To learn more about onsemi™, please visit our website at 

www.onsemi.com

ON Semiconductor

Is Now

onsemi

 and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “

onsemi

” or its affiliates and/or 

subsidiaries in the United States and/or other countries. 

onsemi

 owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of 

onsemi

 

product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. 

onsemi

 reserves the right to make changes at any time to any products or information herein, without 

notice. The information herein is provided “as-is” and 

onsemi

 makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, 

or suitability of its products for any particular purpose, nor does 

onsemi

 assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all 

liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using 

onsemi

 products, including compliance with all laws, 

regulations and safety requirements or standards, regardless of any support or applications information provided by 

onsemi

. “Typical” parameters which may be provided in 

onsemi

 data sheets and/

or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application 
by customer’s technical experts. 

onsemi

 does not convey any license under any of its intellectual property rights nor the rights of others. 

onsemi

 products are not designed, intended, or authorized 

for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for 
implantation in the human body. Should Buyer purchase or use 

onsemi

 products for any such unintended or unauthorized application, Buyer shall indemnify and hold 

onsemi

 and its officers, employees, 

subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death 
associated with such unintended or unauthorized use, even if such claim alleges that 

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 was negligent regarding the design or manufacture of the part. 

onsemi

 is an Equal Opportunity/Affirmative 

Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 

©

 Semiconductor Components Industries, LLC, 2016

November, 2019 

−

 Rev. 3

1

Publication Order Number:

NLX3G16/D

Triple Non-Inverting Buffer

NLX3G16

The NLX3G16 MiniGate

t

 is an advanced high

−

speed CMOS

triple non

−

inverting buffer in ultra

−

small footprint.

The NLX3G16 input and output structures provide protection when

voltages up to 7.0 V are applied, regardless of the supply voltage.

Features

•

High Speed: t

PD

 = 1.8 ns (Typ) @ V

CC

 = 5.0 V

•

Designed for 1.65 V to 5.5 V V

CC

 Operation

•

Low Power Dissipation: I

CC

 = 1 

m

A (Max) at T

A

 = 25

°

C

•

24 mA Balanced Output Source and Sink Capability

•

Balanced Propagation Delays

•

Overvoltage Tolerant (OVT) Input and Output Pins

•

Ultra

−

Small Packages

•

These are Pb

−

Free Devices

IN A2

OUT Y2

1

OUT Y2

IN A1

GND

OUT Y1

IN A2

Figure 1. Pinout

 (Top View)

Figure 2. Logic Symbol

V

CC

IN A1

OUT Y1

1

1

2

3

4

8

7

6

5

OUT Y3

IN A3

IN A3

OUT Y3

1

PIN ASSIGNMENT

1

2
3

IN  A2

IN A1

OUT Y3

4
5

OUT Y2

GND

FUNCTION TABLE

L

H

A

Y

L

H

6

IN  A3

7

OUT Y1

8

V

CC

MARKING

DIAGRAMS

www.onsemi.com

See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

X or XX = Specific Device Code
M

= Date Code

G

= Pb

−

Free Package

UDFN8

1.45 x 1.0

CASE 517BZ

UDFN8

1.6 x 1.0

CASE 517BY

UDFN8

1.95 x 1.0

CASE 517CA

XX M

1

X M

1

XX M

1

NLX3G16

www.onsemi.com

2

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

V

CC

DC Supply Voltage

−

0.5 to +7.0

V

V

IN

DC Input Voltage

−

0.5 to +7.0

V

V

OUT

DC Output Voltage

−

0.5 to +7.0

V

I

IK

DC Input Diode Current 

V

IN

 < GND

−

50

mA

I

OK

DC Output Diode Current 

V

OUT

 < GND

−

50

mA

I

O

DC Output Source/Sink Current

±

50

mA

I

CC

DC Supply Current Per Supply Pin

±

100

mA

I

GND

DC Ground Current per Ground Pin

±

100

mA

T

STG

Storage Temperature Range

−

65 to +150

°

C

T

L

Lead Temperature, 1 mm from Case for 10 Seconds

260

°

C

T

J

Junction Temperature Under Bias

150

°

C

MSL

Moisture Sensitivity

Level 1

F

R

Flammability Rating Oxygen 

Index: 28 to 34

UL 94 V

−

0 @ 0.125 in

I

LATCHUP

Latchup Performance Above V

CC

 and Below GND at 125 

°

C (Note 5)

±

500

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm

−

by

−

1 inch, 2 ounce copper trace no air flow.

2. Tested to EIA/JESD22

−

A114

−

A.

3. Tested to EIA/UESD22

−

A115

−

A.

