SKYPER_32_R_UL-html.html

SKYPER 32 R UL

© by SEMIKRON

Rev. 0 – 11.08.2010

SKYPER

Driver Core

IGBT Driver Core

SKYPER 32 R UL

Preliminary Data

Features

• UL recognized according UL 508C
• UL report reference E242581
• Two output channels
• Integrated potential free power supply
• Under voltage protection
• Drive interlock top / bottom
• Dynamic short cirucit protection
• Shut down input
• Failure management
• IEC 60068-1 (climate) 40/085/56, no

condensation and no dripping water
permitted, non-corrosive, climate class
3K3 acc. EN60721

Typical Applications*

• Driver for IGBT modules in bridge

circuits in industrial application

• DC bus voltage up to 1200V

Footnotes

CE:

With external high voltage diode

isolIO/

isol12

: Isolation test is not performed

as a series test at SEMIKRON and must be
performed by the user
V

isolPD

: According to VDE 0110-20

out/pulse

can be expanded to 6,3µQ with

boost capacitors

Isolation coordination in compliance with
EN50178 PD2
Operating temperature is real ambient
temperature around the driver core
Degree of protection: IP00

This is an electrostatic discharge sensitive device (ESDS), international standard IEC
60747-1, Chapter IX

* The specifications of our components may not be considered as an assurance of component
characteristics. Components have to be tested for the respective application. Adjustments
may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly
recommend prior consultation of our personal.

Absolute Maximum Ratings

Symbol

Conditions

Values

Unit

Supply voltage primary

Input signal voltage (HIGH)

Vs + 0.3

Input signal voltage (LOW)

GND - 0.3

Iout

PEAK

Output peak current

Iout

AVmax

Output average current

max

Max. switching frequency

kHz

Collector emitter voltage sense across
the IGBT

1700

dv/dt

Rate of rise and fall of voltage
secondary to primary side

kV/µs

isol IO

Isolation test voltage input - output
(AC, rms, 2s)

4000

isolPD

Partial discharge extinction voltage,
rms, Q

10pC

1500

isol12

Isolation test voltage output 1 - output
2 (AC, rms, 2s)

1500

Gon min

Minimum rating for external R

Gon

1.5

Goff min

Minimum rating for external R

Goff

1.5

out/pulse

Max. rating for output charge per pulse

2.5

µC

Operating temperature

-40 ... 85

°C

stg

Storage temperature

-40 ... 85

°C

Characteristics

Symbol

Conditions

min.

typ.

max.

Unit

Supply voltage primary side

14.4

15.6

Supply current primary (no load)

Supply current primary side (max.)

450

Input signal voltage on / off

15 / 0

IT+

Input treshold voltage HIGH

12.3

IT-

Input threshold voltage (LOW)

4.6

Input resistance (switching/HALT
signal)

G(on)

Turn on output voltage

G(off)

Turn off output voltage

-7

ASIC

Asic system switching frequency

MHz

d(on)IO

Input-output turn-on propagation time

1.1

µs

d(off)IO

Input-output turn-off propagation time

1.1

µs

d(err)

Error input-output propagation time

5.4

7.9

µs

pERRRESET

Error reset time

µs

Top-Bot interlock dead time

4.3

µs

Coupling capacitance prim sec

MTBF

Mean Time Between Failure Ta = 40°C

2.5

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

Technical Explanations

Revision

Status:

Prepared by:

Johannes Krapp

This Technical Explanation is valid for the following parts:

Related Documents:

part number:

L6100104

title:

Data Sheet SKYPER 32 R UL

date code (YYWW):

≥

1030

SKYPER

32 R UL

Content

Application and Handling Instructions .................................................................................................................... 2

Further application support ..................................................................................................................................... 2

General Description ................................................................................................................................................ 2

Features of SKYPER 32 R UL................................................................................................................................ 2

UL specified remarks .............................................................................................................................................. 3

Block diagram ......................................................................................................................................................... 3

Dimensions ............................................................................................................................................................. 3

PIN Array – Primary Side........................................................................................................................................ 4

PIN Array – Secondary Side................................................................................................................................... 5

Driver Performance................................................................................................................................................. 6

Insulation................................................................................................................................................................. 6

Isolation Test Voltage ............................................................................................................................................. 7

Auxiliary Power Supply ........................................................................................................................................... 7

