
detrimental to the chip size utilized. Typically the pad width is 66% of the 
component width, and the length is .030" (.760mm) longer than the termination 
band on the chip. A 0805 chip, which is .050" wide and has a .020" termination 
band therefore requires a pad .033" wide by .050" in length. Opposing pads 
should be identical in size to preclude uneven solder fillets and mismatched 
surface tension forces, which can misalign the device. It is preferred that the 
pad layout results in alignment of the long axis of the chips at right angles 
to the solder wave, to promote even wetting of all terminals. Orientation of 
components in line with the board travel direction may require dual waves with 
solder turbulence to preclude cold solder joints on the trailing terminals of the 
devices, as these are blocked from full exposure to the solder by the body of 
the capacitor.

The preheat ramp should be such that the components see a temperature 
rise of 1.5ºC to 4ºC per second as for reflow soldering. This is to maintain 
temperature uniformity through the MLCC and prevent the formation of thermal 
gradients within the ceramic. The preheat temperature should be within 120ºC 
maximum (100ºC preferred) of the maximum solder temperature to minimize 
thermal shock. Maximum permissible wave temperature is 270ºC for SM 
chips. Total immersion exposure time for Sn/Ni terminations is 30s at a wave 
temperature of 260ºC. Note that for multiple soldering operations, including 
the rework, the soldering time is cumulative. The total immersion time in the 
solder should be kept to a minimum. It is strongly recommended that plated 
terminations are specified for wave soldering applications. PdAg termination is 
particularly susceptible to leaching when subjected to lead-free wave soldering 
and is not generally recommended for this application. Cooling to ambient 
temperature should be allowed to occur naturally, particularly if larger chip 
sizes are being soldered. Natural cooling allows a gradual relaxation of thermal 
mismatch stresses in the solder joints. Forced cooling should be avoided as 
this can induce thermal breakage.

VAPOR PHASE SOLDERING CHIP CAPACITORS

Vapor phase soldering can expose capacitors to similar thermal shock and stresses 
as wave soldering, and the advice is generally the same. Particular care should 
be taken in soldering large capacitors to avoid thermal cracks being induced and 
natural cooling should be use to allow a gradual relaxation of stresses.

REFLOW SOLDERING SURFACE MOUNT CHIP CAPACITORS

Knowles recommends reflow soldering as the preferred method for mounting 
MLCCs. Knowles MLCCs can be reflow soldered using a reflow profile generally 
as defined in IPC/JEDEC J-STD-020. Sn plated termination chip capacitors are 
compatible with both conventional and lead-free soldering, with peak temperatures 
of 260ºC to 270ºC acceptable. The heating ramp rate should be such that 
components see a temperature rise of 1.5ºC to 4ºC per seconds to maintain 
temperature uniformity through the MLCC. The time for which the solder is molten 
should be maintained at a minimum, so as to prevent solder leaching. Extended 
times above 230ºC can cause problems with oxidation of Sn plating. Use of inert 
atmosphere can help if this problem is encountered. PdAg terminations can be 
particularly susceptible to leaching with lead-free, tin-rich solders and trials are 
recommended for this combination. Cooling to ambient temperature should be 
allowed to occur naturally, particularly if larger chip sizes are being soldered. Natural 
cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. 
Forced cooling should be avoided as this can induce thermal breakage.

HAND SOLDERING AND REWORK OF CHIP CAPACITORS

Attachment using a soldering iron requires extra care and is accepted to have a risk 
of cracking of the chip. Precautions include preheating of the assembly to within 
100°C of the solder flow temperature and the use of a fine tip iron that does not 
exceed 30 watts. In no circumstances should the tip of the iron be allowed to
contact the chip directly. Knowles recommends hot air/gas as the preferred method 
for applying heat for rework. Apply even heat surrounding the component to 
minimize internal thermal gradients. Minimize the rework heat duration and allow 
components to cool naturally after soldering.

18

Mounting, Soldering, Storage and Mechanical Precautions

WAVE SOLDERING RADIAL LEADED CHIP CAPACITORS

Radial leaded capacitors are suitable for wave soldering when mounted 
on the opposite side of the board to the wave. The body of radial 
components should not be exposed directly to the wave. Maximum 
permissible wave temperature is 260ºC for Radial leaded capacitors.

HANDLING

Ceramics are dense, hard, brittle and abrasive materials. They 
are liable to suffer mechanical damage, in the form of chips or 
cracks, if improperly handled.
Terminations may be abraded onto chip surfaces if loose chips are
tumbled in bulk. Metallic tracks may be left on the chip surfaces,
which might pose a reliability hazard.
Components should never be handled with fingers; perspiration and
skin oils can inhibit solderability and will aggravate cleaning.
Chip capacitors should never be handled with metallic instruments.
Metal tweezers should never be used as these can chip the product
and may leave abraded metal tracks on the product surface.
Plastic or plastic coated metal types are readily available and
recommended 

—

 these should be used with an absolute minimum 

of applied pressure.
Counting or visual inspection of chip capacitors is best performed
on a clean glass or hard plastic surface. If chips are dropped or 
subjected to rough handling, they should be visually inspected 
before use. Electrical inspection may also reveal gross damage 
via a change in capacitance, an increase in dissipation factor or a 
decrease either in insulation resistance or electrical strength.

HAND SOLDERING RADIAL LEADED CAPACITORS

Radial capacitors can be hand soldered into boards using soldering
irons, provided care is taken not to touch the body of the capacitor
with the iron tip. Soldering should be carried out from the opposite
side of the board to the radial to minimize the risk of damage to
the capacitor body. Where possible, a heat sink should be used
between the solder joint and the body, especially if longer dwell
times are required.

TRANSPORTATION

Where possible, any transportation should be carried out with the
product in its unopened original packaging. If already opened,
any environmental control agents supplied should be returned to
packaging and the packaging resealed.
Avoid paper and card as a primary means of handling, packing,
transportation and storage of loose components. Many grades
have a sulphur content that will adversely affect termination
solderability. Loose chips should always be packed with sulphur-free 
wadding to prevent impact or abrasion damage during transportation.

SOLDER LEACHING

Leaching is the term for the dissolution of silver into the solder,
causing a failure of the termination system, which causes increased
ESR, tan δ and open circuit faults, including, ultimately, the
possibility of the chip becoming detached. Leaching occurs more
readily with higher temperature solders and solders with a high
tin content. Pb-free solders can be very prone to leaching certain
termination systems. To prevent leaching, exercise care when
choosing solder alloys and minimize both maximum temperature
and dwell time with the solder molten.

Plated terminations with nickel or copper anti-leaching barrier layers
are available in a range of top coat finishes to prevent leaching from 
occurring. These finishes also include Syfer FlexiCap™ for improved
stress resistance post soldering.

STORAGE

Incorrect storage of components can lead to problems for the
user. Rapid tarnishing of the terminations, with an associated
degradation of solderability, will occur if the product comes into
contact with industrial gases such as sulphur dioxide and chlorine.
Storage in free air, particularly moist or polluted air, can result in
termination oxidation.
Packaging should not be opened until the MLCs are required
for use. If opened, the pack should be resealed as soon as is
practicable. Alternatively, the contents could be kept in a sealed
container with an environmental control agent. Long-term storage 
conditions, ideally, should be temperature controlled between -5ºC 
and +40°C and humidity controlled between 40% and 60% RH.
Taped product should be stored out of direct sunlight, which might
promote deterioration in tape or adhesive performance.
Product, stored under the conditions recommended above, in its “as
received” packaging has a minimum shelf life of 2 years.

BONDING

Hybrid assembly using conductive epoxy or wire bonding requires
the use of silver palladium or gold terminations. Nickel barrier
termination is not practical in these applications, as intermetallics
will form between the dissimilar metals. The ESR will increase
over time and may eventually break contact when exposed to
temperature cycling.

CLEANING

Chip capacitors can withstand common agents such as water,
alcohol and degreaser solvents used for cleaning boards. Ascertain
that no flux residues are left on the chip surfaces as these diminish
electrical performance.

19

Chip Marking System

Most, but not all, MLCCs can be supplied marked to indicate the capacitance 
value on request. Parts smaller than 1812 will generally use laser marking, chips 
sizes larger will use laser or ink marking at the Knowles' discretion. Neither 
system causes surface degradation and the ink is chosen to withstand most 
conventional MLCC cleaning processes.  Some values of size/voltage may not 
be suitable for marking due to internal design parameters. 

Capacitance is shown using one of the following methods, depending on 
the size of the component:

•  2 digit EIA-198 code (see table below, e.g., N1 = 33pF). Where space 
    allows, the brand identifier may also be applied (e.g., N = Novacap brand).
•  3-digit capacitance code as part number (e.g., 0330 = 33pF)
•  Brand identifier, 3-digit capacitance code and tolerance 
    (e.g., S/0330J = Syfer Brand, 33pF ± 5%)

Two position alpha-numeric marking 
is available on chip sizes 0603 and 
larger. The marking denotes retma 
value and significant figures of 
capacitance (see table) 
e.g., A5 = 100,000pF.

Three position alpha-numeric
marking is available on chip sizes
1206 and larger. 

Number

0

1

2

3

4

5

6

7

9

A

1.0

10

100

1,000

10,000

100,000

1,000,000

10,000,000

0.10

B

1.1

11

110

1,100

11,000

110,000

1,100,000

11,000,000

0.11

C

1.2

12

120

1,200

12,000

120,000

1,200,000

12,000,000

0.12

D

1.3

13

130

1,300

13,000

130,000

1,300,000

13,000,000

0.13

E

1.5

15

150

1,500

15,000

150,000

1,500,000

15,000,000

0.15

F

1.6

16

160

1,600

16,000

160,000

1,600,000

16,000,000

0.16

G

1.8

18

180

1,800

18,000

180,000

1,800,000

18,000,000

0.18

H

2.0

20

200

2,000

20,000

200,000

2,000,000

20,000,000

0.20

J

2.2

22

220

2,200

22,000

220,000

2,2000,000

22,000,000

0.22

K

2.4

24

240

2,400

24,000

240,000

2,4000,000

24,000,000

0.24

L

2.7

27

270

2,700

27,000

270,000

2,7000,000

27,000,000

0.27

M

3.0

30

300

3,000

30,000

300,000

3,000,000

30,000,000

0.30

N

3.3

33

330

3,300

33,000

330,000

3,000,000

33,000,000

0.33

P

3.6

36

360

3,600

36,000

360,000

3,600,000

36,000,000

0.36

Q

3.9

39

390

3,900

39,000

390,000

3,900,000

39,000,000

0.39

R

4.3

43

430

4,300

43,000

430,000

4,300,000

43,000,000

0.43

S

4.7

47

470

4,700

47,000

470,000

4,700,000

47,000,000

0.47

T

5.1

51

510

5,100

51,000

510,000

5,100,000

51,000,000

0.51

U

5.6

56

560

5,600

56,000

560,000

5,600,000

56,000,000

0.56

V

6.2

62

620

6,200

62,000

620,000

6,200,000

62,000,000

0.62

W

6.8

68

680

6,800

68,000

680,000

6,800,000

68,000,000

0.68

X

7.5

75

750

7,500

75,000

750,000

7,500,000

75,000,000

0.75

Y

8.2

82

820

8,200

82,000

820,000

8,200,000

82,000,000

0.82

Z

9.1

91

910

9,100

91,000

920,000

9,200,000

92,000,000

0.91

a

2.5

25

250

2,500

25,000

250,000

2,500,000

25,000,000

0.25

b

3.5

35

350

3,500

35,000

350,000

3,500,000

35,000,000

0.35

d

4.0

40

400

4,000

40,000

400,000

4,000,000

40,000,000

0.40

e

4.5

45

450

4,500

45,000

450,000

4,500,000

45,000,000

0.45

f

5.0

50

500

5,000

50,000

500,000

5,000,000

50,000,000

0.50

m

6.0

60

600

6,000

60,000

600,000

6,000,000

60,000,000

0.60

n

7.0

70

700

7,000

70,000

700,000

7,000,000

70,000,000

0.70

t

8.0

80

800

8,000

80,000

800,000

8,000,000

80,000,000

0.80

y

9.0

90

900

9,000

90,000

900,000

9,000,000

90,000,000

0.90

Letter

MARKING CODE — VALUE IN PICOFARADS FOR ALPHA-NUMERIC CODE

A5

NA5

20

Ceramic Chip Capacitors 

—

 Packaging Information

PEEL FORCE

The peel force of the top sealing tape is between 0.2 and 1.0
Newton at 180°. The breaking force of the carrier and sealing tape
in the direction of unreeling is greater than 10 Newtons.

