Murata_Chip_Monolithic_Ceramic_Capacitors_for

Cat.No.C03E

Murata
Manufacturing Co., Ltd.

Chip Monolithic
Ceramic Capacitors
for Automotive

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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

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Part Numbering

Selection Guide of Chip Monolithic Ceramic Capacitors

for Automotive GCM Series

Temperature Compensating Type GCM15/18/21/31 Series

High Dielectric Constant Type GCM15/18/21/31/32 Series

Specifications and Test Methods

Package

Caution

Notice

CONTENTS

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Recycled Paper

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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

(Part Number)

Product ID

Series

Chip Monolithic Ceramic Capacitors

Automotive Tin Plated Layer

Product ID

Code

Series

102

A01

Dimension (L

Code

1.0

0.5 mm

1.6

0.8 mm

2.0

1.25 mm

3.2

1.6 mm

3.2

2.5 mm

Dimension (L

0402

0603

0805

1206

1210

EIA

1.25 mm

1.6 mm

2.0 mm

2.5 mm

1.15 mm

1.35 mm

1.8 mm

Depends on individual standards.

Dimension (T)

Code

0.5 mm

0.6 mm

0.8 mm

0.85 mm

Dimension (T)

Continued on the following page.

Part Numbering

-55 to 125

15%

22%

X7R

X7S

-55 to 125

Temperature Characteristics

Code

-55 to 125

Temperature

Range

30ppm/

Capacitance Change or
Temperature Coefficient

C0G

Temperature

Characteristics

-55 to 125

Operating

Temperature Range

Capacitance

Expressed by three figures. The unit is pico-farad (pF). The first
and second figures are significant digits, and the third figure
expresses the number of zeros which follow the two numbers.
If there is a decimal point, it is expressed by the capital letter "

In this case, all figures are significant digits.

R50

1R0

100

103

Ex.)

0.5pF

1.0pF

10pF

10000pF

Code

Capacitance

Capacitance Tolerance

Code

GCM

Series

∆

X7R

0.25pF

0.5pF

10%

20%

Capacitance Tolerance

5pF

6.0 to 9.0pF

10pF

* 1pF

E24 Series

Capacitance Step

E12 Series

E6 Series

E24 series is also available.

Rated Voltage

DC4V

DC6.3V

DC10V

DC16V

DC25V

DC50V

DC100V

DC200V

Code

Rated Voltage

Expressed by three figures.

Individual Specification Code

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Continued from the preceding page.

Packaging

Code

ø178mm Plastic Taping

ø178mm Paper Taping

ø330mm Plastic Taping

ø330mm Paper Taping

ø178mm Special Packaging

ø330mm Special Packaging

Bulk

Bulk Case

Bulk Tray

Packaging

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

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Selection Guide of Chip Monolithic Ceramic Capacitors

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Power-train equipment

Comfort equipment
Security equipment

Safety equipment

Entertainment equipment

Information

Automotive PC

Start

Application

Function and Circuit

For other automotive equipment such as comfort, security, information,

entertainment, GRM series (for general electronics) are available.

General Electronics

Specific Applications

Oscillation Circuit

Temperature

Compensation

Synchronize Circuit

Filtering

Soldering Electrode

C0G Char.

GRM_5C Series

0.5pF–0.1

Capacitor Arrays

C0G Char.

GNM_5C Series

10pF–360pF

Soldering Electrode

for Temperature

Compensation

GRM_ Series

0.5pF–0.1

Capacitor Arrays

for Temperature

Compensation

GNM_5C Series

10pF–360pF

Soldering Electrodes

Y5V Char.

GRM_F5 Series

2200pF–10

Soldering Electrode

X5R/X7R Char.

GRM_R6, R7 Series

220pF–10

High Frequency/

High Power Type

Soldering Electrode

ERF Series

0.75pF–1000pF

High Frequency Type

ERA Series

0.75pF–1000pF

High Frequency

Ribbon Terminal Type

ERD Series

0.75pF–1000pF

High Frequency

for Flow/Reflow

Soldering

GQM Series

0.5pF–100pF

Soldering Electrode

C0G/C0H Char.

GRM_6C Series

0.5pF–47000pF

Microchip Y5V Char.

GMA_F5 Series

4700pF–0.1

Capacitor Arrays

Y5V Char.

GNM_F5 Series

22000pF–0.15

Low-ESL Y5V Char.

LLL_F5 Series

22000pF–0.68

De-coupling

Bypassing

Time Constant Circuits

Coupling

High Frequency

Automotive ( Power-train, Safety equipment )

GCM Series*

0.5pF–10

Ultra Thin Circuit

Medium Voltage

Safety Standard

Recognized

630V/1kV/2kV/3.15kV

Low-dissipation

GRM Series

10pF–1000pF

Capacitor Arrays

GNM Series

390pF–1.0

Thin type Soldering

Electrode

GRM15X Series

0.5pF–4700pF

Low Dissipation

GJM Series

0.5pF–18pF

Ultrasonic Sensors

ZLM Char.

GRM2199E Series

1000pF/1500pF

Low ESL

LLL Series

2200pF–1.0

250V/630V/1kV

High-capacitance

GRM Series

220pF–1

2kV

Only for

Telecommunication

Devices

GR4 Series

100pF–4700pF

AC250V which meet

Japanese Law

GA2 Series

470pF–0.1

UL/IEC

Safety Standard

Recognized

GA3 Series

10pF–33000pF

High Frequency/

High Power

Ribbon Terminal Type

ERH Series

0.75pF–1000pF

Thin Layer

Large Capacitance Type

X5R Char.

