SamtecCompanyOverviewandInterconnect-html.html

AGENDA

9.00am Samtec Company Overview

9h15

Samtec Interconnect:

Flyover Cables

Backplane & Arrays

High Speed and Rugged

10h45 Samtec Optical Group:

Overview of FireFly and roadmap.
FireFly used in a FPGA application: examples

PCIe over FireFly

Introduction to COBO (Consortium for On-Board Optic)

11h15 Samtec Microelectronics:

Micro Interposers
Micro-Electronics Capabilities

Case Studies

Glass Core packaging (GCP)

11h45 Samtec Signal Integrity Support:

12h05 Questions

Samtec was founded in 1976 in

New Albany, Indiana USA.

Samtec is privately held and debt free

with sales over $625M in 2015.

Samtec has 5A1 Dun & Bradstreet

Rating – the highest rating for current

and future business health.

Samtec has been awarded the annual

honor of #1 Connector Manufacturing

15 times by Bishop and Associates.

PROFILE

TOP 20

2015 Interconnect manufacturers in an

industry with over 1,000 competitors

1. TE Connectivity

$14,154

2. Amphenol

$4,832

3. Molex

$4,356

4. Delphi DCS

$2,607

5. Hon Hai/Foxconn

$2,443

6. JST

$1,556

7. JAE

$1,449

8. Hirose

$1,121

9. Huber+Suhner

$858

10. Rosenberger

$855

11. Harting

$692

12. Samtec

$625

13. FCI

$598

14. Furukawa

$548

15. Glenair

$543

16. Fujikura

$534

17. Foxlink

$479

18. Hosiden

$478

19. Volex

$472

20. ITT Cannon

$463

* Competitor numbers based on 2015 sales

To meet the interconnect challenges of tomorrow and beyond, we have developed

technology centers to help optimize your entire signal transmission path… from the

IC to the panel and all points in between.

TECH CENTERS

ADVANCED

INTERCONNECT

DESIGN

SIGNAL

INTEGRITY

GROUP

HIGH SPEED

CABLE PLANT

OPTICAL

GROUP

PACKAGING

TERASPEED

CONSULTING

TECH CENTERS

Advanced Interconnect Design Group

High precision stamping, plating, molding, and automated assembly for fine pitch and array

interconnects used for board-to-board, interposers, micro backplane, and high speed/high

density cable assemblies.

SEARAY™ 1,27 mm

28 Gbps Open Pin Field Arrays

40-500 Positions

SEARAY™ 0,80 mm

28 Gbps

Highest Density Arrays

up to 720 Positions

SEARAY™ LP

34 Gbps Low Profile Arrays

down to 4 mm

SkyRay™

28 Gbps

Elevated Arrays

Q Strip®

28 Gbps Low Profile

Ground Plane Connectors

Edge Rate™

28 Gbps Rugged Connectors

High Speed Backplane

25 to 56 Gbps Solutions

TECH CENTERS

Signal Integrity Group

High speed characterization reports, simulations up to 40 GHz, advanced breakout regions
using technologies such as Differential Vias™ and routing recommendations using
Tri-Planar™ trace technology. Live EE support is available worldwide 24/7.

Live EE Support

24/7 Access to

Signal Integrity Support

Final Inch®

Performance Certified

Break Out Regions

Simulator™

Simulate in a Minute™ Performance Verification

for Mated Connector Sets and Cables

Differential Vias™

High Speed Array

Breakout Region Technology

TECH CENTERS

Teraspeed Consulting

Signal Integrity Services team providing complete system design, full channel signal integrity

analysis, and SI optimized advanced IC packaging for 28 Gbps and beyond.

IC Packaging

Optimized

Modeling, Simulation,

and Measurements

up to 56 Gbps

Electromagnetic Modeling

Modeling, Simulations, Testing

and Measurements

Signal and Power

Integrity

Analysis, Design,

Engineering, and Verification

System Engineering

Full system solutions from

silicon-to-silicon

Thermal Management

Solutions for high density /

high power systems

Eye Speed®

High Performance/

Dynamic Applications

AcceleRate™

High Performance/Lowest Cost

Equalized

Passive or Active for 25-40%

Increased Performance

Z-Ray®

High Speed

Low Profile Interposer

56 Gbps down to 0.30 mm

up to 1,000 Pins

Bull's Eye®

20+ GHz Test Point System

TECH CENTERS

High Speed Cable Plant

R&D and manufacturing of precision extruded micro coax and TwinAx cable used for high speed/high

density cable assemblies. Capabilities include 26-

38 AWG center conductors, 50/75/85/100 Ω

impedance, and assemblies rated at 28 Gbps.