4. Tested to JESD22

−

C101

−

A.

5. Tested to EIA / JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

V

CC

Positive DC Supply Voltage

1.65

5.5

V

V

IN

Digital Input Voltage

0

5.5

V

V

OUT

Output Voltage

0

5.5

V

T

A

Operating Free

−

Air Temperature

−

55

+125

°

C

D

t/

D

V

Input Transition Rise or Fall Rate

 

V

CC

 = 1.8 V 

±

 0.18

V

CC

 = 2.5 V 

±

 0.2 V

V

CC

 = 3.3 V 

±

 0.3 V

V

CC

 = 5.0 V 

±

 0.5 V

0

0

0

0

20

20

10

5

ns/V

NLX3G16

www.onsemi.com

3

DC ELECTRICAL CHARACTERISTICS

Symbol

Parameter

Conditions

V

CC

(V)

T

A

 = 25 

5

C

T

A

 

=

 +85

5

C

T

A

 = 

−

55

5

C to

+125

5

C

Unit

Min

Typ

Max

Min

Max

Min

Max

V

IH

Low

−

Level

Input

Voltage

1.65 to

5.5

0.70 x

V

CC

0.70 x

V

CC

V

V

IL

Low

−

Level

Input

Voltage

1.65 to

5.5

0.30 x

V

CC

0.30 x

V

CC

0.30 x

V

CC

V

V

OH

High

−

Level

Output

Voltage

V

IN

 = V

IH

 or V

IL

I

OH

 = 

−

100 

m

A

1.65 to .5

V

CC

 

−

0.1

V

CC

V

CC

 

−

0.1

V

CC

 

−

0.1

V

V

IN

 = V

IH

 or V

IL

I

OH

 = 

−

4 mA

I

OH

 = 

−

8 mA

I

OH

 = 

−

12 mA

I

OH

 = 

−

16 mA

I

OH

 = 

−

24 mA

I

OH

 = 

−

32 mA

1.65

2.3

2.7

3.0

3.0

4.5

1.4

1.9

2.2

2.4

2.3

3.8

1.50

2.1

2.4

2.7

2.5

4.0

1.4

1.9

2.2

2.4

2.3

3.8

1.4

1.9

2.2

2.4

2.3

3.8

V

OL

Low

−

Level

Output

Voltage

V

IN

 = V

IH

 or V

IL

I

OL

 = 100 

m

A

1.65 

−

 5.5

0.1

0.1

0.1

V

V

IN

 = V

IH

 or V

IL

I

OH

 = 4 mA

I

OH

 = 8 mA

I

OH

 = 12 mA

I

OH

 = 16 mA

I

OH

 = 24 mA

I

OH

 = 32 mA

1.65

2.3

2.7

3.0

3.0

4.5

0.2

0.2

0.22

0.28

0.38

0.42

0.24

0.3

0.4

0.4

0.55

0.55

0.24

0.3

0.4

0.4

0.55

0.55

0.24

0.3

0.4

0.4

0.55

0.55

I

IN

Input

Leakage

Current

0 

v

 V

IN

 

v

 5.5 V

0 to 5.5

±

0.1

±

1.0

±

1.0

m

A

I

OFF

Power

−

Off

Output

Leakage

Current

V

IN

 or V

OUT

 =

5.5 V

0

1.0

10

10

m

A

I

CC

Quiescent

Supply

Current

0 

v

 V

IN

 

v

 V

CC

5.5

1.0

10

10

m

A

NLX3G16

www.onsemi.com

4

AC ELECTRICAL CHARACTERISTICS 

(Input t

r

 = t

f

 = 3.0 nS)

Symbol

Parameter

V

CC

(V)

Test

Condition

T

A

 = 25 

5

C

T

A

 

=

 +85

5

C

T

A

 = 

−

55

5

C to

+125

5

C

Unit

Min

Typ

Max

Min

Max

Min

Max

t

PLH

,

t

PHL

Propagation

Delay Input A to

Output

1.65

−

1.95

R

L

 = 1 M

W

,

C

L

 = 15 pF

1.8

6.0

7.9

1.8

8.8

1.8

12

ns

2.3

−

2.7

R

L

 = 1 M

W

,

C

L

 = 15 pF

1.0

3.0

5.2

1.0

5.8

1.0

9.1

3.0

−

3.6

R

L

 = 1 M

W

,

C

L

 = 15 pF

0.8

2.3

3.6

0.8

4.0

0.8

6.5

R

L

 = 500 

W

,

C

L

 = 50 pF

1.2

3.0

4.6

1.2

5.1

1.2

7.6

4.5

−

5.5

R

L

 = 1 M

W

,

C

L

 = 15 pF

0.5

1.8

2.9

0.5

3.2

0.5

5.5

R

L

 = 500 

W

,

C

L

 = 50 pF

0.8

2.4

3.8

0.8

4.2

0.8

6.4

C

IN

Input

Capacitance

5.5

V

IN

 = 0 V or V

CC

7.0

pF

C

PD

Power

Dissipation

Capacitance

(Note 6)

