C
APAX
T
ECHNOLOGIES
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NC
º
24842 A
VE
T
IBBITTS
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V
ALENCIA
, C
A
º
91355
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661.257.7666
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AX
: 661.257.4819
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APAX
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ECHNOLOGIES
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OM
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AGE
1
º
Parallel Plate Ceramic Single Layer Microwave Capacitors (SLCs)
are ideally suited for applications such as GaAs integrated
circuits, microwave integrated circuits, DC block, bypass, and tuning,
and RF/microwave components. The SLC design offers
increased capacitance for additional bandwidth, increased stability in
capacitance over various temperatures, and more capacitance in
smaller case sizes for greater board density.
SLCs are suitable solutions for applications that require:
•
Through 40 GHz with minimum insertion loss.
•
Specified material from a selection of fourteen standard
dielectric options.
•
Imperviousness to electrostatic discharge and more ruggedness than MOS/MNS capacitors.
•
Gold plated electrode termination, which is compatible with solder, eutectic, epoxy and wire
bonding production methods.
C
ASE
D
IMENSIONS
in Inches (mm)
Case Size
P10
P13
P15
P20
P25
P30
P35
P40
P50
P70
P90
PA0
Width (W)
.010
(.254)
.013
(.330)
.015
(.381)
.020
(.508)
.025
(.635)
.030
(.762)
.035
(.889)
.040
(1.02)
.050
(1.27)
.070
(1.78)
.90
(2.29)
.100
(2.54)
Length (L)
.010
(.254)
.013
(.330)
.015
(.381)
.020
(.508)
.025
(.635)
.030
(.762)
.035
(.889)
.040
(1.02)
.050
(1.27)
.070
(1.78)
.100
(2.54)
.100
(2.54)
Thickness
(50V)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
—
—
—
—
Thickness
(100V)
.007
(.178)
.007
(.178)
.007
(.178)
.007
(.178)
.007
(.178)
.007
(.178)
.007
(.178)
.007
(.178)
.008
(.203)
.008
(.203)
.009
(.229)
.010
(.254)
** Tolerance: ±.002 (.050) or 10%
M
ECHANICAL
•
Bond Strength: Exceeds MIL-STD-883,
Method 2011 Destructive Bond Pull Test
•
Die Shear Strength: Exceeds applicable
MIL-STD-883 requirements.
E
NVIRONMENTAL
•
Low Voltage Humidity: Paragraph 3.17, MIL-C-49464
•
Burn-in/Life Test: MIL-STD-202, Method 108, Condition A/F
•
Solderability: MIL-STD-202, Method 208
H
IGH
R
ELIABILITY
T
ESTING
•
Group A: 100 Hour burn-in, 100% screening.
•
Group B: Group A tests, solderability, bond strength,
die shear strength, and temperature coefficient.
•
Group C: Group B tests, thermal shock, resistance to
soldering heat, low voltage humidity, and life test.
General Specifications
C
AP
W
L
S
TRIPLINE
T
HICKNESS
Ceramic Single-Layer
Microwave Capacitors
Technologies, Inc