IDENTIFICATION

Each reel is labeled with the following information: manufacturer,
chip size, capacitance, tolerance, rated voltage, dielectric type,
batch number, date code and quantity of components.

MISSING COMPONENTS

Maximum number of missing components shall be 1 per reel
or 0.025%, whichever is greater. There shall not be consecutive
components missing from any reel for any reason.

1

2

Dimensions mm (inches)

Symbol

Description

8mm tape

12mm tape

A0

B0

K0

Width of cavity

Length of cavity

Depth of cavity

Dependent on chip size to minimize 

rotation

W

Width of tape

8.0 (0.315)

12.0 (0.472)

F

Distance between drive hole 
centers and cavity centers

3.5 (0.138)

5.5 (0.213)

E

Distance between drive hole 
centers and tape edge

1.75 (0.069)

P1

Distance between cavity centers

4.0 (0.156)

8.0 (0.315)

P2

Axial distance between drive 
hole centers and cavity centers

2.0 (0.079)

P0

Axial distance between drive hole 
centers

4.0 (0.156)

D0

Drive hole diameter

1.5 (0.059)

D1

Diameter of cavity piercing

1.0 (0.039)

1.5 (0.059)

T

Carrier tape thickness

0.3 (0.012) ±0.1 (0.004) 0.4 (0.016) ±0.1 (0.004)

t1

Top tape thickness

0.1 (0.004) max

Symbol

Description

178mm reel

330mm reel

A

Diameter

178 (7)

330 (13)

G

Inside width

8.4 (0.33)

12.4 (0.49)

T

Outside width

14.4 (0.56) max

18.4 (0.72) max

LEADER AND TRAILER

TAPE DIMENSIONS

Tape and reel packing of surface mounting chip capacitors for automatic placement are in accordance with IEC60286-3.

Dimensions 
mm (inches)

21

Ceramic Chip Capacitors 

—

 Packaging Information

COMPONENT ORIENTATION

Tape and reeling is in accordance with IEC 60286 part 3, which
defines the packaging specifications of leadless components on
continuous tapes.

BULK PACKAGING, TUBS

Chips can be supplied in rigid resealable plastic 
tubs together with impact cushioning wadding. Tubs 
are labeled with the details: chip size, capacitance, 
tolerance, rated voltage, dielectric type, batch
number, date code and quantity of components.

PACKAGING CONFIGURATIONS 

—

 DLI PRODUCTS

Chip 

size

0402

0505

0603

0805

1111

1206

1210

1410

1515

1808

1812

1825

2211

2215

2220

2221

2225

2520

3333

3530

3640

4540

5550

6560

7565

Max. chip thickness 

mm

 0.61

1.3

0.89

1.37

1.8

1.63

2.0

2.0

3.3

2.0

3.2

4.2

2.5

2.5

4.2

2.0

4.2

4.57

6.35

6.35

4.2

7.62

7.62

7.62

7.62

inches  0.02"

0.05"

0.03"

0.05"

0.07"

0.06"

0.08"

0.08"

0.13"

0.08"

0.13"

0.165"

0.1"

0.1"

0.165" 0.08"

0.165"

0.18"

0.25"

0.25"

0.165"

0.3"

0.3"

0.3"

0.3"

Reel quantities

178mm 
(7”)

10k 

2500  4000

3000

1000

2500

2000

2000

500

1500

500

500

750

500

500

1000

500

1000

-

-

-

-

-

-

330mm 
(13”) 

15k 

 10k

16k 

12k 

5000

10k 

8000

8000

-

6000

2000

2000

2000 2000 2000

-

2000

1000

1000

500

500

500

500

500

200

Chip Size

7" Reel, 8mm Tape

7" Reel,

16mm Tape

13" Reel,

16mm Tape

2" x 2"

Waffle

Pack

Style

L x W

Horizontal 

Orientation

Vertical 

Orientation

C04

0.040" x0.020"

4000

-

-

-

-

C06

0.060" x 0.030"

4000

-

-

-

108

C07

0.110” x 0.070”

2000

-

-

-

-

C08

0.080" x 0.050"

5000

3100

-

-

108

C11

0.055" x 0.055"

3500

3100

-

-

108

C17

0.110" x 0.110"

2350

750

-

-

49

C18

0.110" x 0.110"

2350

750

-

-

49

C22

0.220" x 0.245"

500

-

-

-

-

C40

0.380" x 0.380"

250

-

250

1300

-

STANDARD REEL QUANTITIES — NOVACAP, SYFER AND VOLTRONICS PRODUCTS

OUTER PACKAGING

Reel Size

No. of reels

L

W

T

178 (7.0)

1

185 (7.28)

185 (7.28)

25 (0.98)

178 (7.0)

4

190 (7.48)

195 (7.76)

75 (2.95)

330 (13.0)

1

335 (13.19)

335 (13.19)

25 (0.98)

OUTER CARTON DIMENSIONS MM (INCHES) MAX.

Notes: 
1) IEC60286-3 states Ao ≤ Bo 
   (see tape dimensions on page 21).
2) Regarding the orientation of 1825 and 2225 components, the  
    termination bands are right to left, NOT front to back. Please 
    see diagram.

H

60 (2.36)

D

50 (1.97)

DIMENSIONS MM (INCHES)

Note: Labeling of box and 
reel with bar codes (Code 39) 
available by arrangement.

22

Note: Chip thickness may affect reel quantity.

Chip 

size

0402

0505

0603

0805

1111

1206

1210

1410

1515

1808

1812

1825

2211

2215

2220

2221

2225

2520

3333

3530

3640

4540

5550

6560

7565

Max. chip thickness 

mm

 0.61

1.3

0.89

1.37

1.8

1.63

2.0

2.0

3.3

2.0

3.2

4.2

2.5

2.5

4.2

2.0

4.2

4.57

6.35

6.35

4.2

7.62

7.62

7.62

7.62

inches  0.02"

0.05"

0.03"

0.05"

0.07"

0.06"

0.08"

0.08"

0.13"

0.08"

0.13"

0.165"

0.1"

0.1"

0.165" 0.08"

0.165"

0.18"

0.25"

0.25"

0.165"

0.3"

0.3"

0.3"

0.3"

Reel quantities

178mm 
(7”)

10k 

2500  4000

3000

1000

2500

2000

2000

500

1500

500

500

750

500

500

1000

500

1000

-

-

-

-

-

-

330mm 
(13”) 

15k 

 10k

16k 

12k 

5000

10k 

8000

8000

-

6000

2000

2000

2000 2000 2000

-

2000

1000

1000

500

500

500

500

500

200

OUTER PACKAGING

Chip Dimensions

1.  For FlexiCap™ terminations, length increases by maximum 0.004" (0.1mm).

2. Dimensions for High Q, Ultra-low ESR and Non-magnetic parts may vary for optimum performance. 

    For accurate part dimensions, use the Part Builder or Part Search application on the Knowles website 

    to generate a component datasheet.

3. Non-standard thicknesses are available – consult your local Knowles Precision Devices sales office.

Size

Length (L1)

Width (W)

Max. Thickness (T)

Termination Band (L2)

mm ~ inches

mm ~ inches

mm ~ inches

min (mm ~ inches)

max (mm ~ inches)