GRM_R6 Series

47000pF–100

Microchip

GMA_R7 Series

470pF–10000pF

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Chip Monolithic Ceramic Capacitors for Automotive

for Automotive GCM Series

■

Features

1. The GCM series meet AEC-Q200 requirements.

2. The GCM series is lead free product.

3. The GCM series is a complete line of chip ceramic

capacitors in 16V, 25V, 50V and 100V ratings.

These capacitors have temperature characteristics

of C0G and X7R.

4. A wide selection of sizes is available, from

miniature LxWxT: 1.0x0.5x0.5mm to

LxWxT: 3.2x2.5x2.5mm.

5. Stringent dimensional tolerances allow highly

reliable, high speed automatic chip replacement on

PCBs.

6. The GCM series is available in paper or plastic

embossed tape and reel packaging for automatic

placement.

■

Applications

Automotive electronic equipment (Power-train, safety

equipment)

Bulk Case : 1.6

0.07(L)

0.8

0.07(W)

0.8

0.07(T)

Part Number

Dimensions (mm)

g min.

GCM033
GCM155
GCM188*
GCM216
GCM219
GCM21B
GCM319
GCM31M
GCM31C
GCM32N
GCM32R
GCM32D
GCM32E
GCM43R
GCM43E
GCM55R

0.6

0.03

1.0

0.05

1.6

0.1

2.0

0.15

3.2

0.15

3.2

0.2

3.2

0.3

4.5

0.4

5.7

0.4

0.3

0.03

0.5

0.05

0.8

0.1

1.25

0.15

1.6

0.15

1.6

0.2

2.5

0.2

3.2

0.3

5.0

0.4

0.3

0.03

0.5

0.05

0.8

0.1

0.6

0.1

0.85

0.1

1.25

0.15

0.85

0.1

1.15

0.1

1.6

0.2

1.35

0.15

1.8

0.2

2.0

0.2

2.5

0.2

1.8

0.2

2.5

0.2

1.8

0.2

0.1 to 0.2

0.15 to 0.3

0.2 to 0.5

0.2 to 0.7

0.3 to 0.8

0.3

0.2
0.4
0.5

0.7

1.5

2.0

1.0

2.0

Temperature Compensating Type GCM15/18/21/31 Series

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

GCM15

1.00x0.50 [0402]

(

)

100

(

)

GCM18

1.60x0.80 [0603]

(

)

100

(

)

GCM21

2.00x1.25 [0805]

(

)

100

(

)

C0G

(

)

GCM31

3.20x1.60 [1206]

(

)

0.5pF(

R50

)

0.50(

)

0.80(

)

0.80(

)

0.75pF(

R75

)

0.50(

)

0.80(

)

0.80(

)

1.0pF(

1R0

)

0.50(

)

0.80(

)

0.80(

)

2.0pF(

2R0

)

0.50(

)

0.80(

)

0.80(

)

3.0pF(

3R0

)

0.50(

)

0.80(

)

0.80(

)

4.0pF(

4R0

)

0.50(

)

0.80(

)

0.80(

)

5.0pF(

5R0

)

0.50(

)

0.80(

)

0.80(

)

6.0pF(

6R0

)

0.50(

)

0.80(

)

0.80(

)

7.0pF(

7R0

)

0.50(

)

0.80(

)

0.80(

)

8.0pF(

8R0

)

0.50(

)

0.80(

)

0.80(

)

9.0pF(

9R0

)

0.50(

)

0.80(

)

0.80(

)

10pF(

100

)

0.50(

)

0.80(

)

0.80(

)

12pF(

120

)

0.50(

)

0.80(

)

0.80(

)

15pF(

150

)

0.50(

)

0.80(

)

0.80(

)

18pF(

180

)

0.50(

)

0.80(

)

0.80(

)

22pF(

220

)

0.50(

)

0.80(

)

0.80(

)

27pF(

270

)

0.50(

)

0.80(

)

0.80(

)

33pF(

330

)

0.50(

)

0.80(

)

0.80(

)

39pF(

390

)

0.50(

)

0.80(

)

0.80(

)

47pF(

470

)

0.50(

)

0.80(

)

0.80(

)

56pF(

560

)

0.50(

)

0.80(

)

0.80(

)

68pF(

680

)

0.50(

)

0.80(

)

0.80(

)

Continued on the following page.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Continued from the preceding page.

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

GCM15

1.00x0.50 [0402]

(

)

100

(

)

GCM18

1.60x0.80 [0603]

(

)

100

(

)

GCM21

2.00x1.25 [0805]

(

)

100

(

)

C0G

(

)

GCM31

3.20x1.60 [1206]

(

)

82pF(

820

)

0.50(

)

0.80(

)

0.80(

)

100pF(

101

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

120pF(

121

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

150pF(

151

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

180pF(

181

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

220pF(

221

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

270pF(

271

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

330pF(

331

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

390pF(

391

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

470pF(

471

)

0.50(

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

560pF(

561

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

680pF(

681

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

820pF(

821

)

0.80(

)

0.80(

)

0.60(

)

0.60(

)

1000pF(

102

)

0.80(

)

0.80(

)

0.85(

)

0.60(

)

1200pF(

122

)

0.80(

)

0.85(

)

0.60(

)

1500pF(

152

)

0.80(

)

0.85(

)

0.60(

)

1800pF(

182

)

0.80(

)

0.60(

)

0.85(

)

2200pF(

222

)

0.80(

)

0.60(

)

0.85(

)

2700pF(

272

)

0.80(

)

0.60(

)

0.85(

)

3300pF(

332

)

0.60(

)

0.85(

)

3900pF(

392

)

0.60(

)

0.85(

)

4700pF(

472

)

0.60(

)