Under Voltage Protection of driver power supply (UVP) ........................................................................................ 8

Input Signals ........................................................................................................................................................... 8

Short Pulse Suppression (SPS) ............................................................................................................................. 8

Failure Management............................................................................................................................................... 9

Shut Down Input (SDI)............................................................................................................................................ 9

Dead Time generation (Interlock TOP / BOT) (DT).............................................................................................. 10

Dynamic Short Circuit Protection by V

CEsat

monitoring / de-saturation monitoring (DSCP).................................. 10

Adjustment of DSCP............................................................................................................................................. 11

High Voltage Diode for DSCP............................................................................................................................... 12

Gate resistors ....................................................................................................................................................... 12

External Boost Capacitors (BC)............................................................................................................................ 13

Application Example ............................................................................................................................................. 13

Mounting Notes..................................................................................................................................................... 14

Environmental Conditions..................................................................................................................................... 14

Marking ................................................................................................................................................................. 15

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

SKYPER 32

Application and Handling Instructions

Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.

Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubbers between main terminals for PLUS and MINUS of the power module.

When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.

It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.

The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V

+0,3V or below -0,3V may destroy

these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.

The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.

Further application support

Latest information is available at

http://www.semikron.com

. For design support please read the SEMIKRON Application

Manual Power Modules available at

http://www.semikron.com

General Description

The SKYPER 32 core constitutes an interface between IGBT modules and the controller. The driver is developed according
to the requirements of UL standard. This core is a half bridge driver. Basic functions for driving, potential separation and
protection are integrated in the driver. Thus it can be used to build up a driver solution for IGBT modules.

Features of SKYPER 32 R UL

Two output channels

Integrated potential free power supply for the secondary side

Short Pulse Suppression (SPS)

Under Voltage Protection (UVP)

Drive interlock (dead time) top / bottom (DT)

Dynamic Short Circuit Protection (DSCP) by V

monitoring and direct

switch off

Shut Down Input (SDI)

Failure Management

Expandable by External Boost Capacitors (BC)

DC bus voltage up to 1200V

Please note:

Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in
large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating
parameters should be validated by user’s technical experts for each application.

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

UL specified remarks

The equipment shall be installed in compliance with the mounting and spacing requirements of the end-use application.

SKYPER 32 shall be supplied by an isolated limited voltage / limited current source or a Class 2 source. The 15 A peak
rating is an instantaneous peak rating only.

These devices do not incorporate solid-state motor overload protection. The need for overload protection and over-
current protection devices shall be determined in the end-use product.

These devices have not been evaluated to over-voltage, over-current, and over-temperature control, and may need to
be subjected to the applicable end-product tests.

Temperature and tests shall be considered in the end use. Due to the limited current source, only the effect of heat
generating components in this device on adjacent components in the end product needs to be considered.

Connectors have not been evaluated field wiring; all connections are to be factory wired only.

Block diagram

Dimensions

Dimensions in mm (bottom view)

(top view)

±0,2mm unless otherwise noted

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

PIN Array – Primary Side

Connectors

Connector X10 (RM2,54, 10pin)

±0,25mm unless otherwise noted

PIN

Signal

Function

Specification

X10:01

PRIM_PWR_GND

GND for power supply and GND for digital
signals

X10:02

PRIM_PWR_GND

GND for power supply and GND for digital
signals

X10:03

PRIM_nERROR_OUT

ERROR output

LOW = NO ERROR; open collector output;
max. 30V / 15mA

(external pull up resistor necessary)

X10:04

PRIM_nERROR_IN

ERROR input

5V logic; LOW active

X10:05

PRIM_PWR_GND

GND for power supply and GND for digital
signals

X10:06

PRIM_PWR_GND

GND for power supply and GND for digital
signals

X10:07

PRIM_TOP_IN

Switching signal input (TOP switch)

Digital 15 V; 10 kOhm impedance;
LOW = TOP switch off;
HIGH = TOP switch on

X10:08

PRIM_BOT_IN

Switching signal input (BOTTOM switch)

Digital 15 V; 10 kOhm impedance;
LOW = BOT switch off;
HIGH = BOT switch on

X10:09

PRIM_PWR_15P

Drive core power supply

Stabilised +15V ±4%

X10:10

PRIM_PWR_15P

Drive core power supply

Stabilised +15V ±4%

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

PIN Array – Secondary Side

Connectors

Connector X100 / X200 (RM2,54, 10pin)