TECH CENTERS

Optics Group

Engineering team dedicated to the design, development, and application support of high performance micro

optical engines, active optical assemblies, and high density ganged passive optical panel solutions. Capable of

14 Gbps, 28 Gbps, and soon 56 Gbps. Samtec’s FireFly™ micro on-board optical engines occupy the smallest

overall footprint, consume the least amount of power, and enable fast, easy and low cost fiber termination.

QSFP+ 14 Gbps

InfiniBand™ QDR

up to 100 m

PCIe® Optic

Supports Gen 3 PCIe® up to 100 m

FireFly™

14 Gbps | 28 Gbps | 56 Gbps

Micro Flyover

Future-proof Copper or Optical

Highest Bandwidth Density Available

56 Gbps

14 Gbps

28 Gbps

TECH CENTERS

IC Packaging Group

Advanced IC packaging with precision die attach, fine pitch/low profile wire bonding, flip chip/underfill, and

dam/encapsulation capabilities. Complete “IC-to-Board” design, application support and manufacturing for

custom IC packaging, substrates, and micro high density interposers. Advanced IC packaging services include

layouts for signal integrity and power optimization, package/materials characterization and structural analysis.

Also, manufacturing of Samtec’s micro optical engines.

Z-Ray®

High Speed

Low Profile Interposer

28 Gbps down to 0.30 mm

up to 1,000 Pins

Flip Chip

Accuracy to

+/- 3 µm

Wire Bond

Diameters Starting at 0.0007" (19 µm)

Dam & Encapsulate

Automated or Manual Encapsulation

Die Attach

Accuracy to

+/- 3 µm

We’re the only company focusing on the

entire signal channel, from the silicon to

the panel, because we know SI is a full

channel challenge.

You can expect faster speeds and

smaller footprints across solutions

that span the entire signal channel

transmission path.

MICRO BACKPLANE

IC PACKAGING

HIGH SPEED

CABLE

ACTIVE OPTICS

RF, TEST &

DEBUG

HIGH SPEED

EDGE CARD

PANEL & I/O

MICRO INTERPOSERS

BOARD LEVEL

INTERCONNECTS

Full Signal Channel Solutions

MICRO FLYOVER SYSTEMS™

CHIP-TO-CHIP

CHIP-TO PANEL

BACKPLANE

COPPER

(1) FireFly™ copper

(2) FQSFP Flyover

(3) ExaMAX™ Fly-under

OPTICS

N/A

(4) FireFly™ + GMPO I/O

(5) FireFly™ + GMPO BP

THESE ARE SOME OF THE REASONS FOR FLYOVER

Bandwidth\

Materials\Reach

FR408

MEGTRON 6

Micro-Twinax

Optics

10 Gbps

<10”

10”+

14 Gbps

<5”

<10”

10”+

28 Gbps

<2”

<5”

10”+

56 Gbps

0.0”

<2”

<10”

10”+

112 Gbps

0.0”

<5”

10”+

LOSS IN dB PER INCH FOR 28 GBPS DESIGNS

28Gbit

14Gbit

PCB

Cable

Fiber

FR4

Megtron 4

ISpeed

Megtron 6

Tachyon

100G

PTFE

34 Gauge

30 Gauge

INTERCONNECT TECHNOLOGY

Highest Performance / Highest Density / Rugged / Future-Proof Design

•

x12 systems on 36 AWG TwinAx ribbon cable

•

x4 (34 AWG) and x12 (36 AWG) duplex systems

•

x4 (4 pair Tx, 4 pair Rx) with 100 Ω 34 AWG cable provides

•

Active and Passive Equalisation options

‒

Performance boost or allow longer cable lengths

•

Variety of end two termination options

•

Future-proof design: pin compatible with optical FireFly™

•

UEC5 0.5mm High speed edge card interface and UCC8 mechanical support

FireFly™ Micro Flyover System™

EQUALIZED X4 X12

IN DEVELOPMENT

28+ Gbps x4 & x12

IN DEVELOPMENT

FLYOVER APPLICATIONS

Save Valuable Real Estate / Eliminate Complex Routing

•

Takes advantage of real estate on the bottom side of the PCB to distribute

critical data to multiple locations

•

Z-Ray® high-density, ultra low profile micro interposer plus Eye Speed®

ultra low skew TwinAx cable

•

BGA-to-BGA high-speed signal “flyover”