0.85(

)

5600pF(

562

)

0.85(

)

0.85(

)

6800pF(

682

)

0.85(

)

8200pF(

822

)

0.85(

)

10000pF(

103

)

0.85(

)

12000pF(

123

)

0.85(

)

15000pF(

153

)

0.85(

)

18000pF(

183

)

0.85(

)

22000pF(

223

)

0.85(

)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type GCM15/18/21/31/32 Series

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

(

)

GCM15

1.00x0.50 [0402]

(

)

100

(

)

(

)

GCM18

1.60x0.80 [0603]

(

)

(

)

(

)

GCM21

2.00x1.25 [0805]

(

)

100

(

)

(

)

(

)

GCM31

3.20x1.60 [1206]

(

)

X7R
(

)

GCM32

3.20x2.50

[1210]

(

)

220pF(

221

)

0.50(

)

270pF(

271

)

0.50(

)

330pF(

331

)

0.50(

)

390pF(

391

)

0.50(

)

470pF(

471

)

0.50(

)

560pF(

561

)

0.50(

)

680pF(

681

)

0.50(

)

820pF(

821

)

0.50(

)

1000pF(

102

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

Continued on the following page.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Continued from the preceding page.

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

(

)

GCM15

1.00x0.50 [0402]

(

)

100

(

)

(

)

GCM18

1.60x0.80 [0603]

(

)

(

)

(

)

GCM21

2.00x1.25 [0805]

(

)

100

(

)

(

)

(

)

GCM31

3.20x1.60 [1206]

(

)

X7R
(

)

GCM32

3.20x2.50

[1210]

(

)

1200pF(

122

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

1500pF(

152

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

1800pF(

182

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

2200pF(

222

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

2700pF(

272

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

3300pF(

332

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

3900pF(

392

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

4700pF(

472

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

5600pF(

562

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

6800pF(

682

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

8200pF(

822

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

10000pF(

103

)

0.50(

)

0.80(

)

0.80(

)

0.6(

)

12000pF(

123

)

0.50(

)

0.80(

)

0.6(

)

15000pF(

153

)

0.50(

)

0.80(

)

0.6(

)

18000pF(

183

)

0.50(

)

0.80(

)

0.6(

)

22000pF(

223

)

0.50(

)

0.80(

)

0.6(

)

27000pF(

273

)

0.50(

)

0.80(

)

0.85(

)

33000pF(

333

)

0.50(

)

0.80(

)

0.85(

)

39000pF(

393

)

0.50(

)

0.80(

)

0.85(

)

47000pF(

473

)

0.50(

)

0.80(

)

1.25(

)

56000pF(

563

)

0.80(

)

1.25(

)

68000pF(

683

)

0.80(

)

1.25(

)

82000pF(

823

)

0.80(

)

1.25(

)

0.10

104

)

0.80(

)

1.25(

)

0.12

124

)

1.25(

)

0.15

154

)

0.80(

)

1.25(

)

1.15(

)

0.18

184

)

0.80(

)

1.25(

)

1.15(

)

0.22

224

)

0.80(

)

1.25(

)

1.15(

)

0.27

274

)

1.25(

)

1.15(

)

0.33

334

)

1.25(

)

1.15(

)

0.39

394

)

1.25(

)

1.15(

)

0.47

474

)

1.25(

)

1.15(

)

0.56

564

)

1.25(

)

1.6(

)

0.68

684

)

1.25(

)

1.6(

)

0.82

824

)

1.25(

)

1.6(

)

1.0

105

)

1.25(

)

1.15(

)

1.15(

)

1.5

155

)

1.25(

)

1.15(

)

2.2

225

)

1.15(

)

3.3

335

)

1.6(

)

4.7

475

)

1.6(

)

106

)

2.00(

)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

The tolerance will be changed to L: 3.2

0.2, W: 1.6

0.2, T: 1.15

0.15 for GCM31 25V 2.2

F type.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

No.

AEC-Q200

Test Item

Temperature Compensating Type

High Dielectric Type

Specifications

AEC-Q200 Test Method

No marking defects

The measured and observed characteristics should satisfy the
specifications in the following table.

–

Pre-and Post-Stress
Electrical Test

High Tempersture
Exposure (Storage)

Appearance

Within ±2.5% or ±0.25pF
(Whichever is larger)

Within ±10.0%

Capacitance
Change

Sit the capacitor for 1000±12 hours at 150±3°C. Let sit for 24±2
hours at room temperature, then measure

Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 1000 cycles
according to the four heat treatments listed in the following table.
Let sit for 24±2 hours at room temperature, then measure

30pFmin. : Q

1000

30pFmax. : Q

400+20C

C : Nominal Capacitance (pF)

W.V. : 25Vmin. : 0.03 max.
W.V. : 16V : 0.05 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

Continued on the following page.

• Initial measurement for high dielectric constant type
Perform a heat treatment at 150

°C for one hour and then

let sit for 48±4 hours at room temperature.
Perform the initial measurement.

Per EIA-469

Apply the 24-hour heat (25 to 65°C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2 hours at room temperature, then measure.

Step

Temp. (°C)

Time (min.)

-55+0/-3

15±3

Room

Temp.

125+3/-0

15±3

Room

Temp.

Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8k

Ω

resister)

at 85±3°C and 80 to 85% humidity for 1000±12 hours.
Remove and let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.

No marking defects

The measured and observed characteristics should satisfy the
specifications in the following table.