±0,25mm unless otherwise noted

PIN

Signal

Function

Specification

X100:01

SEC_TOP_VCE_CFG

Input reference voltage adjustment

X100:02

SEC_TOP_VCE_IN

Input V

monitoring

X100:03

SEC_TOP_15P

Output power supply for external buffer
capacitors

Stabilised +15V

X100:04

SEC_TOP_15P

Output power supply for external buffer
capacitors

Stabilised +15V

X100:05

SEC_TOP_GND

GND for power supply and GND for digital
signals

X100:06

SEC_TOP_IGBT_ON

Switch on signal TOP IGBT

X100:07

SEC_TOP_GND

GND for power supply and GND for digital
signals

X100:08

SEC_TOP_IGBT_OFF

Switch off signal TOP IGBT

X100:09

SEC_TOP_8N

Output power supply for external buffer
capacitors

Stabilised -7V

X100:10

SEC_TOP_8N

Output power supply for external buffer
capacitors

Stabilised -7V

X200:01

SEC_BOT_VCE_CFG

Input reference voltage adjustment

X200:02

SEC_BOT_VCE_IN

Input V

monitoring

X200:03

SEC_BOT_15P

Output power supply for external buffer
capacitors

Stabilised +15V

X200:04

SEC_BOT_15P

Output power supply for external buffer
capacitors

Stabilised +15V

X200:05

SEC_BOT_GND

GND for power supply and GND for digital
signals

X200:06

SEC_BOT_IGBT_ON

Switch on signal BOT IGBT

X200:07

SEC_BOT_GND

GND for power supply and GND for digital
signals

X200:08

SEC_BOT_IGBT_OFF

Switch off signal BOT IGBT

X200:09

SEC_BOT_8N

Output power supply for external buffer
capacitors

Stabilised -7V

X200:10

SEC_BOT_8N

Output power supply for external buffer
capacitors

Stabilised -7V

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

Driver Performance

The  driver  is  designed  for  application  with  half  bridges  or  single  modules  and  a  maximum  gate  charge  per  pulse
<  2,5µC  (<  6,3µC  with  external  boost  capacitors).  The  charge  necessary  to  switch  the  IGBT  is  mainly  depending  on  the
IGBT’s  chip  size,  the  DC-link  voltage  and  the  gate  voltage.  This  correlation  is  shown  in  module  datasheets.  It  should,
however, be considered that the driver is turned on at +15V and turned off at -7V. Therefore, the gate voltage will change by
22V  during  each  switching  procedure.  Unfortunately,  many  datasheets  do  not  show  negative  gate  voltages.  In  order  to
determine  the  required  charge,  the  upper  leg  of  the  charge  curve  may  be  prolonged  to  +22V  for  determination  of
approximate charge per switch.
The  medium  output  current  of  the  driver  is  determined  by  the  switching  frequency  and  the  gate  charge.  The  maximum
switching  frequency  may  be  calculated  with  the  shown  equation and is limited  by  the  average current  of  the driver  power
supply and the power dissipation of driver components.

Calculation Switching Frequency

Maximum Switching Frequency @ different Gate Charges @ T

amb

=25°C

max

: Maximum switching frequency *

Iout

AVmax

: Maximum output average current

: Gate charge of the driven IGBT

* @ T

amb

=25°C

0 kHz

10 kHz

20 kHz

30 kHz

40 kHz

50 kHz

60 kHz

0 µC

1 µC

2 µC

3 µC

4 µC

5 µC

6 µC

7 µC

gate charge

with external boost capacitors

Calculation Average Output Current

Average Output Current as a Function of the Ambient Temperature

Iout

: Average output current

: Switching frequency

Gate charge of the driven IGBT

0 mA

10 mA

20 mA

30 mA

40 mA

50 mA

60 mA

0 °C

10 °C

20 °C

30 °C

40 °C

50 °C

60 °C

70 °C

80 °C

90 °C

ambient temperature

Insulation

Magnetic transformers are used for insulation between gate driver primary and secondary side. The transformer set consists
of  pulse  transformers  which  are  used  bidirectional  for  turn-on  and  turn-off  signals  of  the  IGBT  and  the  error  feedback
between  secondary  and  primary  side,  and  a  DC/DC  converter.  This  converter  provides  a  potential  separation  (galvanic
separation)  and  power  supply  for  the  two  secondary  (TOP  and  BOT)  sides  of  the  driver.  Thus,  external  transformers  for
external power supply are not required.