0402

1.0 ± 0.10 ~ 0.04 ± 0.004

0.50 ± 0.10 ~ 0.02 ± 0.004

0.60 ~ 0.024

0.10 ~ 0.004

0.40 ~ 0.016

C04

1.057 ± 0.188 ~ 0.042 ± 0.008

0.515 ± 0.153 ~ 0.02 ± 0.006

0.64 ~ 0.025

0.097 ~ 0.004

0.427 ~ 0.017

0504

1.27 ± 0.152 ~ 0.050 ± 0.006

1.02 ± 0.152 ~ 0.04 ± 0.006

1.12 ~ 0.044

0.20 ~ 0.008

0.50 ~ 0.02

0505

1.4 +0.35/-0.25 ~ 0.055 +0.014/-0.01

1.4 ± 0.25 ~ 0.055 ± 0.01

1.27 ~ 0.05

0.13 ~ 0.005

0.5 ~ 0.02

RF0505

1.4 +0.38/-0.25 ~ 0.055 +0.015/-0.01

1.4 ± 0.381 ~ 0.055 ± 0.015

1.45 ~ 0.057

0.20 ~ 0.008

0.50 ~ 0.02

C11

1.477 ± 0.391 ~ 0.059 ± 0.016

1.416 ± 0.451 ~ 0.056 ± 0.018

1.334 ~ 0.053

0.193 ~ 0.008

0.733 ~ 0.029

0603

1.6 ± 0.15 ~ 0.063 ± 0.006

0.8 ± 0.15 ~ 0.032 ± 0.006

0.90 ~ 0.036

0.20 ~ 0.004

0.40 ~ 0.016

C06

1.532 ± 0.229 ~ 0.06 ± 0.009

0.77 ± 0.191 ~ 0.031 ± 0.008

0.8 ~ 0.032

0.169 ~ 0.007

0.680 ~ 0.027

C07

1.797 ± 0.470 ~ 0.071 ± 0.019

2.813 ± 0.521 ~ 0.111 ± 0.021

2.667 ~ 0.105

0.193 ~ 0.008

1.20 ~ 0.047

0805

2.0 ± 0.20 ~ 0.079 ± 0.008

1.25 ± 0.20 ~ 0.049 ± 0.008

1.37 ~ 0.054

0.25 ~ 0.010

0.75 ~ 0.030

C08

2.048 ± 0.407 ~ 0.081 ± 0.016

1.28 ± 0.267 ~ 0.051 ± 0.011

1.360 ~ 0.054

0.362 ~ 0.014

1.04 ~ 0.041

0907

2.3 ± 0.30 ~ 0.090 ± 0.012

1.8 ± 0.30 ~ 0.070 ± 0.012

1.52 ~ 0.06

0.25 ~ 0.010

0.75 ~ 0.030

1005

2.54 ± 0.203 ~ 0.100 ± 0.008

1.27 ± 0.203 ~ 0.050 ± 0.008

1.37 ~ 0.054

0.25 ~ 0.010

0.75 ~ 0.030

1111

2.79 +0.51/-0.25 ~ 0.11 +0.02/-0.01

2.79 ± 0.38 ~ 0.113 ± 0.015

1.78 ~ 0.07

0.13 ~ 0.005

0.63 ~ 0.025

RF1111

2.79 +0.64/-0.25 ~ 0.11 +0.025/-0.01

2.79 ± 0.381 ~ 0.110 ± 0.015

2.59 ~ 0.102

0.25 ~ 0.010

0.75 ~ 0.030

C17

2.94 ± 0.527 ~ 0.116 ± 0.021

2.813 ± 0.521 ~ 0.111 ± 0.021

2.667 ~ 0.105

0.193 ~ 0.008

1.2 ~ 0.047

C18

3.14 ± 0.727 ~ 0.124 ± 0.029

2.946 ± 0.654 ~ 0.116 ± 0.026

2.667 ~ 0.105

0.193 ~ 0.008

1.2 ~ 0.047

1206

3.2 ± 0.20 ~ 0.126 ± 0.008

1.6 ± 0.20 ~ 0.063 ± 0.008

1.70 ~ 0.068

0.25 ~ 0.010

0.75 ~ 0.030

1210

3.2 ± 0.20 ~ 0.126 ± 0.008

2.5 ± 0.20 ~ 0.098 ± 0.008

2.0 ~ 0.08

0.25 ~ 0.010

0.75 ~ 0.030

1515

3.81 ± 0.381 ~ 0.150 ± 0.015

3.81 ± 0.381 ~ 0.150 ± 0.015

3.3 ~ 0.13

0.381 ~ 0.015

1.143 ~ 0.045

1808

4.5 ± 0.35 ~ 0.180 ± 0.014

2.0 ± 0.30 ~ 0.08 ± 0.012

2.0 ~ 0.08

0.25 ~ 0.01

1.0 ~ 0.04

1812

4.5 ± 0.30 ~ 0.180 ± 0.012

3.2 ± 0.20 ~ 0.126 ± 0.008

3.2 ~ 0.125

0.25 ~ 0.010

1.143 ~ 0.045

1825

4.5 ± 0.30 ~ 0.180 ± 0.012

6.40 ± 0.40 ~ 0.252 ± 0.016

4.2 ~ 0.16

0.25 ~ 0.010

1.0 ~ 0.04

2020

5.0 ± 0.40 ~ 0.197 ± 0.016

5.0 ± 0.40 ~ 0.197 ± 0.016

4.5 ~ 0.18

0.25 ~ 0.01

1.0 ~ 0.04

2220

5.7 ± 0.40 ~ 0.225 ± 0.016

5.0 ± 0.40 ~ 0.197 ± 0.016

4.2 ~ 0.165

0.25 ~ 0.01

1.0 ~ 0.04

2211

5.7 ± 0.40 ~ 0.225 ± 0.016

2.79 ± 0.30 ~ 0.11 ± 0.012

2.5 ~ 0.1

0.25 ~ 0.01

0.8 ~ 0.03

2215

5.7 ± 0.40 ~ 0.225 ± 0.016

3.81 ± 0.35 ~ 0.35 ± 0.02

2.5 ~ 0.1

0.25 ~ 0.01

0.8 ~ 0.03

2221

5.59 ± 0.381 ~ 0.220 ± 0.015

5.33 ± 0.381 ~ 0.210 ± 0.015

2.03 ~ 0.08

0.381 ~ 0.015

1.143 ~ 0.045

2225

5.7 ± 0.40 ~ 0.225 ± 0.016

6.30 ± 0.40 ~ 0.252 ± 0.016

4.2 ~ 0.165

0.381 ~ 0.01

1.143 ~ 0.045

C22

5.734 ± 0.667 ~ 0.226 ± 0.026

6.37 ± 0.699 ~ 0.251 ± 0.028

3.467 ~ 0.137

N/A

N/A

2520

6.35 ± 0.40 ~ 0.250 ± 0.016

5.08 ± 0.40 ~ 0.200 ± 0.016

4.57 ~ 0.18

0.381 ~ 0.015

1.143 ~ 0.045

RF2525

5.84 ± 0.51 ~ 0.230 ± 0.020

6.35 ± 0.381 ~ 0.250 ± 0.015

4.19 ~ 0.165

0.381 ~ 0.015

1.143 ~ 0.045

3333

8.38 ± 0.432 ~ 0.330 ± 0.017

8.38 ± 0.432 ~ 0.330 ± 0.017

6.35 ~ 0.25

0.381 ~ 0.015

1.143 ~ 0.045

3530

8.89 ± 0.457 ~ 0.350 ± 0.018

7.62 ± 0.381 ~ 0.300 ± 0.015

6.35 ~ 0.25

0.381 ~ 0.015

1.143 ~ 0.045

3640

9.2 ± 0.50 ~ 0.36 ± 0.02

10.16 ± 0.50 ~ 0.40 ± 0.02

4.5 ~ 0.18

0.50 ~ 0.02

1.50 ~ 0.06

C40

9.732 ± 0.804 ~ 0.384 ± 0.032

8.665 ± 1.737 ~ 0.381 ± 0.029

3.467 ~ 0.137

N/A

N/A

4040

10.2 ± 0.508 ~ 0.400 ± 0.020

10.2 ± 0.508 ~ 0.400 ± 0.020

7.62 ~ 0.30

0.50 ~ 0.02

1.50 ~ 0.06

4540

11.4 ± 0.584 ~ 0.450 ± 0.023

10.2 ± 0.508 ~ 0.400 ± 0.020

7.62 ~ 0.30

0.50 ~ 0.02

1.50 ~ 0.06

5440

13.7 ± 0.686 ~ 0.540 ± 0.027

10.2 ± 0.508 ~ 0.400 ± 0.020

7.62 ~ 0.30

0.50 ~ 0.02

1.50 ~ 0.06

5550

14.0 ± 0.711 ~ 0.550 ± 0.028

12.7 ± 0.635 ~ 0.500 ± 0.025

7.62 ~ 0.30

0.50 ~ 0.02

1.50 ~ 0.06

6560

16.5 ± 0.838 ~ 0.650 ± 0.033

15.2 ± 0.762 ~ 0.600 ± 0.030

7.62 ~ 0.30

0.50 ~ 0.02

1.50 ~ 0.06

7565

19.1 ± 0.965 ~ 0.750 ± 0.038

16.5 ± 0.838 ~ 0.650 ± 0.033

7.62 ~ 0.30

0.50 ~ 0.02

1.50 ~ 0.06

8060

20.3 ± 0.5 ~ 0.80 ± 0.02

15.24 ± 0.50 ~ 0.60 ± 0.02

4.2 ~ 0.165

0.50 ~ 0.02

1.50 ~ 0.06

23

Chip Ordering Information 

—

 DLI Brand Parts

Case

Dimensions

04

0.040" x 0.020"

06

0.060" x 0.030"

07

0.110" x 0.070"

08

0.080" x 0.050"

11

0.055" x 0.055"

17

0.110" x 0.110"

18

0.110" x 0.110"

22

0.220" x 0.250"

40

0.380" x 0.380"

Code Testing

X

Commercial or Industrial

Y

Reduced Visual

A

MIL-PRF-55681 Group A

C

MIL-PRF-55681 Group C

D

Customer Specified

Code Laser Marking

0

No Marking

1*

Single-Side Marked

2*

Double-Side Marked

3*

Large Single-Side Marked

4*

Large Double-Side Marked

5*

Vertical Edge Marked

9

Customer Specified

Code Packaging

T

Tape & Reel – Horizontal

V

Tape & Reel – Vertical

W

Waffle Pack

B

Bulk

P

Plastic Box

R

Tube (Rail)

S

Customer Specified

Code Lead Type

A

Axial Ribbon

B

Radial Ribbon

C

Center Ribbon

D

Specialty Customer Defined

E

Axial Wire

F

Radial Wire

N

NONE

Code Value

A

± 0.05pF

B

± 0.1pF

C

± 0.25pF

D

± 0.5pF

F

± 1%

G

± 2%

J

± 5%

K

± 10%

M

± 20%

X

GMV

S

SPECIAL

Code Value

5

50V

1

100V

8

150V

6

200V

9

250V

3

300V

4

500V

7

1kV

A 

1.5kV

G 

2kV

B

2.5kV

D 

3.6kV

H 

7.2kV

S 

SPECIAL

CODE Termination System

T

Ag Termination, Ni Barrier Layer, Heavy SnPb Plated Solder

U

Ag Termination, Ni Barrier Layer, SnPb Plated Solder

S

Ag Termination, Ni Barrier Layer, Gold Flash

**

Z

Ag Termination, Ni Barrier Layer, Sn Plated Solder

**

E

Ag Terier, Sn Plated Solder

**

P*

AgPd Termination

**

Q

Polymer Termination, Ni Barrier Layer, Sn Plated Solder

**

Y

Polymer Termination, Ni Barrier Layer, SnPb Plated Solder

M*

Polymer Termination, Cu Barrier Layer, Sn Plated Solder

**

W*

Ag Termination, Cu Barrier Layer, Sn Plated Solder

**

H*

Ag Termination, Enhanced Cu Barrier, Sn Plated Solder

**

V*

Ag Termination, Cu Barrier Layer, SnPb Plated Solder

R*

Ag Termination, Cu Barrier Layer, Heavy SnPb Plated Solder

Material Characteristics

AH

P90 High-Q Porcelain

CF

NP0 High-Q Porcelain

UL

NP0 Ultra Low ESR

Axial Ribbon 

—

 Code A Radial Ribbon 

—

 Code B Center Ribbon 

—

 Code C

Axial Wire Lead 

—

 Code E

Radial Wire Lead 

—

 Code F

1st two digits are significant 
figures of capacitance, 3rd 
digit denotes number of 
zeros, R = decimal point 
Examples:

1R0

1.0pF

120

12pF

471

470pF

102

1,000pF

CASE SIZE

TEST LEVEL

LASER MARK

PACKAGING

LEADING

CAPACITANCE 

TOLERANCE

VOLTAGE CODES

DIELECTRIC CODES

CAPACITANCE CODES

TERMINATION CODES

C

17

CF

620

J

7

-

-

N

0

U

X

T

MLC

Capacitor

Case Size

Dielectric

Capacitance

Codes

Capacitance

Tolerance

Rated

Voltage

Termination

Lead Type

Test Level

Marking

Packaging

* Nonmagnetic 

**

Indicates RoHS terminations

Note: Consult your local Sales Office 
for RoHS-compliant leaded devices.

<10pF A, B, C, D
>10pF F, G, J, K, M

*Reduces DWV Rating.