Temperature
Cycle

No defects or abnormalities

Destructive
Phisical Analysis

Appearance

Within ±2.5% or ±0.25pF
(Whichever is larger)

Within ±10.0%

Capacitance
Change

30pFmin. : Q

1000

30pFmax. : Q

400+20C

C : Nominal Capacitance (pF)

W.V. : 25Vmin. : 0.03 max.
W.V. : 16V : 0.05 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

No marking defects

The measured and observed characteristics should satisfy the
specifications in the following table.

Moisture
Resistance

Appearance

Within ±3.0% or ±0.30pF
(Whichever is larger)

Within ±12.5%

Capacitance
Change

30pFmin. : Q

350

10pF and over, 30pF and below:
Q

275+

10pFmax. : Q

200+10C

C : Nominal Capacitance (pF)

W.V. : 25Vmin. : 0.03 max.
W.V. : 16V : 0.05 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

No marking defects

The measured and observed characteristics should satisfy the
specifications in the following table.

Biased Humidity

Appearance

Within ±3.0% or ±0.30pF
(Whichever is larger)

Within ±12.5%

Capacitance
Change

30pF and over : Q

200

30pF and below : Q

100+

C : Nominal Capacitance (pF)

W.V. : 25Vmin. : 0.035 max.
W.V. : 16V : 0.05 max.

Q/D.F.

More than 1,000

Ω

or 50

Ω

• F

(Whichever is smaller)

I.R.

70
65
60
65
50
45
40
35
30
25
20
15
10

5
0

-5

-10

Humidity

90-98%

Humidity

80-98%

Humidity

90-98%

Humidity

80-98%

Humidity

90-98%

+10

-2

Initial measurement

Temparature

One cycle 24 hours

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Hours

Specifications and Test Methods

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Continued from the preceding page.

No.

AEC-Q200

Test Item

Temperature Compensating Type

High Dielectric Type

Specifications

AEC-Q200 Test Method

No marking defects

The measured and observed characteristics should satisfy the
specifications in the following table.

Operational Life

Appearance

Within ±3.0% or ±0.30pF
(Whichever is larger)

Within ±12.5%

Capacitance
Change

Apply 200% of the rated voltage for 1000±12 hours at
125±3°C. Let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.

• Initial measurement for high dielectric constant type.
Apply 200% of the rated DC voltage for one hour at the maximum
operating temperature ±3°C. Remove and let sit for 48±4 hours
at room temperature. Perform initial measurement.

Visual inspection

30pFmin. : Q

350

10pF and over, 30pF and below:
Q

275+

10pFmax. : Q

200+10C

C : Nominal Capacitance (pF)

W.V. : 25Vmin. : 0.035 max.
W.V. : 16V : 0.05 max.

Q/D.F.

More than 1,000M

Ω

or 50

Ω

• F

(Whichever is smaller)

I.R.

Continued on the following page.

Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration : 0.5ms, peak value: 1500g and velocity change: 4.7m/s.

Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2000Hz. The
frequency range, from 10 to 2000Hz and return to 10Hz, should
be traversed in approximately 20 minutes. This motion should be
applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).

No defects or abnormalities

External Visual

Using calipers

Within the specified dimensions

Phisical Dimension

Per MIL-STD-202 Method 215

Solvent 1 : 1 part (by volume) of isopropyl alcohol

3 parts (by volume) of mineral spirits

Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water

1 part (by volume) of propylene glycol
monomethylether
1 part (by volume) of monoethanolomine

Resistance
to Solvents

No marking defects

Appearance

Within the specified tolerance

Capacitance
Change

30pFmin. : Q

1000

30pFmax. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

Mechanical
Shock

No marking defects

Appearance

Within the specified tolerance

Capacitance
Change

30pFmin. : Q

1000

30pFmax. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

Vibration

No defects or abnormalities

Appearance

Within the specified tolerance

Capacitance
Change

30pFmin. : Q

1000

30pFmax. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

No marking defects

The measured and observed characteristics should satisfy the
specifications in the following table.

Resistance to
Soldering Heat

Appearance

Within the specified tolerance

Capacitance
Change

Immerse the capacitor in a eutectic solder solution at 260±5°C for
10±1 seconds. Let sit at room temperature for 24±2 hours, then
measure.

• Initial measurement for high dielectric constant type
Perform a heat treatment at 150

°C for one hour and then let

sit for 48±4 hours at room temperature.
Perform the initial measurement.

30pFmin. : Q

1000

30pFmax. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

Specifications and Test Methods

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Continued from the preceding page.

No.

AEC-Q200

Test Item

Temperature Compensating Type

High Dielectric Type

Specifications

AEC-Q200 Test Method

Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 300 cycles
according to the two heat treatments listed in the following table
(Maximum transfer time is 20 seconds). Let sit for 24±2 hours at
room temperature, then measure

Continued on the following page.

• Initial measurement for high dielectric constant type
Perform a heat treatment at 150

°C for one hour and then

let sit for 48±4 hours at room temperature.
Perform the initial measurement.

(a) Preheat at 155°C for 4 hours. After preheating, immerse the

capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-
K-5902) (25% rosin in weight proportion). Immerse in eutectic
solder solution for 5+0/-0.5 seconds at 235±5°C.

(b) Shall be placed into steam aging for 8 hours±15 minutes.

After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for
5+0/-0.5 seconds at 235±5°C.

Per AEC-Q200-004

The capacitance/Q/D.F. should be measured at 25°C at the
frequency and voltage shown in the table.

The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 25°C and 125°C and within 2
minutes of charging.

No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/ discharge current is less than 50mA.

No marking defects

The measured and observed characteristics should satisfy the
specifications in the following table.

Thermal Shock

95% of the terminations is to be soldered evenly and
continuously.