Creepage and Clearance Distance in mm

Primary to secondary

Min. 12,2

Please note:

The maximum value of the switching frequency is limited to 50kHz due to switching reasons.

max

Iout

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

Isolation Test Voltage

The  isolation  test  voltage  represents  a  measure  of  immunity  to  transient  voltages.  The  maximum  test  voltage  and  time
applied  once between  input  and  output,  and  once between  output 1  and output  2  are  indicated  in  the absolute  maximum
ratings.  The  high-voltage  isolation  tests  and  repeated  tests  of  an  isolation  barrier  can  degrade  isolation  capability  due  to
partial  discharge.  Repeated  isolation  voltage  tests  should  be  performed  with  reduced  voltage.  The  test  voltage  must  be
reduced by 20% for each repeated test.
The  isolation  of  the  isolation  barrier  (transformer)  is  checked  in  the  part. With  exception  of  the  isolation  barrier,  no  active
parts,  which  could  break  through  are  used.  An  isolation  test  is  not  performed  as  a  series  test.  Therefore,  the  user  can
perform once the isolation test with voltage and time indicated in the absolute maximum ratings.

Auxiliary Power Supply

A few basic rules should be followed when dimensioning the customer side power supply for the driver. The following table
shows the required features of an appropriate power supply.

Requirements of the auxiliary power supply

Regulated power supply

+15V ±4%

Maximum rise time of auxiliary power supply

50ms

Minimum peak current of auxiliary supply

Power on reset completed after

150ms

The supplying switched mode power supply may not be turned-off for a short time as consequence of its current limitation.
Its output characteristic needs to be considered. Switched mode power supplies with fold-back characteristic or hiccup-mode
can create problems if no sufficient over current margin is available. The voltage has to rise continuously and without any
plateau formation as shown in the following diagram.

Rising slope of the power supply voltage

If  the  power  supply  is  able  to  provide  a  higher  current,  a  peak  current  will  flow  in  the  first  instant  to  charge  up  the  input
capacitances  on  the  driver.  Its  peak  current  value  will  be  limited  by  the  power  supply  and  the  effective  impedances  (e.g.
distribution lines), only.
It is recommended to avoid the paralleling of several customer side power supply units. Their different set current limitations
may lead to dips in the supply voltage.
The  driver  is  ready  for  operation  typically  150ms  after  turning  on  the  supply  voltage.  The  driver  error  signal
PRIM_nERROR_OUT is operational after this time. Without any error present, the error signal will be reset.
To  assure a  high  level  of  system safety  the  TOP  and  BOT signal inputs  should stay  in  a  defined  state  (OFF state,  LOW)
during driver turn-on time. Only after the end of the power-on-reset, IGBT switching operation shall be permitted.

Please note:

Do not apply switching
signals during power on
reset.

Please note:

An isolation test is not performed at SEMIKRON as a series test.

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

Under Voltage Protection of driver power supply (UVP)

The internally detected supply voltage of the driver has an under voltage protection. The table below gives an overview of
the trip level.

Supply voltage

UVP level

Regulated +15V ±4%

13,5V

If the internally detected supply voltage of the driver falls below this level, the IGBTs will be switched off (IGBT driving
signals set to LOW). The input side switching signals of the driver will be ignored. The error memory will be set, and the
output PRIM_nERROR_OUT changes to the HIGH state.

Input Signals

The signal transfer to each IGBT is made with pulse transformers, used for switching on and switching off of the IGBT. The
inputs have a Schmitt Trigger characteristic and a positive / active high logic (input HIGH = IGBT on; input LOW = IGBT off).
It is mandatory to use circuits which switch active to +15V and 0V. Pull up and open collector output stages must not be
used for TOP / BOT control signals. It is recommended choosing the line drivers according to the demanded length of the
signal lines.

TOP / BOT Input

A capacitor is connected to the input to obtain high noise immunity.
This capacitor can cause for current limited line drivers a little delay of
few ns, which can be neglected. The capacitors have to be placed as
close as possible to the driver interface.