24

Chip Ordering Information 

—

 Novacap Brand Parts

1st two digits are 
significant figures 
of capacitance, 
3rd digit denotes 
number of zeros, 
R = decimal point 
Examples:

1R0

1.0pF

120

12pF

471

470pF

102

1,000pF

273

0.027μF

474

0.47μF

105

1.0μF

CAPACITANCE CODES

CAPACITANCE TOLERANCE CODES

None Standard Chip

RF

Improved ESR Capacitor

p. 37

ST

Stacked Capacitor Assembly

p. 83-88

SM

Stacked Hi-Rel Capacitor Assembly

p. 83-88

CR

Cap Rack Arrays

p. 89

SV

Stacked Vertical Capacitor Assembly

p. 90

None

Standard thickness as 
per Novacap catalog 
specifications

X

Denotes a special 
thickness other than 
standard. Specify in 
inches if required. (As 
shown above X = 0.050")

None Bulk

T

Tape and Reel

W

Waffle Pack

None No voltage conditioning/burn-in

H

Voltage conditioning/burn-in*

1st two digits are significant, third 
digit denotes number of zeros. 

For example:

160

16 Volts

101

100 Volts

501

500 Volts

102

1,000 Volts

502 5,000 Volts

103

10,000 Volts

HB

MIL-PRF-55681 Group A

HV

MIL-PRF-49467 Group A

HS

MIL-PRF-123 Group A

HK

MIL-PRF-38534 Class K

HH

MIL-PRF-38534 Class H

None Unmarked

M

Marked 

*Marking not available 

on sizes ≤ 0603

PREFIX DEFINITIONS

SPECIAL THICKNESS

HIGH RELIABILITY TESTING

MARKING

PACKAGING

HIGH RELIABILITY 

TESTING CRITERIA

N

C0G/NP0

Ultra Stable

K

R3L

Ultra Stable

B

X7R

Stable

W

X5R

Stable

X

BX

MIL

BB

X7R

Stable BME

BW

X5R

Stable BME

M

C0G/NP0

Non-Magnetic

C

X7R

Non-Magnetic

F

C0G/NP0

High Temp. (up to 160ºC)

D, RD

C0G/NP0

High Temp. (up to 200ºC)

S

X8R

High Temp. (up to 150ºC)

E, RE

Class II

High Temp. (up to 200ºC)

G

Class II

High Temp. (up to 160ºC)

RN

C0G/NP0

Lead Free

RB

X7R

Lead Free

Code

Tolerance

C0G/NP0

R3L

X7R

BX

X8R

Class II

X5R

*Not RF series

N

M

F/D, RD

K

B

C, RE

X

S

E/G

W

B

±0.10pF

Cap.

Value

< 10pF

C

±0.25pF

D

±0.50pF

F

±1%

G

±2%

J

±5%

     *

     *

K

±10%

M

±20%

DIELECTRIC CODES

P

Palladium Silver

PR

Palladium Silver*

K

Solderable Palladium Silver*

N

Nickel Barrier*

100% tin

Y

Nickel Barrier

90% tin, 10% lead

NG

Nickel Barrier Gold Flash*

C

FlexiCap™/Nickel Barrier*

100% tin

D

FlexiCap™/Nickel Barrier

90% tin, 10% lead

B

Copper Barrier*

100% tin

E

Copper Barrier

90% tin, 10% lead

S

Silver*

TERMINATION CODES

VOLTAGE CODES

XX

1206

N

472

J

101

X050

T

N

H

HB

Prefix

Case Size

Dielectric

Capacitance

Codes

Capacitance

Tolerance

Voltage

Termination

Special 

Thickness

High 

Reliability 

Testing

Packaging

Marking

High 

Reliability 

Test Criteria

Note: Refer to page 20.

*Option H is required for Testing Criteria HB, HV, HS, HK, 

and is optional for HH. For high temperature dielectrics, 

option H includes high temperature screening.

*Indicates RoHS terminations

-

M

25

Chip Ordering Information 

—

 Syfer Brand Parts

1210

Y

100

0103

K

T

X

---

Chip Size

Termination

Voltage

Capacitance

in Picofarads (pF)

Capacitance

Tolerance

Dielectric

Packaging

Suffix Code

Code  

T

178mm (7") reel

R

330mm (13") reel

B

Bulk pack 

—

 tubs or trays

Used for specific customer

requirements

PXX Palladium electrodes

LS*

Chip marking

*(consult Sales Office)

Calculation

Example Capacaitance value

<1.0pF
Insert a P for the decimal point as the 1st character.

P300

0.3pF 
(values in 0.1pF steps)

≥1.0pF & <10pF
Insert a P for the decimal point as the 2nd character.

8P20

8.2pF 
(values are E24 series)

≥10pF
1st digit is 0. 2nd and 3rd digits are significant figures 
of capacitance value. 4th digit is number of zeros.

0101

100pF 
(values are E24 series)

PACKAGING

SUFFIX DEFINITIONS

CASE CODE

CAPACITANCE TOLERANCE CODES

CAPACITANCE CODES

TERMINATION CODES

DIELECTRIC CODES

VOLTAGE CODES

0402
0603
0805

1206

1210

1808

1812

1825

2220
2225
3640
4040
5550
8060

A

Nickel barrier

90%/10% tin/lead

F

Palladium Silver*

H

FlexiCap™/Nickel Barrier

90%/10% tin/lead

J

Nickel Barrier*

100% tin

Y

FlexiCap™/Nickel Barrier*

100% tin

2

Copper Barrier* (Non-Mag)

100% tin

3

FlexiCap™/Copper Barrier* (Non-Mag)

100% tin

4

Copper Barrier (Non-Mag)

90%/10% tin/lead

5

FlexiCap™/Copper Barrier (Non-Mag)

90%/10% tin/lead

Code

Dielectric

Feature

C

C0G/NP0 (1B)

Ultra Stable

H

X8G

Ultra Stable/High Q

P

X5R

Stable

X

X7R (2R1)

Stable

J

X7R (2R1)(BME)

Stable

N

X8R

Stable

Q

C0G/NP0 (1B)

Ultra Stable/High Q

U

C0G/NP0 (1B)

Ultra Stable/Ultra-Low ESR

A

C0G/NP0 (1B)

AEC -Q200 Approved

S

X7R (2R1)(BME)

AEC -Q200 Approved

E

X7R (2R1)

AEC -Q200 Approved

T

X8R

AEC -Q200 Approved

K

C0G/NP0 (1B)(BME)

AEC -Q200 Approved

F

C0G/NP0 (1B)

IECQ-CECC Release

D

X7R (2R1)

IECQ-CECC Release

R

BZ (2C1)

IECQ-CECC Release

B

BX (2X1)

IECQ-CECC Release

G

C0G/NP0 (1B)(BME)

Ultra Stable

Code

Tolerance

H

±0.05pF

< 4.7pF

H

±0.05pF

Cap. Value < 10pF

B

±0.10pF

C

±0.25pF

D

±0.50pF

F

±1%

Cap. Value ≥ 10pF

G

±2%

J

±5%

K

±10%

M

±20%

Code

Value

Code

Value

Code

Value

010

10Vdc

1K0

1kVdc

A25

250Vac

016

16Vdc

1K2

1.2kVdc

025

25Vdc

1K5

1.5kVdc

050

50Vdc

2K0

2kVdc

063

63Vdc

2K5

2.5kVdc

100

100Vdc

3K0

3kVdc

200

200Vdc

4K0

4kVdc

250

250Vdc

5K0

5kVdc

500

500Vdc

6K0

6kVdc

630

630Vdc

8K0

8kVdc

10K

10kVdc

12K

12kVdc

*Indicates RoHS terminations

26

Calculation

Example Capacaitance value

<1.0pF
Insert a P for the decimal point as the 1st character.

P300

0.3pF 
(values in 0.1pF steps)

≥1.0pF & <10pF
Insert a P for the decimal point as the 2nd character.

8P20

8.2pF 
(values are E24 series)

≥10pF
1st digit is 0. 2nd and 3rd digits are significant figures 
of capacitance value. 4th digit is number of zeros.

0101

100pF 
(values are E24 series)

C0G/NP0 (1B)

0402

0603

0805

1206

1210

1808

Maximum Thickness (T)

0.6mm

0.8mm

1.3mm

1.7mm

2.0mm

2.2mm

2.0mm

10V

Standard

-

0.5pF-3.9nF

1.0pF-15nF

1.0pF-47nF

3.9pF-100nF

-

4.7pF-100nF

16V

AEC-Q200

-

0.5pF-1.0nF

1.0pF-4.7nF

1.0pF-15nF

3.9pF-27nF

-

4.7pF-27nF

Standard

-

0.5pF-2.7nF

1.0pF-12nF

1.0pF-33nF

3.9pF-68nF

-

4.7pF-68nF

25V

AEC-Q200

-

0.5pF-1.0nF

1.0pF-4.7nF

1.0pF-15nF

3.9pF-27nF

-

4.7pF-27nF

Standard

0.2pF- 220pF

0.5pF-2.2nF

1.0pF-10nF

1.0pF-27nF

3.9pF-56nF

-

4.7pF-47nF

50V/63V

AEC-Q200

-

0.5pF-1.0nF

1.0pF-4.7nF

1.0pF-15nF

3.9pF-27nF

-

4.7pF-27nF

Standard

0.2pF-220pF

0.5pF-1.5nF

1.0pF-5.6nF

1.0pF-22nF

3.9pF-33nF

-

4.7pF-33nF

100V

AEC-Q200

-

0.5pF-680pF

1.0pF-2.2nF

1.0pF-8.2nF

3.9pF-15nF

-

4.7pF-15nF

Standard

0.2pF-100pF

0.5pF-680pF

1.0pF-2.2nF

1.0pF-8.2nF

3.9pF-18nF

-

4.7pF-18nF

200/250V

AEC-Q200

-

0.5pF-560pF

1.0pF-1.5nF

1.0pF-3.9nF

3.9pF-8.2nF

-

4.7pF-8.2nF

Standard

0.2pF-33pF

0.5pF-560pF

1.0pF-1.5nF

1.0pF-3.9nF

3.9pF-8.2nF

-

4.7pF-8.2nF

500V

AEC-Q200

-

10pF-330pF

1.0pF-1.0nF

1.0pF-3.3nF

3.9pF-6.8nF

-

4.7pF -6.8nF

Standard

-

0.5pF-330pF

1.0pF-1.5nF

1.0pF-3.3nF

3.9pF-6.8nF

-

4.7pF-6.8nF

630V

AEC-Q200

-

-

10pF-820pF

1.0pF-2.7nF

3.9pF-5.6nF

6.8nF-6.8nF

4.7pF-6.8nF

Standard

-

-

1.0pF-820pF

1.0pF-2.7nF

3.9pF-5.6nF

6.8nF-6.8nF

4.7pF-6.8nF

1kV

AEC-Q200

-

-

10pF-330pF

1.0pF-2.2nF

3.9pF-3.9nF

-

4.7pF-3.9nF

Standard

-

-

1.0pF-330pF

1.0pF-2.2nF

3.9pF-3.9nF

-

4.7pF-3.9nF

1.2kV

AEC-Q200

-

-

10pF-180pF

1.0pF-820pF

3.9pF-1.8nF

-

4.7pF-2.2nF

Standard

-

-

1.0pF-180pF

1.0pF-820pF

3.9pF-1.8nF

-

4.7pF-2.2nF

1.5kV

AEC-Q200

-

-

10pF-150pF

1.0pF-560pF

3.9pF-1.2nF

-

4.7pF-1.5nF

Standard

-

-

1.0pF-150pF

1.0pF-560pF

3.9pF-1.2nF

-

4.7pF-1.5nF

2kV

AEC-Q200

-

-

10pF-100pF

1.0pF -390pF

3.9pF-560pF

-

4.7pF-680pF

Standard

-

-

1.0pF-100pF

1.0pF-390pF

3.9pF-560pF

-

4.7pF-680pF

2.5kV

AEC-Q200

-

-

-

10pF-150pF

10pF-330pF

-

10pF-390pF

Standard

-

-

-

1.0pF-150pF

3.9pF-330pF

-

4.7pF-390pF

3kV

AEC-Q200

-

-

-

10pF-100pF

10pF-220pF

-

10pF-270pF

Standard

-

-

-

1.0pF-100pF

3.9pF-220pF

-

4.7pF-270pF

4kV*

AEC-Q200

-

-

-

-

-

-

10pF-150pF

Standard

-

-

-

-

-

-

4.7pF-150pF

5kV*

AEC-Q200

-

-

-

-

-

-

10pF-82pF

Standard

-

-

-

-

-

-

4.7pF-82pF

6kV*

Standard

-

-

-

-

-

-

4.7pF-47pF

8kV*

Standard

-

-

-

-

-

-

-

10kV*

Standard

-

-

-

-

-

-

-

12kV*

Standard

-

-

-

-

-

-

-

C0G/NP0 (1B) 

