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SBSPDatasheet Issue 4 (P109792) Release Date 04/11/14 Page 1 of 3

Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer

SBSP

Surface Mount EMI Filters

1206

3.2 ± 0.3

(0.126 ± 0.012)

1.6 ± 0.3

(0.063 ± 0.012)

1.6 ± 0.2

(0.063 ± 0.008)

0.95 ± 0.3

(0.037 ± 0.012)

0.5 ± 0.25

(0.02 ± 0.01)

Type

SBSPP

Chip Size

1206

Max Current

Rated

Voltage

Dielectric

Minimum and

maximum

capacitance

values

25Vdc

C0G/NP0

X7R

100nF-150nF

50Vdc

C0G/NP0

X7R

22nF-68nF

100Vdc

C0G/NP0

22pF-470pF

X7R

1nF-15nF

Effects of mounting method on insertion loss

C and Pi filters are mounted to PCBs and soldered in identical manner to chip capacitors. Solder connections made to each end (signal lines) and

each side band (earth track).
Whilst SBSG, SBSM and SBSP filters can be mounted conventionally on PCBs, they are also suitable for mounting in a wall or partition on a board.
This greatly improves the screening between filter input and output, thereby enhancing the high frequency response.
The following insertion loss curves (for SBSP, SBSG, SBSM Pi filters), based on actual measurements, show the effect. It can be seen that the filters
conventionally mounted (Fig. 1) exhibit a drop in attenuation at higher frequencies. Improved shielding methods (Fig. 2), maintain excellent
suppression characteristics to 1GHz and above. See below for application example.

SBSPDatasheet Issue 4 (P109792) Release Date 04/11/14 Page 2 of 3

Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer

Insertion loss tables for surface mount EMI filters - Pi filter

Typical No-Load Insertion Loss (dB)*

Product Code

Packing

Capacitance

(±20%)

Dielectric

Rated

Voltage

(dc)

DWV

(dc)

Approximate

Resonant

Frequency

(MHz)

10M

100M

SBSPP1000220MC

B = Bulk P

ack

T = Tape-a

nd-Reel (178mm / 7”

reels)

R = Tape-an

-Reel (330mm / 13”

reels)

22pF

C0G

100

250

1000

SBSPP1000470MC

47pF C0G

100 250

620

0 0 0 4 16

SBSPP1000101MC

100pF

C0G

100

250

400

SBSPP1000221MC

220pF C0G

100 250

260

0 0 1 14 12

SBSPP1000471MC

470pF

C0G

100

250

180

SBSPP1000102MX

1.0nF X7R

100 250

120

0 0 4 37 16

SBSPP1000152MX

1.5nF

X7R

100

250

SBSPP1000222MX

2.2nF X7R

100 250

0 0 9 37

SBSPP1000332MX

3.3nF

X7R

100

250

SBSPP1000472MX

4.7nF X7R

100 250

0 2 14 37

SBSPP1000682MX

6.8nF

X7R

100

250

SBSPP1000103MX

10nF X7R

100 250

0 5 24 37

SBSPP1000153MX

15nF

X7R

100

250

SBSPP0500223MX

22nF X7R

125

21 0

SBSPP0500333MX

33nF

X7R

125

SBSPP0500473MX

47nF X7R

50 125

13 2

SBSPP0500683MX

68nF

X7R

125

SBSPP0250104MX 100nF

X7R

67.5

8.5 6

SBSPP0250154MX

150nF

X7R

67.5

* - Insertion Loss performance quoted is measured on an open board mounted on a brass backplane in a 50

Ω

system. Performance curves can be supplied on request. Performance in

circuit is liable to be different and is affected by board material, track layout, grounding efficiency and circuit impedances. Shielding can be used to improve high frequency
performance.

Ordering Information

SBS

500

0473

Type

Size

Configuration

Rated Voltage

Capacitance in Pico farads (pF)

Tolerance

Dielectric

Packaging

Surface

mount board

filter

P = 1206

= Pi Section

050 = 50Vdc

100 = 100Vdc
200 = 200Vdc
500 = 500Vdc

First digit is 0.

Second and third digits are significant

figures of capacitance code. The fourth

digit is number of zeros following.

Example:

0473

= 47nF

M = ±20%

X = X7R

T=178mm

(7”) reel

R=330mm

(13”) reel

B = Bulk

Reeled Quantities

178mm (7”) reel

1206

330mm (13”) reel

1206

1500

6000

SBSPDatasheet Issue 4 (P109792) Release Date 04/11/14 Page 3 of 3

Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer

Surface mount and panel mount solder-in filters

Solder pad layouts are included with the detailed information
for each part.

Recommended soldering profile

Soldering of filters

The soldering process should be controlled such that the filter
does not experience any thermal shocks which may induce
thermal cracks in the ceramic dielectric.
The pre-heat temperature rise of the filter should be kept to
around 2°C per second. In practice successful temperature
rises tend to be in the region of 1.5°C to 4°C per second
dependent upon substrate and components.
The introduction of a soak after pre-heat can be useful as it
allows temperature uniformity to be established across the
substrate thus preventing substrate warping. The magnitude
or direction of any warping may change on cooling imposing
damaging stresses upon the filter.
E01, E03, E07 SBSP ranges are compatible with all standard
solder types including lead-free, maximum temperature

260°C. For SBSG, SBSM and SFSS ranges, solder time should
be minimised, and the temperature controlled to a maximum
of 220°C. For SFSR, SFST and SFSU ranges the maximum
temperature is 250°C.
Cooling to ambient temperature should be allowed to occur
naturally. Natural cooling allows a gradual relaxation of
thermal mismatch stresses in the solder joints. Draughts
should be avoided. Forced air cooling can induce thermal
breakage, and cleaning with cold fluids immediately after a
soldering process may result in cracked filters.
Note: The use of FlexiCap™ terminations is strongly
recommended to reduce the risk of mechanical cracking.

Soldering to axial wire leads
Soldering temperature

The tip temperature of the iron should not exceed 300°C.

Dwell time

Dwell time should be 3-5 seconds maximum to minimise the
risk of cracking the capacitor due to thermal shock.

Heat sink

Where possible, a heat sink should be used between the solder
joint and the body, especially if longer dwell times are
required.

Bending or cropping of wire leads

Bending or cropping of the filter terminations should not be
carried out within 4mm (0.157”) of the epoxy encapsulation,
the wire should be supported when cropping.

A more comprehensive application note covering
installation of all Syfer products is available on the
Syfer website.