Solderability

Appearance

Within ±2.5% or ±0.25pF
(Whichever is larger)

R7
Within ±10.0%

Capacitance
Change

30pF min. : Q

1000

30pF max. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

No marking defects

ESD

Appearance

Within the specified tolerance

Capacitance
Change

30pF min. : Q

1000

30pF max. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

No defects or abnormalities

Visual inspection.

Electrical
Chatacteri-
zation

Appearance

Within the specified tolerance

Capacitance
Change

30pF min. : Q

1000

30pF max. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25V min. : 0.025 max.
W.V. : 16V : 0.035 max

Q/D.F.

More than 100,000M

Ω

or 1,000

Ω

• F

(Whichever is smaller)

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

More than 10,000M

Ω

or 100

Ω

• F

(Whichever is smaller)

More than 1,000M

Ω

or 10

Ω

• F

(Whichever is smaller)

I.R. 25°C

I.R. 125°C

No failure

Dielectric
Strength

Char.

Item

Frequency

Voltage

1±0.1MHz

0.5 to 5Vrms

1±0.1kHz

1±0.2Vrms

∆

(1000pF and below)

∆

(more than 1000pF)

R7 (C

10µF)

Step

Temp. (°C)

Time (min.)

-55+0/-3

15±3

125+3/-0

15±3

Specifications and Test Methods

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Continued from the preceding page.

No.

AEC-Q200

Test Item

Temperature Compensating Type

High Dielectric Type

Specifications

AEC-Q200 Test Method

Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1sec. The soldering should be done either
with an iron or using the reflow method and should be conducted
with care so that the soldering is uniform and free of defects such
as heat shock.

Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply *18N force in parallel
with the test jig for 60sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*2N (GCM15)

Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip Length : 2.5mm max. >

< Chip Length : 3.2mm min. >

Speed supplied the Stress Load : 2.5mm / sec.

No marking defects

Terminal
Strength

Destruction value should be exceed following one.

< Chip L dimension : 2.5mm max. >

Chip thickness

0.5mm rank : 20N

Chip thickness

0.5mm rank : 8N

< Chip L dimension : 3.2mm min. >

Chip thickness

1.25mm rank : 15N

Chip thickness

1.25mm rank : 54.5N

Beam Load Test

Appearance

Within the specified tolerance

Capacitance
Change

30pF min. : Q

1000

30pF max. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

No marking defects

Board
Flex

Appearance

Within ±5.0% or ±0.5pF
(Whichever is larger)

R7 : Within ±10.0%

Capacitance
Change

30pF min. : Q

1000

30pF max. : Q

400+20C

C : Nominal Capacitance (pF)

R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.

Q/D.F.

More than 10,000M

Ω

or 500

Ω

• F

(Whichever is smaller)

I.R.

(in mm)

Type

GCM15
GCM18
GCM21
GCM31
GCM32

0.4
1.0
1.2
2.2
2.2

1.5
3.0
4.0
5.0
5.0

0.5
1.2

1.65

2.0
2.9

(in mm)

Type

GCM15
GCM18
GCM21
GCM31
GCM32

0.5
0.6
0.8
2.0
2.0

1.5
2.2
3.0
4.4
4.4

0.6
0.9
1.3
1.7
2.6

Iron Board

0.6

100

t : 1.6mm
(GCM15 : 0.8mm)

114

Pressunzing
speed : 1.0mm/sec
Pressurize

Capacitance meter

Flexure :

(High Dielectric Type)
Flexure :

(Temperature
Compensating Type)

Baked electrode or
copper foil

Solder resist

(t=1.6mm
GCM15 : 0.8mm)

Fig. 1

Fig. 2

Fig. 3

Fig. 4

Continued on the following page.

Specifications and Test Methods

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Continued from the preceding page.

No.

AEC-Q200

Test Item

Temperature Compensating Type

High Dielectric Type

Specifications

AEC-Q200 Test Method

The capacitance change should be measured after 5 min. at
each specified temperature stage.
(1) Temperature Compensating Type

The temperature coefficient is determind using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 (

∆

C: +25°C to

+125°C : other temp. coeffs.: +25°C to +85°C) the capacitance
should be within the specified tolerance for the temperature
coefficient and capacitance change as Table A. The
capacitance drift is caluculated by dividing the differences
between the maximum and minimum measured values in the
steps 1, 3 and 5 by the capacitance value in step 3.

(2) High Dielectric Constant Type

The ranges of capacitance change compared with the above
25°C value over the temperature ranges shown in the table
should be within the specified ranges.
· Initial measurement for high dielectric constant type.
Perform a heat treatment at 150+0/-10°C for one hour and then
set for 48±4 hours at room temperature.
Perform the initial measurement.

Within the specified tolerance.
(Table A)

Capacitance
Temperature
Character-
istics

Capacitance
Change

Within the specified tolerance.
(Table A)

R7 : Withn ±15%
(-55°C to +125°C)

Temperature
Coefficent

Within ±0.2% or ±0.05 pF
(Whichever is larger.)
* Not apply to 1X/25V

Capacitance
Drift

Step

1
2
3
4
5

25±2

-55±3 (for

∆

C to R7)

25±2

125±3 (for

∆

C / R7), 85±3 (for other TC)

25±2

Temperature (°C)

Note 1 : Nominal values denote the temperature coefficient within a range of 25°C to 125°C (for

∆

C)/85°C (for other TC).

0.25

0.40

0.58

-0.11

-0.17

-0.24

Char.

Nominal Values (ppm/°C) Note1

Capacitance Change from 25°C (%)

Max.

Min.

-30

-10

Max.

Min.

Table A

-55

Max.

Min.

Specifications and Test Methods

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Part Number

Dimensions (mm)

Bulk Bag

Bulk Case

ø180mm reel

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

ø330mm reel

Quantity (pcs.)