—

 AEC-Q200 and Standard Ranges

C0G/NP0 (1B) 

—

 AEC-Q200 AND STANDARD RANGES 

—

 CAPACITANCE VALUES

27

Notes: 
1)  *Parts rated 4kV and above may require conformal coating post soldering.
2) Standard parts are normally ordered using the Syfer order code system (see page 26), but are also available  
    as Novacap parts using dielectric code RN (page 25). Note the RN nomenclature is being phased out and is  
    not recommended for new designs, rather the Syfer brand part number should be used.

C0G/NP0 (1B)

1812

1825

2220

Maximum Thickness (T)

2.5mm

3.2mm

2.5mm

4.0mm

2.5mm

4.0mm

10V

Standard

10pF-220nF

-

10pF - 470nF

-

10pF-470nF

-

16V

AEC-Q200

10pF-47nF

-

10pF-82nF

-

10pF-100nF

-

Standard

10pF-180nF

-

10pF-330nF

-

10pF-330nF

-

25V

AEC-Q200

10pF-47nF

-

10pF-82nF

-

10pF-100nF

-

Standard

10pF-150nF

-

10pF-220nF

-

10pF-220nF

-

50V/63V

AEC-Q200

10pF-47nF

-

10pF-82nF

-

10pF-100nF

-

Standard

10pF-100nF

-

10pF-150nF

-

10pF-150nF

-

100V

AEC-Q200

10pF-39nF

-

10pF-47nF

-

10pF-56nF

-

Standard

10pF-47nF

-

10pF-68nF

-

10pF-68nF

-

200V/250V

AEC-Q200

10pF-18nF

22nF-22nF

10pF-27nF

33nF-33nF

10pF-33nF

39nF-39nF

Standard

10pF-22nF

27nF-27nF

10pF-33nF

39nF-47nF

10pF-33nF

39n-56nF

500V

AEC-Q200

10pF-15nF

18nF-22nF

10pF-18nF

22nF-33nF

10pF-27nF

33nF-39nF

Standard

10pF-15nF

18nF-22nF

10pF-27nF

33nF-33nF

10pF-27nF

33nF-39nF

630V

AEC-Q200

10pF-15nF

18nF-22nF

10pF-10nF

12nF-33nF

10pF-27nF

33nF-39nF

Standard

10pF-15nF

18nF-22nF

10pF-22nF

27nF-33nF

10pF-27nF

33nF-39nF

1kV

AEC-Q200

10pF-6.8nF

8.2nF-10nF

10pF-10nF

12nF-22nF

10pF-15nF

18nF-22nF

Standard

10pF-6.8nF

8.2nF-10nF

10pF-12nF

15nF-22nF

10pF-15nF

18nF-22nF

1.2kV

AEC-Q200

10pF-3.9nF

4.7nF-8.2nF

10pF-5.6nF

6.8nF-18nF

10pF-5.6nF

6.8nF-22nF

Standard

10pF-4.7nF

5.6nF-8.2nF

10pF-6.8nF

8.2nF-18nF

10pF-10nF

12nF-22nF

1.5kV

AEC-Q200

10pF-3.9nF

4.7nF-6.8nF

10pF-5.6nF

6.8nF-12nF

10pF-5.6nF

6.8nF-15nF

Standard

10pF-3.9nF

4.7nF-6.8nF

10pF-5.6nF

6.8nF-12nF

10pF-5.6nF

6.8nF-15nF

2kV

AEC-Q200

10pF-2.2nF

2.7nF-2.7nF

10pF-4.7nF

5.6nF-5.6nF

10pF-4.7nF

5.6nF-5.6nF

Standard

10pF-2.2nF

2.7nF-2.7nF

10pF-4.7nF

5.6nF-5.6nF

10pF-4.7nF

5.6nF-5.6nF

2.5kV

AEC-Q200

10pF-680pF

820pF-1.5nF

10pF-1.2nF

1.5nF-3.3nF

10pF-1.5nF

1.8nF-3.9nF

Standard

10pF-820pF

1.0nF-1.5nF

10pF-1.5nF

1.8nF-3.3nF

10pF-1.8nF

2.2nF-3.9nF

3kV

AEC-Q200

10pF-470pF

560pF-1.0nF

10pF-820pF

1.0nF-2.2nF

10pF-1.0nF

1.2nF-2.7nF

Standard

10pF-560pF

680pF-1.0nF

10pF- 1.2nF

1.5nF-2.2nF

10pF-1.5nF

1.8nF-2.7nF

4kV*

AEC-Q200

10pF-220pF

270pF-560pF

10pF-680pF

820pF-1.5nF

10pF-680pF

820pF-1.8nF

Standard

10pF-270pF

330pF-560pF

10pF-680pF

820pF-1.5nF

10pF-680pF

820pF-1.8nF

5kV*

AEC-Q200

10pF-180pF

220pF-220pF

10pF-330pF

390pF- 560pF

10pF-330pF

390pF-680pF

Standard

10p-180pF

220pF-270pF

10pF-390pF

470pF- 560pF

10pF-470pF

560pF-820pF

6kV*

Standard

10pF-120pF

150pF-180pF

10pF-270pF

330pF- 330pF

10pF-330pF

390p-560pF

8kV*

Standard

-

-

-

-

-

-

10kV*

Standard

-

-

-

-

-

-

12kV*

Standard

-

-

-

-

-

-

C0G/NP0 (1B) 

—

 AEC-Q200 and Standard Ranges

C0NTINUED

10V TO 12KV

 

28

Notes: 
1)  *Parts rated 4kV and above may require conformal coating post soldering.
2) Standard parts are normally ordered using the Syfer order code system (see page 26), but are also available  
    as Novacap parts using dielectric code RN (page 25). Note the RN nomenclature is being phased out and is  
    not recommended for new designs, rather the Syfer brand part number should be used.

10V TO 12KV

Notes: 
1)  *Parts rated 4kV and above may require conformal coating post soldering.
2) Standard parts are normally ordered using the Syfer order code system (see page 26), but are also available  
    as Novacap parts using dielectric code RN (page 25). Note the RN nomenclature is being phased out and is  
    not recommended for new designs, rather the Syfer brand part number should be used.

 

C0G/NP0 (1B)

2225

3640

5550

8060

Maximum

 Thickness (T)