Short Pulse Suppression (SPS)

This circuit suppresses short turn-on and off-pulses of incoming signals. This way the IGBTs are protected against spurious
noise as they can occur due to bursts on the signal lines. Pulses shorter than 625ns are suppressed and all pulses longer
than 750ns get through for 100% probability. Pulses with a length in-between 625ns and 750ns can be either suppressed or
get through.

Pulse pattern – SPS

short pulses

PRIM_TOP/BOT_IN (HIGH)

PRIM_TOP/BOT_IN (LOW)

SEC_TOP/BOT_IGBT_ON

SEC_TOP/BOT_IGBT_OFF

Please note:

It is not permitted to apply switching pulses shorter than 1µs.

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

Failure Management

Any error detected will set the error latch and force the output PRIM_nERROR_OUT into HIGH state. Switching pulses from
the controller will be ignored. Connected and switched off IGBTs remain turned off. The switched off IGBTs remain turned
off. A reset of the latched error memory is only possible if no failure is present anymore and if the TOP and BOT input
signals are set to the LOW level for a period of t

pERRRESET

> 9µs.

The output PRIM_nERROR_OUT is an open collector output. For the error evaluation an external pull-up-resistor is
necessary pulled-up to the positive operation voltage of the control logic (LOW signal = no error present, wire break safety is
assured).

Open collector error transistor

Application hints

An external resistor to the controller logic high level is required. The
resistor has to be in the range of V

/ I

max

< R

pull_up

< 10k

Ω

PRIM_nERROR_OUT can operate to maximum 30V and can switch
a maximum of 15mA.

Example:

For V

= +15V the needed resistor should be in the range

pull_up

= (15V/15mA) … 10k

Ω

⇒

Ω

… 10k

Ω

Shut Down Input (SDI)

The shut down input / error input signal can gather error signals of other hardware components for switching off the IGBT
(input HIGH = no turn-off; input LOW = turn-off).
A  LOW  signal  at  PRIM_nERROR_IN  will  set  the  error  latch  and  force  the  output  PRIM_nERROR_OUT  into  HIGH  state.
Switching pulses from the controller will be ignored. A reset of the latched error memory is only possible if no LOW signal at
PRIM_nERROR_IN  is  present  anymore  and  if  the  TOP  and  BOT  input  signals  are  set  to  the  LOW  level  for  a  period  of
t

pERRRESET

> 9µs.

The SDI function can be disabled by no connection or connecting to 5V.

Connection SDI

Please note:

The error output PRIM_ERROR_OUT is not short circuit proof.

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

Dead Time generation (Interlock TOP / BOT) (DT)

The DT circuit prevents, that TOP and BOT IGBT of one half bridge are switched on at the same time (shoot through). The
dead time is not added to a dead time given by the controller. Thus the total dead time is the maximum of "built in dead time"
and "controller dead time". It is possible to control the driver with one switching signal and its inverted signal.

Pulse pattern – DT

The total propagation delay of the driver is the sum of

interlock dead time (t

) and driver input output signal

propagation delay (t

d(on;off)IO

) as shown in the pulse pattern.

Moreover the switching time of the IGBT chip has to be taken
into account (not shown in the pulse pattern).

case

both

channel

inputs

(PRIM_TOP_IN

and

PRIM_BOT_IN) are at high level, the IGBTs will be turned off.

If only one channel is switching, there will be no interlock

dead time.

Dynamic Short Circuit Protection by V

CEsat

monitoring / de-saturation monitoring (DSCP)

The DSCP circuit is responsible for short circuit sensing. It monitors the collector-emitter voltage V

of the IGBT during its

on-state. Due to the direct measurement of V

CEsat

on the IGBT's collector, the DSCP circuit switches off the IGBTs and an

error is indicated.

The reference voltage V

CEref

may dynamically be adapted to the IGBTs switching behaviour. Immediately after turn-on of the

IGBT, a higher value is effective than in steady state. This value will, however, be reset, when the IGBT is turned off. V

CEstat

is the steady-state value of V

CEref

and is adjusted to the required maximum value for each IGBT by an external resistor R

It may not exceed 10V. The time constant for the delay (exponential shape) of V

CEref

may be controlled by an external

capacitor C

, which is connected in parallel to R

. It controls the blanking time t

which passes after turn-on of the IGBT

before the V

CEsat

monitoring is activated. This makes an adaptation to any IGBT switching behaviour possible.