Minimum Quantity Guide

Packaging Code

Packaging Type

Bulk Packaging in a bag

Tape Carrier Packaging

Bulk Case Packaging

Bulk Packaging

Packaging Code

D, L, K, J

Continued on the following page.

Tape Carrier Packaging

1. Dimensions of Reel

2.0

0.5

180mm Reel

1.5 for 8mm wide tape

1.5 for 12mm wide tape

178

2.0

50 min.

13.0

0.5

21.0

0.8

(in mm)

330mm Reel

2.0

0.5

2.5

0.5

1.5 for 8mm wide tape

1.5 for 12mm wide tape

328

2.0

50 min.

13.0

0.5

21.0

0.8

1) 68000pF/0.1

F of R7 50V are not available by bulk case.

For Flow/Reflow

For Reflow

GCM18

GCM21

GCM31

GCM03

GCM155

GCM32

GCM43

GCM55

1.6

2.0

3.2

0.6

1.0

3.2

4.5

5.7

0.8

1.25

1.6

0.3

0.5

2.5

3.2

5.0

0.8

0.6

0.85

1.25

0.85

1.15

1.6

0.3

0.5

1.15

1.35

1.8/1.6

1.15

2.5

3.2

1,000

500

15,000

10,000

5,000

50,000

10,000

50,000

10,000

6,000

10,000

8,000

4,000

5,000

4,000

5,000

4,000

2,000

1,500

4,000

15,000

10,000

3,000

2,000

3,000

2,000

1,000

500

300

1.35/1.6

1.8/2.0

1.35/1.6

1.8/2.0

Package

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

2. Dimensions of Paper Tape

4.0

0.1

8mm width 4mm pitch Tape

8mm width 2mm pitch Tape

1.5

+0.1

4.0

0.1

1.75

0.1

1.1 max.

8.0

0.3

Direction of Feed

3.5

0.05

2.0

0.05

Part Number

GCM18

GCM32
(T=0.85mm)

GCM31
(T

0.85mm)

GCM21
(T

0.85mm)

1.05

0.1

2.0

0.2

2.8

0.2

1.55

0.15

1.85

0.1

3.6

0.2

3.6

0.2

2.3

0.15

Part Number

GCM03

GCM15

0.37

0.65

0.67

1.15

*Nominal Value

(in mm)

2.0

0.05

1.5

+0.1

-0

3.5

0.05

4.0

0.1

2.0

0.05

8.0

0.3

1.75

0.1

0.8 max.

Direction of Feed

Continued on the following page.

Continued from the preceding page.

3. Dimensions of Plastic Tape

8mm width 4mm pitch Tape

12mm width 8mm pitch Tape

Part Number

GCM21
(T=1.25mm)

GCM31
(T

1.15mm)

GCM32
(T

1.15mm)

1.45

0.2

2.8

0.2

1.9

0.2

2.25

0.2

3.5

0.2

3.5

0.2

Part Number

GCM43

GCM55

3.6

4.9

5.2

6.1

*Nominal Value

(in mm)

4.0

0.1

4.0

0.1

1.75

0.1

8.0

0.3

Direction of feed

2.0

0.1

0.2

0.1

2.5 max.

1.5

+0.1

-0

3.5

0.05

(3.0 max. T=1.8/2.0 rank)

8.0

0.1

4.0

0.1

1.75

0.1

12.0

0.3

Direction of feed

5.5

0.1

2.0

0.1

0.3

0.1

2.5 max.

1.5

+0.1

-0

Package

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

4. Taping Method

(1) Tapes for capacitors are wound clockwise. The

sprocket holes are to the right as the tape is pulled

toward the user.

(2) Part of the leader and part of the empty tape shall be

attached to the end of the tape as follows.

(3) The top tape and base tape are not atteached at the

end of the tape for a minimum of 5 pitches.

(4) Missing capacitors number within 0.1% of the number

per reel or 1 pc, whichever is greater, and are not

continuous.

(5) The top tape and bottom tape shall not protrude

beyond the edges of the tape and shall not cover

sprocked holes.

(6) Cumulative tolerance of sprocket holes, 10 pitches :

0.3mm.

(7) Peeling off force : 0.1 to 0.6N* in the direction shown

below.

*GCM03 : 0.05 to 0.5N

165 to 180˚

Base Tape

Top Tape

Direction of Feed

160 min.

190 min.

210 min.

(Top Tape alone)

(in mm)

Vacant Section Chip-mounting Unit

Vacant Section

Leader unit

Continued from the preceding page.

Dimensions of Bulk Case Packaging

The bulk case used antistatic materials. Please contact

Murata for details.

6.8

8.8

12.0

2.0
3.0

1.5

110

(in mm)

36.0

31.5

Package

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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Caution

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

■

Storage and Operating Condition

Chip monolithic ceramic capacitors (chips) can

experience degradation of termination solderability

when subjected to high temperature or humidity, or if

exposed to sulfur or chlorine gases.

Storage environment must be at an ambient temperature

of 5-40 degree C and an ambient humidity of 20-70%RH.

Use chip within 6 months. If 6 months or more have

elapsed, check solderability before use.

(Reference Data 1. Solderability)

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

FUMING WHEN THE PRODUCT IS USED.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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■

Soldering and Mounting

Choose a mounting position that minimizes the stress

imposed on the chip during flexing or bending of the

board.

Locate chip
horizontal to the
direction in which
stress acts.

Chip arrangement
Worst A-C- (B, D)
Best

[Component direction]

[Chip Mounting Close to Board Separation Point]

Perforation

Slit

2. Solder

1. Mounting Position

Overly thick application of solder paste results in

excessive fillet height solder.