2.5mm

4.0mm

2.5mm

4.0mm

2.5mm

4.0mm

2.5mm

4.0mm

10V

Standard

10pF - 560nF

-

10pF - 330nF

-

-

-

-

-

16V

AEC-Q200

10pF - 150nF

-

10pF - 220nF

-

-

-

-

-

Standard

10pF - 470nF

-

10pF - 330nF

-

-

-

-

-

25V

AEC-Q200

10pF - 150nF

-

10pF - 220nF

-

-

-

-

-

Standard

10pF - 330nF

-

10pF - 330nF

-

-

-

-

-

50V/

63V

AEC-Q200

10pF - 150nF

-

10pF - 220nF

-

-

-

-

-

Standard

10pF - 220nF

-

10pF - 330nF

-

27pF - 680nF

-

47pF - 1.0μF

-

100V

AEC-Q200

10pF - 68nF

-

10pF - 180nF

-

-

-

-

-

Standard

10pF - 82nF

-

10pF - 270nF

-

27pF - 470nF

-

47pF - 680nF

-

200V/

250V

AEC-Q200

10pF - 33nF

39nF - 47nF

10pF - 82nF

100nF - 100nF

-

-

-

-

Standard

10pF - 47nF

56nF - 68nF

10pF - 120nF

150nF - 180nF

27pF - 270nF

330nF - 330nF

47pF - 390nF 470nF - 560nF

500V

AEC-Q200

10pF - 33nF

39nF - 47nF

10pF - 82nF

100nF - 100nF

-

-

-

-

Standard

10pF - 33nF

39nF - 47nF

10pF - 82nF

100nF - 120nF

27pF - 180nF

220nF - 270nF

47pF - 270nF 330nF - 470nF

630V

AEC-Q200

10pF - 18nF

-

10pF - 82nF

100nF - 100nF

-

-

-

-

Standard

10pF - 22nF

27nF - 39nF

10pF - 82nF

100nF - 100nF

27pF - 120nF

150nF - 180nF

47pF - 220nF 270nF - 390nF

1kV

AEC-Q200

10pF - 18nF

22nF - 27nF

10pF - 47nF

56nF - 68nF

-

-

-

-

Standard

10pF - 18nF

22nF - 27nF

10pF - 47nF

56nF - 82nF

27pF - 82nF

100nF - 150nF

47pF - 150nF 180nF - 270nF

1.2kV

AEC-Q200

10pF - 6.8nF

8.2nF - 27nF

10pF - 33nF

39nF - 56nF

-

-

-

-

Standard

10pF - 12nF

15nF - 27nF

10pF - 33nF

39nF - 56nF

27pF - 68nF

82nF - 100nF

47pF - 100nF 120nF - 180nF

1.5kV

AEC-Q200

10pF - 6.8nF

8.2nF - 18nF

10pF - 22nF

27nF - 39nF

-

-

-

-

Standard

10pF - 6.8nF

8.2nF - 18nF

10pF - 22nF

27nF - 39nF

27pF - 39nF

47nF - 68nF

47pF - 68nF 82nF - 120nF

2kV

AEC-Q200

10pF - 3.9nF

4.7nF - 8.2nF

10pF - 12nF

15nF - 15nF

-

-

-

-

Standard

10pF - 4.7nF

5.6nF - 8.2nF

10pF - 12nF

15nF - 18nF

27pF - 22nF

27nF - 39nF

47pF - 39nF

47nF - 68nF

2.5kV

AEC-Q200

10pF - 2.7nF

3.3nF - 4.7nF 100pF - 5.6nF

6.8nF - 8.2nF

-

-

-

-

Standard

10pF - 2.7nF

3.3nF - 4.7nF

10pF - 6.8nF

8.2nF - 12nF

27pF - 12nF

15nF - 22nF

47pF - 22nF

27nF - 39nF

3kV

AEC-Q200

10pF - 1.5nF

1.8nF - 3.9nF 100pF - 3.9nF

4.7nF - 6.8nF

-

-

-

-

Standard

10pF - 1.8nF

2.2nF - 3.9nF

10pF - 4.7nF

5.6nF - 8.2nF

27pF - 10nF

12nF - 18nF

47pF - 15nF

18nF - 27nF

4kV*

AEC-Q200

10pF - 1.0nF

1.2nF - 1.8nF

-

-

-

-

-

-

Standard

10pF - 1.0nF

1.2nF - 1.8nF

10pF - 1.8nF

2.2nF - 3.3nF

27pF - 4.7nF

5.6nF - 6.8nF

47pF - 8.2nF

10nF - 15nF

5kV*

AEC-Q200

10pF - 680pF  820pF - 820pF

-

-

-

-

-

-

Standard

10pF - 680pF

820pF - 1.2nF

10pF - 1.5nF

1.8nF - 2.2nF

27pF - 2.7nF

3.3nF - 4.7nF

47pF - 5.6nF

6.8nF - 10nF

6kV*

Standard

10pF - 390pF

470pF - 680pF

10pF - 1.0nF

1.2nF - 1.5nF

27pF - 1.8nF

2.2nF - 3.3nF

47pF - 3.9nF 4.7nF - 6.8nF

8kV*

Standard

-

-

10pF - 150pF

-

27pF - 330pF

-

47pF - 680pF

-

10kV*

Standard

-

-

10pF - 100pF

-

27pF - 180pF

-

47pF - 470pF

-

12kV*

Standard

-

-

10pF - 68pF

-

27pF - 120pF

-

47pF - 220pF

-

C0G/NP0 (1B) 

—

 AEC-Q200 and Standard Ranges

29

 

30

X7R (2R1) 

—

 AEC-Q200 and Standard Ranges

X7R (2R1) 

—

 AEC-Q200 AND STANDARD RANGES 

—

 CAPACITANCE VALUES

X7R(2R1)

0402

0603

0805

1206

1210

1808

Maximum

Thickness (T)

0.6mm

0.9mm

1.3mm

1.7mm

1.7mm

2.0mm

2.0mm

2.8mm

2.8mm

2.0mm

2.0mm

Special

Requirements

-

-

-

-

Conformal 

Coating

-

Conformal 

Coating

-

Conformal 

Coating

-

Conformal 

Coating

16V

AEC-Q200

-

-

220pF - 100nF

220pF - 470nF

-

1.0nF - 1.0μF

-

-

-

1.0nF - 470nF

-

Standard

-

100pF - 100nF

100pF - 330nF

100pF - 

1.0μF

-

100pF - 1.5μF

-

-

-

100pF - 1.5μF

-

25V

AEC-Q200

-

-

220pF - 100nF

220pF - 470nF

-

1.0nF - 1.0μF

-

-

-

1.0nF - 470nF

-

Standard

47pF - 10nF

100pF - 100nF

100pF - 220nF

100pF - 820nF

-

100pF - 1.2μF

-

-

-

100pF - 1.2μF

-

50/ 

63V

AEC-Q200

-

100pF - 100nF

100pF - 220nF

100pF - 470nF

-

100pF - 1.0μF

-

-

-

100pF - 680nF

-

Standard

47pF - 5.6nF

100pF - 100nF

100pF - 220nF

100pF - 470nF

-

100pF - 1.0μF

-

-

-

100pF - 680nF

-

100V

AEC-Q200

-

100pF - 47nF

100pF - 100nF

100pF - 220nF

-

100pF - 680nF

-

-

-

100pF - 560nF

-

Standard

47pF - 3.3nF

100pF - 47nF

100pF - 100nF

100pF - 330nF

-

100pF - 680nF

-

-

-

100pF - 560nF

-

200

AEC-Q200

-

100pF - 10nF

100pF - 47nF

100pF - 150nF

-

100pF - 330nF

-

-

-

100pF - 330nF

-

Standard

47pF - 1.0nF

100pF - 10nF

100pF - 56nF

100pF - 150nF

-

100pF - 330nF

-

-

-

100pF - 330nF

-

250V

AEC-Q200

-

100pF - 10nF

100pF - 47nF

100pF - 150nF

-

100pF - 330nF

-

-

-

100pF - 270nF

-

Standard

47pF - 1.0nF

100pF - 10nF

100pF - 56nF

100pF - 150nF

-

100pF - 330nF

-

-

-

100pF - 270nF

-

500V

AEC-Q200

-

220pF - 2.2nF

100pF - 15nF

100pF - 68nF

-

100pF - 150nF

-

-

-

100pF - 150nF

-

Standard

-

100pF - 2.2nF

100pF - 15nF

100pF- 68nF

-

100pF - 150nF

-

-

-

100pF - 150nF

-

630V

AEC-Q200

-

-

220pF - 10nF

100pF - 47nF

-

100pF - 100nF

-

-

-

100pF - 100nF

-

Standard

-

-

100pF - 10nF

100pF - 47nF

-

100pF - 100nF

-

-

-

100pF - 100nF

-

1kV

AEC-Q200

-

-

220pF - 4.7nF

100pF - 22nF

-

100pF - 47nF

-

-

-

100pF - 47nF

-

Standard

-

-

100pF - 10nF

100pF - 22nF

-

100pF - 47nF

-

-

-

100pF - 47nF

-

1.2kV

AEC-Q200

-

-

-

100pF - 10nF

-

100pF - 22nF

-

-

-

100pF - 18nF

-

Standard

-

-

-

100pF - 15nF

-

100pF - 22nF

-

-

-

100pF - 22nF

-

1.5kV

AEC-Q200

-

-

-

100pF - 10nF

-

100pF - 18nF

-

22nF - 22nF

-

100pF - 18nF

-

Standard

-

-

-

100pF - 10nF

-

100pF - 18nF

-

22nF - 22nF

-

100pF - 18nF

-

2kV

AEC-Q200

-

-

-

100pF - 2.2nF

2.7nF - 3.3nF

100pF - 4.7nF

5.6nF - 5.6nF

-

6.8nF - 10nF

100pF - 4.7nF

5.6nF - 8.2nF

Standard

-

-

-

100pF - 2.2nF

2.7nF - 3.3nF

100pF - 4.7nF

5.6nF - 5.6nF

-

6.8nF - 10nF

100pF - 4.7nF

5.6nF - 8.2nF

2.5kV

AEC-Q200

-

-

-

-

100pF - 2.2nF

-

100pF - 4.7nF

-

-

1.0nF - 1.5nF

1.8nF - 4.7nF

Standard

-

-

-

-

220pF - 2.7nF

-

680pF - 4.7nF

-

-

100pF - 1.5nF

1.8nF - 4.7nF

3kV

AEC-Q200

-

-

-

-

100pF - 1.5nF

-

100pF - 3.3nF

-

-

1.0nF - 1.2nF

1.5nF - 3.9nF

Standard

-

-

-

-

220pF - 1.5nF

-

680pF - 3.3nF

-

-

100pF - 1.2nF

1.5nF - 3.9nF

4kV*

AEC-Q200

-

-

-

-

-

-

-

-

-

1.0nF - 1.0nF

1.2nF - 1.5nF

Standard

-

-

-

-

-

-

-

-

-

100pF - 1.0nF

1.2nF - 2.2nF

5kV*

Standard

-

-

-

-

-

-

-

-

-

100pF - 680pF

-

6kV*

Standard

-

-

-

-

-

-

-

-

-

100pF - 390pF

-

8kV*

Standard

-

-

-

-

-

-

-

-

-

-

-

10kV*

Standard

-

-

-

-

-

-

-

-

-

-

-

12kV*

Standard

-

-

-

-

-

-

-

-

-

-

-

16V TO 12KV

Notes: 
1) *Parts rated 4kV and higher may require conformal coating post soldering.
2) "Conformal Coating" identifies parts that must be conformally coated after mounting     
    to prevent flashover, especially between the board and the component.
3) Suffix codes WS2 and WS3 relate to StackiCap™ high capacitance parts. WS3 parts (shown in   

       

     parentheses) must be conformally coated after mounting, especially between the board and the component.

4)  Parts in this range may be dual use under export control legislation and as  
     such may be subject to export license restrictions. Please refer to page 15 for 
     more information on the dual-use regulations and contact the Knowles Precision 
     Devices sales office for further information on specific part numbers.
5)  Standard parts are normally ordered using the Syfer order code system (see page 26),     
     but are also available as Novacap parts using dielectric code RB (see page 25). Note the RB   
     nomenclature is being phased out and is not recommended for new designs, rather the  
     Syfer brand part number should be used.

 

31

X7R (2R1) 

—

 AEC-Q200 and Standard Ranges

16V TO 12KV

X7R(2R1)

1812

1825

2220

Maximum

Thickness (T)

2.5mm

2.5mm

3.2mm

3.5mm

2.5mm

2.5mm

4.0mm

2.5mm

2.5mm

4.0mm

4.5mm

Special 

Requirements

-

Conformal 

Coating

-

Suffix Code WS2 

(WS3)

-

Conformal 

Coating

-

-

Conformal 

Coating

-

Suffix Code 

WS2 (WS3)

16V

AEC-Q200

1.0nF - 680nF

-

-

-

1.0nF - 680nF

-

-

1.0nF - 1.5μF

-

-

-

Standard

150pF - 3.3μF

-

-

-

220pF - 4.7μF

-

-

220pF - 5.6μF

-

-

-

25V

AEC-Q200

1.0nF - 680nF

-

-

-

1.0nF - 680nF

-

-

1.0nF - 1.5μF

-

-

-

Standard

150pF - 2.2μF

-

-

-

220pF - 3.9μF

-

-

220pF - 4.7μF

-

-

-

50/ 

63V

AEC-Q200

150pF - 2.2μF

-

-

-

220pF - 2.2μF

-

-

220pF - 3.3μF

-

-

-

Standard

150pF - 2.2μF

-

-

-

220pF - 2.2μF

-

-

220pF - 3.3μF

-

-

-

100V

AEC-Q200

150pF - 1.0μF

-

-

-

220pF - 1.5μF

-

-

220pF - 1.5μF

-

-

-

Standard

150pF - 1.5μF

-

-

-

220pF - 1.5μF

-

-

220pF - 2.2μF

-

-

-

200

AEC-Q200

150pF - 560nF

-

680nF - 680nF

820nF - 1.0μF

220pF - 1.2μF

-

1.5μF - 1.5μF

220pF - 1.2μF

-

1.5μF - 1.5μF

-

Standard

150pF - 560nF

-

680nF - 680nF

820nF - 1.0μF

220pF - 1.2μF

-

1.5μF - 1.5μF

220pF - 1.2μF

-

1.5μF - 1.5μF

1.8μF - 2.2μF

250V

AEC-Q200

150pF - 560nF

-

680nF - 680nF

820nF - 1.0μF

220pF - 1.2μF

-

1.5μF - 1.5μF

220pF - 1.2μF

-

1.5μF - 1.5μF

-

Standard

150pF - 560nF

-

680nF - 680nF

820nF - 1.0μF

220pF - 1.2μF

-

1.5μF - 1.5μF

220pF - 1.2μF

-

1.5μF - 1.5μF

1.8μF - 2.2μF

500V

AEC-Q200

150pF - 390nF

-

470nF - 470nF

470nF - 470nF

220pF - 560nF

-

-

220pF - 680nF

-

-

-

Standard

150pF - 390nF

-

470nF - 470nF

470nF - 470nF

220pF - 560nF

-

-

220pF - 680nF

-

-

820nF - 1.2μF

630V

AEC-Q200

150pF - 220nF

-

-

220nF - 330nF

220pF - 470nF

-

-

220pF - 470nF

-

-

560nF - 1.0μF

Standard

150pF - 220nF

-

-

270nF - 330nF

220pF - 470nF

-

-

220pF - 470nF

-

-

560nF - 1.0μF

1kV

AEC-Q200

150pF - 100nF

-

-

120nF - 180nF

220pF - 180nF

-

-

220pF - 180nF

-

-

220nF - 470nF

Standard

150pF - 100nF

-

-

120nF - 180nF

220pF - 180nF

-

-

220pF - 180nF

-

-

220nF - 470nF

1.2kV

AEC-Q200

150pF - 39nF

-

-

(47nF - 100nF)