Reference Voltage (V

CEref

) Characteristic

After t

has passed, the V

monitoring will be triggered as soon as V

> V

CEref

and will turn off the IGBT. The error

memory will be set, and the output PRIM_nERROR_OUT changes to the HIGH state. Possible failure modes are shows in
the following pictures.

Please note:

The generated dead time is fixed and cannot be changed.

Please note:

No error message will be generated when overlap of switching signals occurs.

SKYPER

32 R UL

Rev 0 – 11.08.2010

© by SEMIKRON

Short circuit during operation

Turn on of IGBT too slow *

Short circuit during turn on

* or adjusted blanking time too short

Adjustment of DSCP

The external components R

and C

are applied for adjusting the steady-state threshold the blanking time.

Connection R

and C

Dimensioning of R

and C

[ ]













Ω

⋅

−

⋅

Ω

−

Ω

VCE

CEstat

[

]

[ ]

00323

⋅

Ω

−

CEstat

Collector-emitter threshold static monitoring voltage

blx

Blanking time

CEstat_max

= 8V (R

VCE

= 0

Ω

)

CEstat_max

= 7V (R

VCE

= 1k

Ω

)

Please Note:

The equations are calculated considering the use of high voltage diode
BY203/20S. The calculated values V

CEstat

and t

are typical values at room

temperature. These values can and do vary in the application (e.g. tolerances of
used high voltage diode, resistor R

, capacitor C

The DSCP function is not recommended for over current protection.

Application hints

If the DSCP function is not used, for example during the experimental phase, SEC_TOP_VCE_IN must be connected with
SEC_TOP_GND for disabling SCP @ TOP side and SEC_BOT_VCE_IN must be connected with SEC_BOT_GND for disabling SCP @
BOT side.

SKYPER

32 R UL

Rev 0 – 11.08.2010

High Voltage Diode for DSCP

The high voltage diode blocks the high voltage during IGBT off state. The connection of this diode between driver and IGBT
is shown in the following schematic.

Connection High Voltage Diode

Characteristics

Reverse blocking voltage of the diode shall be higher than the

used IGBT.

Reverse recovery time of the fast diode shall be lower than V

rising of the used IGBT.

Forward voltage of the diode: 1,5V @ 2mA forward current

=25°C).

A collector series resistance R

VCE

(1k

Ω

/ 0,4W) must be

connected for 1700V IGBT operation.

Gate resistors

The output transistors of the driver are MOSFETs. The sources of the MOSFETs are separately connected to external
terminals in order to provide setting of the turn-on and turn-off speed of each IGBT by the external resistors R

Gon

and R

Goff

As an IGBT has input capacitance (varying during switching time) which must be charged and discharged, both resistors will
dictate what time must be taken to do this. The final value of the resistance is difficult to predict, because it depends on
many parameters as DC link voltage, stray inductance of the circuit, switching frequency and type of IGBT.

Connection R

Gon

, R

Goff

Application Hints

The  gate  resistor  influences  the  switching  time,  switching  losses,
dv/dt behaviour, etc. and has to be selected very carefully. Due to
this  influence  a  general  value  for  the  gate  resistors  cannot  be
recommended.  The  gate  resistor has  to  be  optimized  according  to
switching  behaviour  and  over  voltage  peaks  within  the  specific
circuitry.

By  increasing  R

Gon

the turn-on speed will decrease. The reverse

peak current of the free-wheeling diode will diminish.

By increasing R

Goff

the turn-off speed of the IGBT will decrease. The

inductive peak over voltage during turn-off will diminish.

In order to ensure locking of the IGBT even when the driver supply
voltage is turned off, a resistance (R

) has to be integrated.

Please note:

Do not connect the terminals SEC_TOP_IGBT_ON with SEC_TOP_IGBT_OFF and SEC_BOT_IGBT_ON
with SEC_BOT_IGBT_OFF, respectively.

SKYPER

32 R UL

Rev 0 – 11.08.2010

External Boost Capacitors (BC)

The rated gate charge of the driver may be increase by additional boost capacitors to drive IGBT with large gate
capacitance.

Connection External Boost Capacitors

Dimensioning of C

boost

boost15P

[µF] = Q

[µC] × 1/V - 2,2µF

boost8N

[µF] = Q

[µC] × 2/V - 4,7µF

: Gate charge of the IGBT @ V

= -7 …+15V

Minimum rated voltage C

boost15P

: 25V

Minimum rated voltage C

boost8N

: 16V

Type of capacitor: ceramic capacitor

Please consider the maximum rating four output charge per
pulse of the gate driver.

