Microsemi_Aerospace_Integrated_Power

Increasing Use of Electronics in Electrical Actuation & Motor Drive Systems

The Microsemi technologies underlying the Integrated Power Solutions™ product portfolio have been used in all major
commercial, military, and space platforms for decades. With our broad product and capability portfolio and a proven track record
of success, we are well-positioned as a key partner in high-reliability applications.
We continue to leverage our technology and capabilities in the aerospace power segment to offer lighter and more efficient
solutions with increasing levels of reliability.
Microsemi has evolved to become a leading-edge power and motor drive solutions provider for the most demanding aerospace
applications.

Recent technological advancements in the field of wide band gap SiC power electronics have initiated the replacement of
hydraulic actuators with lighter electro-hydrostatic and electro-mechanical actuators in flight control systems for fuel savings
through weight reduction. These features are also advantageous for space thrust vector control, where excess weight can cost a
launch system up to $10,000/kg.
The key technology drivers for high-reliability electrical motor drive systems will continue to be lower weight, higher reliability,
improved power efficiency and thermal management.
Microsemi’s growing capability as an integrated power solutions provider offers the best cost-of-ownership for our customers
and partners. We offer fully integrated state-of-the-art power, hybrid, and digital and mixed-signal technologies to offer highly
integrated, high-reliability, flexible and scalable solutions for different applications.

Applications

• Flight control actuation systems
• Thrust vector control
• Pumps
• Landing gear
• Missile actuation

Microsemi Benefits

• Fully integrated solution capabilities
• System size and weight reduction
• Reduced time to market through

qualified design building blocks

• SiC or IGBT based solutions
• Flight-proven building blocks available
• Available in both standard and custom

packages

Heritage

• Commercial aviation
• Space launch systems
• Military aviation
• Missiles

Qualification and Reliability

• DO-160
• DO-254
• Extensive life and HALT testing
• Partial discharge tested

Motor Drive Power Solution

High-Reliability Aerospace and Defense Heritage

Increasing Use of Electronics in Electrical Actuation & Motor Drive Systems

System Solutions to Components

Heritage

• Commercial aviation
• Space launch systems
• Military aviation
• Missiles

Qualification and Reliability

• DO-160
• DO-254
• Extensive life and HALT testing
• Partial discharge tested

Features

• Schottky Barrier Diodes (SBD) and MOSFETs

700 V, 1200 V, and 1700 V

• AEC-Q101 qualified
• Designed for Extreme Ruggedness

High repetitive unclamped inductive switching (UIS) rating

High short circuit rating 3 – 5 µs) for MOSFETs

Benefits

• Improved power density over IGBT Si solutions
• Higher efficiency and size reduction

Rugged Next Generation Silicon Carbide (SiC) Components

Microsemi’s next-generation Silicon Carbide (SiC) semiconductors are designed for extreme ruggedness.
For more information visit

www.microsemi.com/sic

Power Modules

Microsemi’s aerospace-grade power modules provide the capability to exponentially increase power density through hybrid integration.
For more information visit

www.microsemi.com/sicmodules

Power Core Module

The power core module (PCM) combines our hybrid power drive (HPD) with our control/telemetry platform to create highly integrated
solutions for high-reliability actuation and motor drive applications. Our customers use this platform with their control and health
monitoring expertise, resulting in weight reduction for many critical applications. For more information visit

www.microsemi.com/pcm

Hybrid Power Drive

The hybrid power drive (HPD) includes a three-phase power stage, drive and bias circuitry, and telemetry monitoring. The HPD is available
in various configurations, power levels, and form factors. For more information visit

www.microsemi.com/hpd

Features

• AlSiC baseplate for enhanced thermal cycling
• DBC on AIN or AMB on Si

substrate

•  Aerospace grade silicone gel coating (–60°C to 125°C)
•  Various power topology options available using SiC or IGBT
•  Low profile, low inductance solutions

Benefits

•  Improved reliability and thermal conductivity
•  40% lower weight
•  High-speed switching capability

Features

•  PWM control and telemetry integrated with HPD
•  LVDS interface
•  Greater than 99% efficiency
•  High frequency power switching
•  3-phase bridge topology
•  SiC MOSFET or IGBT solutions

Benefits

•  Highly integrated motor drive solution
•  Qualified using DO-160 test standards
•  Reduced weight and solution size
•  Reduced system cost and shorter time to market

Features

•  540 V or 270 VDC operation
•  Up to 20 kVA
•  SiC MOSFET or IGBT-based solutions
•  Various signal and power interface options
•  Optional solenoid drive and regeneration capability
•  Hall effect or shunt current sensing
•  Integrated temperature sensing

Benefits

•  Integrated gate drive and power stage
•  Qualified using DO-160 test standards
•  Leveraging 10M+ flight hours of power hybrid technology
•  100% partial discharge tested

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trademarks of Microsemi Corporation. All other

trademarks and service marks are the property of

their respective owners.

Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any

particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold

hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment

or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other

testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters

provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information

provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer.

Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself

or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any

changes to the information in this document or to any products and services at any time without notice.

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace

& defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened

analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization

devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete

components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products;

Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is

headquartered in Aliso Viejo, California and has approximately 4,800 employees globally. Learn more at www.microsemi.com.

Microsemi Corporate Headquarters

One Enterprise, Aliso Viejo, CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100
Fax: +1 (949) 215-4996
Email: sales.support@microsemi.com
www.microsemi.com

Aerospace Integrated Power Solutions 05-18

For more information, please email

AerospaceIPS@microsemi.com

Power Core Module (PCM) –

www.microsemi.com/pcm

Hybrid Power Drive (HPD) –

www.microsemi.com/hpd

Our Aerospace Integrated Power Solutions team can also
provide custom solutions using our flight-qualified high-reliability
building blocks. Example customization options:

• Higher power scalability
• Inrush current protection
• Various power stage topologies
• Regeneration and/or solenoid drive
• Various signal and power interface options
• Various approaches to health monitoring (current, voltage,

and temperature)

Evaluation Kit Available

Flexible Integrated Power Solutions