220pF - 68nF

-

-

220pF - 82nF

-

-

(100nF - 220nF)

Standard

150pF - 39nF

-

-

(47nF - 100nF)

220pF - 68nF

-

-

220pF - 82nF

-

-

(100nF - 220nF)

1.5kV

AEC-Q200

150pF - 39nF

-

-

(47nF - 56nF)

220pF - 68nF

-

-

220pF - 82nF

-

-

(100nF - 150nF)

Standard

150pF - 39nF

-

-

(47nF - 56nF)

220pF - 68nF

-

-

220pF - 82nF

-

-

(100nF - 150nF)

2kV

AEC-Q200

150pF - 10nF

12nF - 18nF

-

-

220pF - 10nF

12nF - 22nF

-

220pF - 27nF

-

-

(33nF - 100nF)

Standard

150pF - 10nF

12nF - 18nF

-

-

220pF - 10nF

12nF - 22nF

-

220pF - 33nF

-

-

(39nF - 100nF)

2.5kV

AEC-Q200

150pF - 3.3nF

3.9nF - 10nF

-

-

220pF - 6.8nF

8.2nF - 18nF

-

220pF - 8.2nF

10nF - 22nF

-

-

Standard

150pF - 3.3nF

3.9nF - 10nF

-

-

220pF - 6.8nF

8.2nF - 18nF

-

220pF - 8.2nF

10nF - 22nF

-

-

3kV

AEC-Q200

150pF - 2.7nF

3.3nF - 4.7nF

-

-

220pF - 3.9nF

4.7nF - 10nF

-

220pF - 6.8nF

8.2nF - 15nF

-

-

Standard

150pF - 2.7nF

3.3nF - 4.7nF

-

-

220pF - 3.9nF

4.7nF - 10nF

-

220pF - 6.8nF

8.2nF - 15nF

-

-

4kV*

AEC-Q200

150pF - 2.2nF

-

-

-

1.0nF - 2.2nF

-

-

220pF - 4.7nF

5.6nF - 6.8nF

-

-

Standard

150pF - 2.2nF

2.7nF - 3.3nF

-

-

220pF - 2.2nF

-

-

220pF - 4.7nF

5.6nF - 6.8nF

-

-

5kV*

Standard

150pF - 1.2nF

-

-

-

220pF - 1.8nF

-

-

220pF - 3.9nF

4.7nF - 4.7nF

-

-

6kV*

Standard

150pF - 1.0nF

-

-

-

220pF - 1.5nF

-

-

220pF - 2.2nF

-

-

-

8kV*

Standard

-

-

-

-

-

-

-

-

-

-

-

10kV*

Standard

-

-

-

-

-

-

-

-

-

-

-

12kV*

Standard

-

-

-

-

-

-

-

-

-

-

-

Notes: 
1 ) *Parts rated 4kV and above may require conformal coating post soldering.
2) “Conformal Coating” identifies parts that must be conformally coated after mounting to  

       

    prevent flashover, especially between the board and the component.
3) Suffix codes WS2 and WS3 relate to StackiCap™ high capacitance parts. WS3 parts (shown in   

      

    parentheses) must be conformally coated after mounting, especially between the board and the component.

4)  Parts in this range may be dual use under export control legislation and as such may 
     be subject to export license restrictions. Please refer to page 15 for more 
     information on the dual-use regulations and contact the Knowles Precision Devices sales office for  
     further information on specific part numbers.
5)  Standard parts are normally ordered using the Syfer order code system (see page 26), but are also  
      available as Novacap parts using dielectric code RB (see page 25). Note the RB nomenclature is being  
      phased out and is not recommended for new designs, rather the Syfer brand part number should  
      be used.

 

32

X7R (2R1) 

—

 AEC-Q200 and Standard Ranges

X7R(2R1)

2225

3640

5550

8060

Maximum Thickness (T)

2.5mm

2.5mm

4.0mm

2.5mm

4.5mm

2.5mm

2.5mm

Special Requirements

-

Conformal 

Coating

-

-

Suffix Code WS2 

(WS3)

-

-

16V

AEC-Q200

-

-

-

-

-

-

-

Standard

330pF - 6.8μF

-

-

-

-

-

-

25V

AEC-Q200

-

-

-

-

-

-

-

Standard

330pF - 5.6μF

-

-

-

-

-

-

50/ 63V

AEC-Q200

330pF - 3.3μF

-

-

470pF - 4.7μF

-

-

-

Standard

330pF - 3.3μF

-

-

470pF - 10μF

-

1.0nF - 15

μ

F

2.2nF - 22

μ

F

100V

AEC-Q200

330pF - 2.2μF

-

-

470pF - 3.3μF

-

-

-

Standard

330pF - 2.7μF

-

-

470pF - 5.6μF

-

1.0nF - 10

μ

F

2.2nF - 15

μ

F

200

AEC-Q200

330pF - 1.5μF

-

1.8μF - 2.2μF

470pF - 1.5μF

-

-

-

Standard

330pF - 1.5μF

-

1.8μF - 2.2μF

470pF - 3.3μF

3.9μF - 5.6μF

1.0nF - 5.6μF

2.2nF - 10μF

250V

AEC-Q200

330pF - 1.5μF

-

1.8μF - 2.2μF

470pF - 1.5μF

-

-

-

Standard

330pF - 1.5μF

-

1.8μF - 2.2μF

470pF - 3.3μF

3.9μF - 5.6μF

1.0nF - 5.6μF

2.2nF - 10μF

500V

AEC-Q200

330pF - 1.0μF

-

-

470pF - 1.0μF

-

-

-

Standard

330pF - 1.0μF

-

-

470pF - 1.0μF

1.2μF - 2.7μF

1.0nF - 1.8μF

2.2nF - 3.3μF

630V

AEC-Q200

330pF - 680nF

-

-

470pF - 680nF

-

-

-

Standard

330pF - 680nF

-

-

470pF - 680nF

820nF - 2.2μF

1.0nF - 1.2μF

2.2nF - 2.2μF

1kV

AEC-Q200

330pF - 220nF

-

-

470nF - 180nF

220nF - 1.0μF

-

-

Standard

330pF - 220nF

-

-

470pF - 180nF

220nF - 1.0μF

1.0nF - 390nF

2.2nF - 1.0μF

1.2kV

AEC-Q200

330pF - 100nF

-

-

470pF - 150nF

-

-

-

Standard

330pF - 100nF

-

-

470pF - 150nF

(180nF - 470nF)

1.0nF - 220nF

2.2nF - 470nF

1.5kV

AEC-Q200

330pF - 100nF

-

-

470pF - 100nF

-

-

-

Standard

330pF - 100nF

-

-

470pF - 100nF

(120nF - 330nF)

1.0nF - 150nF

2.2nF - 330nF

2kV

AEC-Q200

330pF - 47nF

-

-

470pF - 47nF

-

-

-

Standard

330pF - 47nF

-

-

470pF - 47nF

(56nF - 150nF)

1.0nF - 82nF

2.2nF - 150nF

2.5kV

AEC-Q200

330pF - 12nF

15nF - 33nF

-

470pF - 22nF

-

-

-

Standard

330pF - 12nF

15nF - 33nF

-

470pF - 33nF

-

1.0nF - 68nF

2.2nF - 100nF

3kV

AEC-Q200

330pF - 8.2nF

10nF - 18nF

-

470pF - 18nF

-

-

-

Standard

330pF - 8.2nF

10nF - 18nF

-

470pF - 22nF

-

1.0nF - 47nF

2.2n - 82nF

4kV*

AEC-Q200

2.2nF - 5.6nF

6.8nF - 10nF

-

-

-

-

-

Standard

330pF - 5.6nF

6.8nF - 10nF

-

470pF - 6.8nF

-

1.0nF - 15nF

2.2nF - 33nF

5kV*

Standard

330pF - 4.7nF

-

-

470pF - 5.6nF

-

1.0nF - 10nF

2.2nF - 22nF

6kV*

Standard

330pF - 2.7nF

-

-

470pF - 4.7nF

-

1.0nF - 8.2nF

2.2nF - 15nF

8kV*

Standard

-

-

-

470pF - 1.5nF

-

1.0nF - 4.7nF

2.2nF - 6.8nF

10kV*

Standard

-

-

-

470pF - 1.0nF

-

1.0nF - 2.2nF

2.2nF - 4.7nF

12kV*

Standard

-

-

-

470pF - 820pF

-

1.0nF - 1.2nF

2.2nF - 2.2nF

16V TO 12KV

CONTINUED

Notes: 
1) *Parts rated 4kV and above may require conformal coating post soldering.
2) “Conformal Coating” identifies parts that must be conformally coated after mounting to  

     

    prevent flashover, especially between the board and the component.
3) Suffix codes WS2 and WS3 relate to StackiCap™ high capacitance parts. WS3 parts (shown in   

     

    parentheses) must be conformally coated after mounting, especially between the board and  the component.

4) Parts in this range may be dual use under export control legislation  

     

    and as such may be subject to export license restrictions. Please refer to  
    page 15 for more information on the dual-use regulations and contact the 
    Knowles Precision Devices sales office for further information on specific 
    part numbers.
5) Standard parts are normally ordered using the Syfer order code system (see  

        

    page 26), but are also available as Novacap parts using dielectric code RB (see  
    page 25). Note the RB nomenclature is being phased out and is not recommended   
    for new designs, rather the Syfer brand part number should be used.

 

33

Ordering Information 

— 

AEC-Q200 and Standard Ranges

0805

Y

100

0103

K

S

T

---

Chip Size

Termination

Voltage

Capacitance in 

Picofarads (pF)

Capacitance

Tolerance

Dielectric 

Release Codes

Packaging

Suffix Code

0603
0805

1206

1210

1808

1812

1825

2220
2225
3640

Y = FlexiCap

TM

 termination base with Ni barrier 

(100% matte tin plating). 