•

Customizable selective signal mapping

Backside Interconnect Ultra High-Speed Low Skew TwinAx Fabric

FLYOVER APPLICATIONS - FQSFP

Bypass Signal Traffic & Loss / Controlled Impedance

•

Ultra low skew Eye Speed® TwinAx direct-to-MCM solution

•

Design bypasses BGA signal traffic and loss associated with

host boards

•

Chip-to-Chip impedance-controlled link with ultra low

skew TwinAx cabling

Direct Attach to Multi-Chip Module

DIRECT ATTACH

TO MCM

Z-RAY®

Ultra Low Profile

FireFly®

Future Proof

System

28G Right Angle

Edge Card

DCC

2.0

DCC

3.0

28+ Gbps

34+ Gbps

(Targeting up to 56

Gbps NRZ)

Up to 16 signal

pairs on

0.80 mm pitch

High density

“futureproof” system

for copper today and

equalized or active

optical tomorrow

Ultra Micro + Low

Costs

Meets SAS-4, PCIe®

Gen 4 and beyond

Lowest Cost HS

Cable-to-Board

Designed for

chip-to-chip high

speed signal traffic

* Data Rate based on Channel Operating Margin and/or OIF specifications

“END 2”

OPTIONS

HIGH SPEED

CABLE-TO-BOARD

SEARAY™ OPEN PIN FIELD ARRAYS

•

Three product types,

all with 28+ Gbps

performance

‒

SEARAY 1.27mm with IPC-A-610F Class 3 solder joint

‒

SEARAY 0.80 mm for highest density

‒

SEARAY LP for lowest profile

•

Lower insertion/extraction forces vs. typical

array products

•

Open pin field for maximum grounding and

routing flexibility

•

Differential Vias™ for optimized PCB routing in

DP applications

SEAF8-RA/SEAM-EW

•

Right-angle open-pin-field SEAF8

•

8 and 10 rows: Released

•

20, 30, 40, 50 positions per row

•

2X the density of SEAF-RA

•

SEAM-GP also released

SEAF8-RA

SEAF8-RA: RELEASED

SEAM8-EW: Q4 2016

•

Allows for

2 mm of wipe

when combined with SEAF8-RA

•

2 mm is the magic number for backplane connectors

SEAM8-EW (EXTENDED WIPE)

UBPS/UBPT

UBPS/UBPT – SEARAY

™

Power Modules

•

20 A per module (4 contacts x 5 Amps)

•

Designed for SEARAY and SEARAY .8 mm

•

Phase 1: DV-RA, Phase 2: DV-DV

•

Staging between ground and power

•

3 stages when combined with SEAXX

•

Press-fit termination only

UBPS/UBPT: Q4 2016

SEARAY™ LOW PROFILE

Series

LPAM, LPAF

SEARAY™ LP for lowest profile

•

Stack height: 4 mm, 4.5 mm or 5 mm

•

Pitch: 1.27 mm

•

Positions: 40 to 320

•

Termination: solder crimp

•

Dual beam contact system

•

Two points of contact for

higher reliability

•

Orientation: parallel

4mm

Stack height

As low as

* Data Rate based on Channel Operating Margin and/or OIF specifications

ROADMAP

ExaMAX

Traditional

BACKPLANE SYSTEM

ExaMAX® 2 mm

ExaMAX® 3 mm

ExaMAX® Plus

New System

28 Gbps NRZ

56 Gbps NRZ

56 Gbps PAM4

56 Gbps NRZ/

112 Gbps PAM4

Up to 8 pair/col,

2 mm column pitch

Up to 8 pair/col,

3 mm column pitch

Same or better density

than ExaMAX 2 mm

Better density than

ExaMAX 3 mm

Most Dense

Double track routing

Most Dense

Blazing fast and dense

ULTRA MICRO INTERCONNECTS

ROADMAP

56 to 100 Gbps Z-Ray®

Ultra Micro Cables

Z-Ray®

Multilayer System

•

Ultra Low Profile Interposers

•

Razor Beam™ Hermaphroditic Connectors

•

Razor Beam™ LP Low Profile Connectors

•

Edge Rate® Fine Pitch Connectors

Z-ray® low profile interposer

Specifications

•

56+ Gbps

•

4,000 cycles

•

Stack height: 0.30 mm to 4 mm

(1 mm standard)

•

.008” contact deflection

•

500 mA per line

•

25 grams per line of normal force

•

Differential Vias™ PCB routing available

0.30 mm

Stack height

as low as

Z-RAY® HARDWARE SYSTEMS

ZSO Series

Used with single-compression Z-Ray® products

that have beams that fully compress on one

side and solder balls on the other.

ZD Series

Used alongside off-the-shelf retention

hardware to provide alignment for dual-

compression Z-Ray® products.

ZHSI Series

Used with dual-compression Z-Ray® products

that have beams that fully compress on both

sides of the connector.