This makes the chip more susceptible to mechanical and

thermal stress on the board and may cause cracked

chips.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in chips

breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

[Optimum Solder Amount for Reflow soldering]

0.2mm min.

3. Chip Placing

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. So adjust the suction nozzle's

bottom dead point by correcting warp in the board.

Normally, the suction bottom dead point must be set on

the upper surface of the board. Nozzle pressure for chip

mounting must be a 1 to 3N static load.

Dirt particles and dust accumulated between the suction

nozzle and the cylinder inner wall prevent the nozzle from

moving smoothly. This imposes great force on the chip

during, causing cracked chips. And the locating claw,

when worn out, imposes uneven forces on the chip when

positioning, causing cracked chips. The suction nozzle

and the locating claw must be maintained, checked and

replaced periodically.

Board Guide

[Correct]

Suction Nozzle

Board

Support Pin

[Incorrect]

Deflection

Continued on the following page.

Caution

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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4. Reflow Soldering

Sudden heating of the chip results in distortion due to

excessive expansion and construction forces within the

chip causing cracked chips. So when preheating, keep

temperature differential,

∆

T, within the range shown in

Table 1. The smaller the

∆

T, the less stress on the chip.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

(

∆

T) between the component and solvent within the

range shown in the above table.

Inverting the PCB

Make sure not to impose an abnormal mechanical shock

on the PCB.

GCM03/15/18/21/31

GCM32/43/55

∆

190

∆

130

Part Number

Temperature Differential

Table 1

££

¤¤

¥¥

¢¢

¤¤

Soldering

60 seconds min.

120 seconds max.

20 - 40 seconds

Temperature (

200

∆

Temperature (

∆

60 seconds min.

120 seconds max.

20 seconds max.

Soldering

Time

¢¢

¤¤

Soldering temperature (

Soldering time (sec.)

260

270

250

240

230

120

280

220

[Standard Conditions for Reflow Soldering]

[Allowable Soldering Temperature and Time]

In case of repeated soldering, the accumulated
Soldering time must be within the range shown
above.

Infrared Reflow

Vapor Reflow

Continued from the preceding page.

5. Leaded Component Insertion

If the PCB is flexed when leaded components (such as

transformers and lCs) are being mounted, chips may

crack and solder joints may break.

Before mounting leaded components, support the PCB

using backup pins or special jigs prevent warping.

Gradual
cooling
(in the air)

Preheating

Continued on the following page.

Caution

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Optimum Solder Amount for Flow Soldering

Adhesive

Up to Chip Thickness

6. Flow Soldering

Sudden heating of the chip results in thermal distortion

causing cracked chips. And an excessively long soldering

time or high soldering temperature results in leaching of

the outer electrodes, causing poor adhesion or a

reduction in capacitance value due to loss of contact

between electrodes and end termination.

When preheating, keep temperature differential between

solder temperature and chip surface temperature,

∆

within the range shown in Table 2. The smaller the

∆

the less stress on the chip.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

between the component and solvent within the range

shown in Table 2.

Don't apply flow soldering to chips not listed in Table 2.

GCM18/21/31

∆

150

Part Number

Temperature Differential

Table 2

[Standard Conditions for Flow Soldering]

[Allowable Soldering Temperature and Time]

In case of repeated soldering, the accumulated
Soldering time must be within the range shown above.

RRSS

££¤¤

¥¥

Soldering

Preheating

60 - 120 seconds

Temperature (

∆

5 seconds max.

Time

¢¢

££

¤¤

¥¥

Soldering temperature (

Soldering time (sec.)

260

270

250

240

230

280

220

Continued from the preceding page.

Gradual
cooling
(in the air)

Continued on the following page.

Caution

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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Optimum Solder Amount when Corrections Are Made

Using a Soldering Iron

Up to Chip Thickness

7. Correction with a Soldering Iron

(1) For Chip Type Capacitors

Sudden heating of the chip results in distortion due to a

high internal temperature differential, causing cracked

chips. When preheating, keep temperature differential,

∆

T, within the range shown in Table 3. The smaller the

∆

T, the less stress on the chip.

[Standard Conditions for Soldering Iron Temperature]

GCM15, GCM18/21/31

GCM32/43/55

∆

190

∆

130

Part Number

Temperature Differential

Table 3

RRSS

££¤¤

¥¥

Soldering

Preheating

Gradual
cooling
(in the air)

60 - 120 seconds

20 seconds max.

∆

Time

[Allowable time and Temperature for Making

Corrections with a Soldering Iron]

RRS

££¤

¥¥

Soldering time (sec.)

260

270

250

240

230

120

280

220

8. Washing

Excessive output of ultrasonic oscillation during cleaning

causes PCBs to resonate, resulting in cracked

chips or broken solder. Take note not to vibrate PCBs.

Failure to follow the above cautions may result, worst

case, in a short circuit and fuming when the products is

used

Temperature (

Soldering temperature (

Continued from the preceding page.

Caution

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Caution

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

■

Handling

1. Inspection

Thrusting force of the test probe can flex the

PCB, resulting in cracked chips or open solder

joints. Provide support pins on the back side of

the PCB to prevent warping or flexing.

2. Board Separation (or Depane-lization)

• Board flexing at the time of separation causes

cracked chips or broken solder.

• Severity of stresses imposed on the chip at the

time of board break is in the order of :

Pushback<Slitter<V Slot<Perforator.

• Board separation must be performed using special

jigs, not with hands.

3.Reel and bulk case

• In the handling of reel and case, please pay

attentionnot to drop it.