RoHS compliant.

H = FlexiCap

TM

 termination base with Ni barrier 

(Tin/lead plating with min. 10% lead). 

Not RoHS compliant.

J = Nickel barrier (100% matte tin plating). 

RoHS compliant. Lead free. 

A = Nickel barrier (Tin/lead plating with

 min. 10% lead). Not RoHS compliant

Note: X7R (2R1) to  AEC-Q200 is 

only available in Y or H  termination.

016 = 16V

025 = 25V
050 = 50V
063 = 63V

100 = 100V

200 = 200V
250 = 250V
500 = 500V

630 = 630V

1K0 = 1kV

1K2 = 1.2kV
1K5 = 1.5kV

2K0 = 2kV

2K5 = 2.5kV

3K0 = 3kV

First digit is 0.

Second and third digits 

are significant figures of 

capacitance code.

The fourth digit is number 

of zeros following

Example: 0103 = 10nF

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

Note:

X7R (2R1) parts are

available in J, K & M

tolerances only.

A = C0G/NP0 (1B)

to AEC-Q200 

—

original

K = C0G/NP0 (1B)

to AEC-Q200 

—

recommended

E = X7R (2R1) to

AEC-Q200 

—

 original

S = X7R (2R1)

to AEC-Q200 

—

recommended

T = 178mm

(7") reel

R = 330mm

(13") reel

B = Bulk

pack 

—

 tubs

 or trays

For StackiCap™ 

parts only: 

WS2

WS3

1210

Y

200

0103

K

C

T

---

Chip Size

Termination

Voltage

Capacitance in 

Picofarads (pF)

Capacitance

Tolerance

Dielectric 

Release Codes

Packaging

Suffix Code

0402
0603
0805

1206

1210

1808

1812

1825

2220
2225
3640
5550
8060

Y = FlexiCap

TM

termination base with Ni

barrier (100% matte tin

plating). RoHS compliant.

H = FlexiCap

TM

termination base with Ni

barrier (Tin/lead plating

with min. 10% lead).

Not RoHS compliant.

J = Nickel barrier

(100% matte tin plating).

RoHS compliant. Lead free.

A = Nickel barrier (Tin/

lead plating with min. 10% lead).

Not RoHS compliant.

010 = 10V
016 = 16V

025 = 25V
050 = 50V
063 = 63V

100 = 100V

200 = 200V
250 = 250V
500 = 500V

630 = 630V

1K0 = 1kV

1K2 = 1.2kV
1K5 = 1.5kV

2K0 = 2kV

2K5 = 2.5kV

3K0 = 3kV
4K0 = 4kV
5K0 = 5kV
6K0 = 6kV
8K0 = 8kV

10K = 10kV
12K = 12kV

First digit is 0.

Second and third digits 

are significant figures of 

capacitance code.

The fourth digit is

number of zeros

following

Example:0103 = 10nF

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

Note:

X7R (2R1) parts are

available in J, K & M

tolerances only.

C = C0G/NP0 (1B)

X = X7R (2R1)

T = 178mm

(7") reel

R = 330mm

(13") reel

B = Bulk

pack 

—

 tubs

or trays

For StackiCap™ 

parts only: 

WS2

WS3

ORDERING INFORMATION 

—

 AEC-Q200 RANGES

ORDERING INFORMATION 

—

 STANDARD RANGES

Notes: 
1) Suffix code WS3 applies to StackiCap™ parts rated ≥1.2kV, and indicates conformal coating is required   
   after mounting. For StackiCap™ parts rated <1.2kV, use suffix WS2.  
2) Standard parts are normally ordered using the Syfer order code system (see page 26), but are also  
    available as Novacap parts using dielectric codes RN and RB (see page 25). Note the RN and RB  
    nomenclature is being phased out and is not recommended for new designs, rather the Syfer brand  
    part number should be used.

Note: Suffix code WS3 applies to StackiCap™ parts rated ≥1.2kV, and indicates conformal coating is required after mounting. For StackiCap™ parts rated <1.2kV, use suffix WS2.  

Novacap Range (Lead-Containing)

C0G/NP0 (1B) NOVACAP BRAND N RANGE 

—

 CAPACITANCE VALUES

 

34

Order using Novacap dielectric code N (see page 25). Lead-free alternatives are available using Syfer Brand.

C0G/NP0 (1B)

0402

0504

0603

0805

1005

1206

1210

1515

1808

1812

1825

Max. T.

Min. Cap.

16V

25V

50V

100V

200V

250V

300V

400V

500V

600V

800V

1000V

1500V

2000V

3000V

4000V

5000V

0.6mm

0.3pF

270pF

220pF

180pF

180pF

100pF

56pF

-

-

-

-

-

-

-

-

-

-

-

1.12mm

0.5pF

2.2nF

1.8nF

1.5nF

1.5nF

820pF

560pF

-

-

-

-

-

-

-

-

-

-

-

0.89mm

0.3pF

1.5nF

1.2nF

1.0nF

1.0nF

560pF

330pF

-

-

-

-

-

-

-

-

-

-

-

1.37mm

0.5pF

5.6nF

4.7nF

3.9nF

3.9nF

1.8nF

1.5nF

820pF

820pF

820pF

680pF

680pF

470pF

-

-

-

-

-

1.37mm

0.5pF

8.2nF

6.8nF

5.6nF

5.6nF

2.7nF

2.2nF

1.2nF

1.2nF

1.2nF

1.0nF

1.0nF

390pF

-

-

-

-

-

1.63mm

3.3pF

15nF

12nF

12nF

10nF

5.6nF

3.9nF

2.7nF

1.8nF

1.8nF

1.5nF

1.5nF

1.0nF

560pF

390pF

-

-

-

1.65mm

5.6pF

27nF

27nF

22nF

18nF

10nF

8.2nF

4.7nF

4.7nF

3.9nF

3.3nF

3.3nF

2.2nF

1.2nF

820pF

-

-

-

3.3mm

3.3pF

47nF

39nF

33nF

33nF

22nF

22nF

15nF

10nF

8.2nF

6.8nF

6.8nF

5.6nF

3.9nF

2.7nF

1.2nF

680pF

-

1.65mm

5.6pF

39nF

33nF

22nF

15nF

10nF

6.8nF

4.7nF

4.7nF

4.7nF

3.9nF

3.9nF

2.2nF

1.2nF

820pF

390pF

220pF

-

2.03mm

5.6pF

39nF

33nF

27nF

22nF

15nF

10nF

5.6nF

4.7nF

4.7nF

4.7nF

4.7nF

3.3nF

1.8nF

1.2nF

470pF

270pF

-

1.65mm

10pF

56nF

56nF

39nF

27nF

18nF

15nF

10nF

10nF

10nF

8.2nF

8.2nF

4.7nF

2.7nF

1.8nF

820pF

470pF

-

2.5mm

10pF

56nF

56nF

39nF

39nF

27nF

22nF

15nF

12nF

12nF

10nF

10nF

8.2nF

4.7nF

2.7nF

1.2nF

820pF

-

2.03mm

15pF

100nF

100nF

100nF

68nF

47nF

39nF

22nF

22nF

22nF

18nF

18nF

10nF

5.6nF

2.7nF

1.2nF

680pF

390pF

3.56mm

15pF

100nF

100nF

100nF

82nF

68nF

56nF

47nF

33nF

27nF

18nF

18nF

15nF

10nF

5.6nF

2.2nF

1.2nF

820pF

C0G/NP0 (1B)

2020

2221

2225

2520

3333

3530

4040

4540

5440

5550

6560

7565

Max. T.

Min. Cap.

16V

25V

50V

100V

200V

250V

300V

400V

500V

600V

800V

1000V

1500V

2000V

3000V

4000V

5000V

6000V

7000V

8000V

9000V

10000V

4.57mm

27pF

68nF

68nF

68nF

56nF

56nF

47nF

39nF

33nF

27nF

15nF

15nF

10nF

8.2nF

4.7nF

2.2nF

1.2nF

820pF

-

-

-

-

-

2.03mm

27pF

100nF

100nF

100nF

68nF

47nF

39nF

22nF

22nF

22nF

18nF

18nF

10nF

5.6nF

2.7nF

1.2nF

680pF

390pF

-

-

-

-

-

2.03mm

27pF

120nF

120nF

120nF

82nF

56nF

47nF

27nF

27nF

27nF

27nF

27nF

15nF

8.2nF

3.9nF

1.8nF

1.0nF

560pF

-

-

-

-

-

3.81mm

27pF

120nF

120nF

120nF

100nF

82nF

68nF

56nF

39nF

33nF

27nF

27nF

22nF

15nF

8.2nF

3.3nF

1.8nF

1.2nF

-

-

-

-

-

4.57mm

39pF

100nF

100nF

100nF

82nF

68nF

56nF

47nF

39nF

39nF

22nF

18nF

12nF

10nF

5.6nF

2.7nF

1.5nF

1.0nF

-

-

-

-

-

6.35mm

39pF

180nF

180nF

150nF

120nF

100nF

100nF

82nF

56nF

47nF

39nF

33nF

27nF

18nF

15nF

8.2nF

3.3nF

2.2nF

1.8nF

-

-

-

-

6.35mm

39pF

180nF

180nF

180nF

150nF

120nF

120nF

100nF

82nF

68nF

39nF

33nF

27nF

22nF

15nF

10nF

5.6nF

3.3nF

1.8nF

1.2nF

1.0nF

820pF

680pF

7.62mm

39pF

330nF

330nF

270nF

220nF

180nF

180nF

150nF

120nF

100nF

82nF

56nF

56nF

39nF

27nF

18nF

12nF

6.8nF

3.9nF

2.7nF

2.2nF

1.5nF

1.2nF

7.62mm

39pF

330nF

330nF

330nF

270nF

220nF

180nF

180nF

150nF

120nF

82nF

68nF

56nF

39nF

33nF

22nF

12nF

8.2nF

3.9nF

2.7nF

2.2nF

1.8nF

1.5nF

7.62mm

39pF

390nF

390nF

390nF

270nF

270nF

220nF

220nF

180nF

150nF

100nF

82nF

68nF

39nF

33nF

22nF

12nF

8.2nF

4.7nF

3.3nF

2.7nF

1.8nF

1.5nF

7.62mm

39pF

390nF

390nF

390nF

270nF

270nF

220nF

220nF

180nF

180nF

150nF

120nF

100nF

56nF

47nF

33nF

18nF

12nF

5.6nF

4.7nF

3.3nF

2.7nF

2.2nF

7.62mm

56pF

680nF

680nF

680nF

470nF

470nF

390nF

390nF

330nF

270nF

220nF

180nF

150nF

82nF

68nF

47nF

27nF

18nF

10nF

6.8nF

5.6nF

3.9nF

3.3nF

7.62mm

100pF

820nF

820nF

820nF

560nF

560nF

470nF

470nF

390nF

330nF

270nF

220nF

180nF

120nF

100nF

68nF

39nF

22nF

12nF

8.2nF

6.8nF

4.7nF

3.9nF