3.3

5.5

10 MHz

V

IN

 = 0 V or V

CC

9

11

pF

6. C

PD

 is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without

load. Average operating current can be obtained by the equation I

CC(OPR)

 = C

PD

 

•

 V

CC

 

•

 f

in

 + I

CC

. C

PD

 is used to determine the no

−

load

dynamic power consumption: P

D

 = C

PD

 

•

 V

CC

2

 

•

 f

in

 + I

CC 

•

 

V

CC.

Figure 3. Switching Waveforms

Figure 4. Test Circuit

PULSE

GENERATOR

R

T

DUT

V

CC

R

L

C

L

R

T

 =  Z

OUT

 of pulse generator (typically 50 

W

)

V

CC

GND

50%

50% V

CC

A

Y

t

PHL

t

PLH

PROPAGATION DELAYS

t

R

 = t

F

 = 2.5 ns, 10% to 90%; f = 1 MHz; t

W

 = 500 ns

NLX3G16

www.onsemi.com

5

ORDERING

 

INFORMATION

Device

Package Marking

Package

Shipping

†

NLX3G16DMUTCG

AC

UDFN8, 1.95 x 1.0, 0.5P

(Pb

−

Free)

3000 / Tape & Reel

NLX3G16EMUTCG

AE

UDFN8, 1.6 x 1.0, 0.4P

(Pb

−

Free)

3000 / Tape & Reel

NLX3G16FMUTCG

E

UDFN8, 1.45 x 1.0, 0.35P

(Pb

−

Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NLX3G16

www.onsemi.com

6

PACKAGE DIMENSIONS

UDFN8 1.6x1.0, 0.4P

CASE 517BY

ISSUE O

ÉÉÉ

ÉÉÉ

ÉÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb

−

Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.15

0.25

D

1.60 BSC

E

1.00 BSC

e

0.40 BSC

L

0.25

0.35

L1

0.30

0.40

A B

E

D

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

2X

2X

A3

BOTTOM VIEW

b

e

8X

L

7X

L1

1

4

5

8

e/2

0.10

B

0.05

A

C

C

NOTE 3

M

M

DIMENSIONS: MILLIMETERS

0.26

7X

0.49

8X

1.24

0.53

PITCH

0.40

1

PKG

OUTLINE

NLX3G16

www.onsemi.com

7

PACKAGE DIMENSIONS

UDFN8 1.45x1.0, 0.35P

CASE 517BZ

ISSUE O

ÉÉ

ÉÉ

ÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb

−

Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.15

0.25

D

1.45 BSC

E

1.00 BSC

e

0.35 BSC

L

0.25

0.35

L1

0.30

0.40

A B

E

D

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

2X

2X

A3

BOTTOM VIEW

b

e

8X

L

7X

L1

1

4

5

8

e/2

DIMENSIONS: MILLIMETERS

0.22

7X

0.48

8X

1.18

0.53

PITCH

0.35

1

PKG

OUTLINE

0.10

B

0.05

A

C

C

NOTE 3

M

M

NLX3G16

www.onsemi.com

8

PACKAGE DIMENSIONS

UDFN8 1.95x1.0, 0.5P

CASE 517CA

ISSUE O

ÉÉÉ

ÉÉÉ

ÉÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb

−

Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.15

0.25

D

1.95 BSC

E

1.00 BSC

e

0.50 BSC

L

0.25

0.35

L1

0.30

0.40

A B

E

D

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

2X

2X

A3

BOTTOM VIEW

b

e

8X

L

7X

L1

1

4

5

8

e/2

DIMENSIONS: MILLIMETERS

0.30

7X

0.49

8X

1.24

0.54

PITCH

0.50

1

PKG

OUTLINE

0.10

B

0.05

A

C

C

NOTE 3

M

M

MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at 

www.onsemi.com/site/pdf/Patent

−

Marking.pdf

. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800

−

282

−

9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

LITERATURE FULFILLMENT

:

Email Requests to:

 orderlit@onsemi.com

ON Semiconductor Website:

 www.onsemi.com

Europe, Middle East and Africa Technical Support:

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For additional information, please contact your local Sales Representative

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