Application Hints

The external boost capacitors should be connected as close as
possible to the gate driver and to have low inductance.

Application Example

Connection Schematic

1nF
100V

+15V

1nF

100V

INPUT BOT

INPUT TOP

1nF

100V

220µF

35V

ERROR OUT

1nF

100V

4,75k

BY203/20S

DC+

10k

16V

4,7µF

2,2µF

25V

BY203/20S

10k

4,7µF

16V

2,2µF

25V

DC-

load

18k

330pF

50V

Ron

Roff

18k

330pF

50V

Ron

Roff

SEC_TOP_VCE_CFG

SEC_TOP_VCE_IN

SEC_TOP_15P

SEC_TOP_GND

SEC_TOP_IGBT_ON

SEC_TOP_GND

SEC_TOP_IGBT_OFF

SEC_BOT_VCE_CFG

SEC_BOT_VCE_IN

SEC_BOT_15P

SEC_BOT_GND

SEC_BOT_IGBT_ON

SEC_BOT_GND

SEC_BOT_IGBT_OFF

PRIM_PWR_GND

PRIM_nERROR_OUT

PRIM_nERROR_IN

PRIM_PWR_GND

PRIM_TOP_IN

PRIM_BOT_IN

PRIM_PWR_15P

SKYPER

SEC_TOP_8N

SEC_BOT_8N

- application example for 1200V IGBT
- Q

out/pulse

= 5µC

- V

CEref

= 5,5V

- t

= 5,5µs

SKYPER

32 R UL

Rev 0 – 11.08.2010

Mounting Notes

Soldering Hints

Finished Hole & Pad Size in mm

The temperature of the solder must not exceed 260°C, and solder time must
not exceed 10 seconds.

The ambient temperature must not exceed the specified maximum storage
temperature of the driver.

The solder joints should be in accordance to IPC A 610 Revision D (or later) -
Class 3 (Acceptability of Electronic Assemblies) to ensure an optimal
connection between driver core and printed circuit board.

The connection between driver core and printed circuit board should be mechanical reinforced by using support posts.

Use of Support Posts

Product information of suitable support posts and
distributor contact information is available at e.g.
http://www.richco-inc.com

(e.g.

series

DLMSPM,

LCBST

Environmental Conditions

The driver core is type tested under the environmental conditions below.

Conditions

Values (max.)

Vibration

Sinusoidal sweep 20Hz … 500Hz, 5g, 26 sweeps per axis (x, y, z)

- Tested acc. IEC 68-2-6

- Connection between driver core and printed circuit board mechanical reinforced by using support posts.

Shock

Half-sinusoidal pulse, 5g, shock width 18ms, 3 shocks in each direction (±x, ±y, ±z), 18 shocks in total

- Tested acc. IEC 68-2-27

- Connection between driver core and printed circuit board mechanical reinforced by using support posts.

The characteristics and further environmental conditions are indicated in the data sheet.

Please note:

The use of agressive materials in cleaning and potting process of driver core may be detrimental for the device parameters. If the driver
core is coated by the user, any warranty (Gewährleistung) expires.

Please note:

The driver is not suited for hot air reflow or infrared reflow processes.

SKYPER

32 R UL

Rev 0 – 11.08.2010

Marking

Every driver core is marked. The marking contains the following items.

Part Marking Information

1. SEMIKRON part number (8 digits) + version number (2 digits)

2. Date code (4 digits): YYWW

3. Continuous number referred to date coce (4 digits)

4. Data matrix code

The Data Matrix Code is described as follows:

Type:

EEC 200

Standard:

ICO / IEC 16022

Cell size:

0,254 - 0,3 mm

Dimension:

5 mm

The following data is coded:

XXXXXXXXYY ZZZZ VVVV

8 digits

2 digits

part number
version number

1 digit

blank

4 digits

date code

1 digit

blank

4 digits

continuous number

DISCLAIMER

SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design.
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume
any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical
information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed
or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information
previously supplied and may be superseded by updates without further notice.

SEMIKRON products are not authorized for use in life support appliances and systems without the express written
approval by SEMIKRON.

www.SEMIKRON.com