Please do not use chip of the case which dropped.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

FUMING WHEN THE PRODUCT IS USED.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

■

Soldering and Mounting

(1) Notice for Pattern Forms

1. PCB Design

Unlike leaded components, chip components are

susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal

stresses than leaded components.

Excess solder fillet height can multiply these stresses and

cause chip cracking. When designing substrates, take

land patterns and dimensions into consideration to

eliminate the possibility of excess solder fillet height.

Pattern Forms

Incorrect

Correct

Lead Wire

Solder Resist

Chassis

Solder (Ground)

Electrode Pattern

Solder

Resist

Soldering Iron

Lead Wire

Solder Resist

Placing Close to Chassis

Placing of Chip Components

and Leaded Components

Placing of Leaded Components

after Chip Component

Lateral Mounting

Continued on the following page.

Notice

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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GCM18

GCM21

GCM31

1.6

0.8

0.6

1.0

0.8

0.9

0.6

0.8

2.0

1.25

1.0

1.2

0.9

1.0

0.8

1.1

3.2

1.6

2.2

2.6

1.0

1.1

1.0

1.4

(in mm)

(2) Land Dimensions

Part Number

Dimensions

Dimensions (L

Table 1 Flow Soldering Method

GCM15

GCM18

GCM21

GCM31

GCM32

GCM43

GCM55

1.0

0.5

1.6

0.8

2.0

1.25

3.2

1.6

0.3

0.5

0.6

0.8

1.0

1.2

2.2

2.4

2.0

2.4

3.0

3.5

4.0

4.6

0.35

0.45

0.6

0.7

0.6

0.7

0.8

0.9

1.0

1.2

1.4

1.6

0.4

0.6

GCM03

0.6

0.3

0.2

0.3

0.2

0.35

0.2

0.4

0.6

0.8

1.1

1.0

1.4

1.8

2.3

3.0

3.5

4.8

3.2

2.5

4.5

3.2

5.7

5.0

(in mm)

Part Number

Dimensions

Dimensions (L

Table 2 Reflow Soldering Method

Chip Capacitor

Land

Solder Resist

Continued from the preceding page.

Continued on the following page.

2. Adhesive Application

Thin or insufficient adhesive causes chips to loosen or

become disconnected when flow soldered.

The amount of adhesive must be more than dimension c

shown in the drawing below to obtain enough bonding

strength.

The chip's electrode thickness and land thickness must

be taken into consideration.

Low viscosity adhesive causes chips to slip after

mounting. Adhesive must have a viscosity of

5000pa-s (500ps) min. (at 25

Land

Adhesive

Board

Chip Capacitor

c : 50 to 105

b : 30 to 35

a : 20 to 70

3. Adhesive Curing

Insufficient curing of the adhesive causes chips to

disconnect during flow soldering and causes deteriorated

insulation resistance between outer electrodes due to

moisture absorption.

Control curing temperature and time in order to prevent

insufficient hardening.

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Notice

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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4. Flux Application

An excessive amount of flux generates a large quantity of

flux gas, causing deteriorated solderability.

So apply flux thinly and evenly throughout.

(A foaming system is generally used for flow soldering) .

Flux containing too high a percentage of halide may

cause corrosion of the outer electrodes unless sufficiently

cleaned. Use flux with a halide content of 0.2w% max.

But do not use strongly acidic flux.

Wash thoroughly because water-soluble flux causes

deteriorated insulation resistance between outer

electrodes unless sufficiently cleaned.

Set temperature and time to ensure that leaching of the

outer electrode does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

shown below) and 25% of the length A-B shown below as

mounted on substrate.

[As a Single Chip]

[As Mounted on Substrate]

5. Flow Soldering

Outer Electrode

Continued from the preceding page.

Notice

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Murata_Chip_Monolithic_Ceramic_Capacitors_for_Automotive-html.html

Notice

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

■

Other

1. Resin Coating

When selecting resin materials, select those with

low contraction.

2. Circuit Design

These capacitors on this catalog are not safety

recognized products

3. Remarks

The above notices are for standard applications

and conditions. Contact us when the products are

used in special mounting conditions. Select optimum

conditions for operation as they determine the

reliability of the product after assembly.

The data here in are given in typical values, not

guaranteed ratings.

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

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Head Office

2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone: 81-75-951-9111

International Division

3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan
Phone: 81-3-5469-6123 Fax: 81-3-5469-6155 E-mail: intl@murata.co.jp

http://www.murata.com/

Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

Note

C03E.pdf 04.5.21

Note:

1. Export Control

For customers outside Japan

Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive
weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons.

For customers in Japan

For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required
for export.

2. Please contact our sales representatives or product engineers before using the products in this catalog for the applications listed below, which require especially

high reliability for the prevention of defects which might directly damage to a third party's life, body or property, or when one of our products is intended for use
in applications other than those specified in this catalog.

Aircraft equipment

Aerospace equipment

Undersea equipment

Power plant equipment

Medical equipment

Transportation equipment (vehicles, trains, ships, etc.)

Traffic signal equipment

Disaster prevention / crime prevention equipment

Data-processing equipment

Application of similar complexity and/or reliability requirements to the applications listed in the above

3. Product specifications in this catalog are as of April 2004. They are subject to change or our products in it may be discontinued without advance notice. Please

check with our sales representatives or product engineers before ordering. If there are any questions, please contact our sales representatives or product
engineers.

4. Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

5. This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or

transact the approval sheet for product specifications before ordering.

6. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect

of our and/or a third party's intellectual property rights and other related rights in consideration of your use of our products and/or information described or
contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned
above under licenses without our consent.

7. No ozone depleting substances (ODS) under the Montreal Protocol are used in our manufacturing process.