ZSO Series

ZHSI Series

ZD Series

HIGH SPEED EDGE CARD

High performance edge card, HSEC8 Series

•

Up to 37 Gbps, 0.80 mm pitch

•

Pass-through or signal/power combination available

•

Vertical, right angle, and edge mount

•

Rugged Edge Rate® contacts optimized for signal integrity performance

•

Optional board locks, cable latching, and weld tabs

Serial ATA, SAL1 Series

•

SATALink™ compatible, 1 mm pitch

•

Low profile, board stacking and routing flexibility

PCI Express® socket, PCIE Series

•

PCIe® compatible, 1 mm pitch

•

Vertical, right angle, and edge mount

HIGH SPEED BOARD-TO-BOARD SYSTEMS

•

Ground Plane connectors

•

Q Strip® 28+ Gbps Low Profile Connectors

•

Q Rate® 28+ Gbps Slim Connectors

•

Q2™ 28+ Gbps Rugged Connectors

•

Edge Rate

•

28+ Gbps Rugged Connectors

FLEXIBILITY

Configurability

Edge Rate™ Advantage

Cable Mates

EDGE RATE®

Edge Rate® Rugged Connectors

•

Edge Rate® contacts optimized for Signal

Integrity performance

•

Robust when “zippered” during unmating

•

1.5 mm contact wipe on 0.80 mm pitch

•

1.00 mm contact wipe on 0.50 mm pitch

•

Up to 40% PCB space savings with 0.50 mm

system

•

Stack heights from 7 mm to 16 mm

•

Right angle and edge mount

•

Metal friction latches available

CONTACT FLEXIBILITY

High reliability

High mating cycles

IDC cable assemblies

Discrete wire

Tiger Buy™



High retention



Cost effective



Tuning fork contact

Tiger Claw™



Pass-through



Ultra low profile



Dual wipe contact

Tiger Beam™



Best cost



Reliable performance



Post and beam contact

Blade & Beam



Micro pitch



Mating/alignment

“friendly”



Cost effective

Razor Beam™



Rugged retention notch



Ultra-fine pitch



High speed



Low profile to

elevated designs

Machined



Multi-finger BeCu

contact



Precision machined shell

Edge Rate™



Designed for Signal

Integrity



Reduced broadside

coupling



Rugged contact system



Smooth broad milled

surface for high cycles



Multi-finger

contact



Board-to-board

Tiger Eye™ System

•

High reliability

•

Multi-Finger contacts

•

Metal and plastic latching systems

•

Screw down options

•

PVC or *Teflon® cable

•

0.8 mm, 1.27 mm, or 2 mm pitch

TIGER EYE™ DISCRETE WIRE

*DuPont™ Teflon® is a registered trademark of the E.I. du Pont de Nemours and

Company or its affiliates.

DISCRETE WIRE & IDC CABLE COMPONENTS

•

A broad selection of housings and contacts for build-it-yourself

design and application flexibility

•

High reliability BeCu Tiger Eye™ contacts on 0.80 mm, 1.27 mm and

2.00 mm pitches, 32 - 24 AWG wire, housings, screw downs, plastic

and metal latches

•

1,00 mm dual leaf contacts, 30 - 28 AWG wire, housings and latches

•

2.00 mm IDC components, 24 AWG wire and latches

•

Mini Mate® and Power Mate® housings, contacts, 30 - 16 AWG wire,

plastic and metal latches

SESDT

(RELEASED)

•

Samtec’s smallest pitch: .8 mm

•

Components and tooling

available for field termination

•

Tiger Eye™ contact system

•

Double row crimp and poke

•

Rugged end latches

•

Mates with new DV TEM

•

32 AWG Teflon wire

•

Current rating ~1.0 A per contact

•

5, 10, 15 & 20 position per row

S1SD

(RELEASED)

•

1 mm pitch

•

Dual row

•

Standard rugged

end latches

•

28 and 30 AWG

•

Mates with new DV & RA T1M

•

2-10 positions per row

SESDT/S1SD/S1SS

S1SS-L

(RELEASED)

•

Mates with new DV & RA T1M

•

Available in all current S1SS

positions

•

Compatible with current

footprint

•

2-5 Released

•

6-20 in late Q1

RUGGED FEATURES AND OPTIONS

JACK SCREWS

POSITIVE LATCHING

FRICTION LOCKS

RETENTION PINS

RUGGED IDC

BOARD LOCKS

SCREW DOWNS

BOARD STANDOFFS

WELD TABS

ALIGNMENT PINS/POSTS

CAPTIVE PANEL SCREWS

IP68/IP67 SEALING