Spansion_Quick_Reference

Hyper

Flash

S26KL128S

S26KS128S

S26KL256S

S26KS256S

S26KL512S

S26KS512S

24-BALL BGA

S29GL032N

S25FL123K

S70GL02GS

S29GL064S

S29AL016J

S29GL256S

S29GL512S

S29GL128S

S29GL01GS

S29GL01GP

S25FL208K

S25FL216K

S25FL116K

S25FL204K

lle

l N

al NO

NAN

S34ML02G1

S34ML02G2

S34ML08G1

S34ML08G2

S34ML08G1

S34MS08G2

S34ML02G1

S34MS02G1

S34ML02G2

S34MS02G2

S25FL208K

S25FL204K

S25FL164K

S25FS128S

S25FL116K

S25FL164K

S25FL032P

S25FL132K

S25FS128S

S25FL127S

S25FL032P

S25FL132K

S25FL064P

S25FL164K

S25FL512S

S25FL116K

S25FL256S

S25FS256S

S25FL128S

S25FL128P

S25FL129P

S25FL127S

S25FL256S

S25FS256S

S25FL064P

S25FL164K

S25FL032P

S25FL512S

S70FL01GS

S25FL256S

S25FS256S

S25FL128S

S25FL128P

S25FL129P

S25FL032P

S25FL064P

S25FL128S

S25FS128S

S25FL127S

S25FL129P

S34ML04G1

S34ML04G2

S34MS04G1

S34MS04G2

S29GL032N

S29JL032J

S29AL008J

S29AS008J

S29AL016J

S29AS016J

S29GL064S

S29JL064J

S29GL032N

S29GL064S

S29GL512S

S29GL512P

S29GL128S

S29GL128P

S29PL127J

S29GL256S

S29GL256P

S29AL008J

S29AS008J

S29AL016J

S29AS016J

S29GL032N

S29JL032J

S29PL032J

S29GL064S

S29JL064J

S29PL064J

S29GL128S

S29GL128P

S29GL256S

S29GL256P

S29GL512S

S29GL512P

S29GL01GS

S29GL01GP

S25FL032P

S25FL132K

S25FL216K

S25FL116K

S34ML01G1

S34ML01G2

S34ML01G1

S34ML01G2

S34MS01G1

S34MS01G2

S34ML04G1

S34ML04G2

S34MS04G1

S34MS04G2

48-PIN TSOP

56-PIN TSOP

64-BALL

FORTIFIED BGA

(1.0 MM PITCH)

8-PIN SO

(150 MIL)
8-PIN SO

(208 MIL)

48-PIN TSOP

63-BALL BGA

8-CONTACT

WSON (6x5 MM)

24-BALL BGA

48-BALL FBGA

(0.8 MM PITCH)

56-BALL FBGA

(0.8MM PITCH)

8-CONTACT

WSON (6X8 MM)

16-PIN SO

(300 MIL)

S25FL132K

S70FL01GS

1.8V

Ser

l NO

High performance MIO w/DDR

FL-S

GL FAMILY: Leading price-performance, page-mode

GL-N

GL-P/S

Standard interface

AL-J

High performance SRW*

JL-J

PL-J

Burst-mode

CD-J/CL-J

Standard interface

AS-J

High performance Burst-mode SRW* – Mux

NS-P

VS/XS-R

High performance Burst-mode SRW* – DeMux

WS-P

WS-R

4Mb

8Mb

16Mb

32Mb

64Mb

128Mb

256Mb

512Mb

1Gb

2Gb

4Gb

8Gb

1.8V

ral

lel

Simultaneous Read while Write.

spansion’s product portfolio

1.8V

ML FAMILY: High Perf. SLC**

ML-1

High performance multi I/O SPI

FL2-K

FL-P

FL1-K

FL127S

High performance MIO /w DDR

FS-S

MS-1

MS FAMILY: High Perf. SLC**

GL-S

ML-2

MS-2

4Mb

8Mb

16Mb

32Mb

64Mb

128Mb

256Mb

512Mb

1Gb

2Gb

4Gb

8Gb

Additional NAND offerings in development. Contact Spansion Sales for information.

universal footprint for ultimate flexibility

Spansion

Flash Memory Reference Guide

1.8V

ADM DDR Burst

KL-S

ADM DDR Burst

KS-S

Hyper

Flash

™

Spansion:

915 DeGuigne Drive, PO Box 3453, Sunnyvale, CA 94088-3453 USA

+1 (408) 962-2500 | 1 866 SPANSION | www.spansion.com

© 2014 Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™ and combinations thereof, are trademarks
and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for
informational purposes only and may be trademarks of their respective owners.

(s) spansion ordering part number construction / single-die products

Generic OPN

Ordering Options

Additional Ordering Options

Prefix

Series

Family

G Density

Tech

Speed /

Bus Width

Package

Temp

Model Number

Pack

type

Temperature Grade

C = Commercial (0° to +70°C)
W = Wireless (-25° to +85°C)
I = Industrial (-40° to +85°C)
V = In-Cabin (-40° to +105°C)
N = Extended (-40° to +125°C)

29 = Sector Erase NOR Flash memory
34 = Floating Gate NAND
70 = Dual Die Flash Package

Density

001-512 = 1 Mb-512 Mb
204-216 = 4 Mb-16 Mb*
116-164 = 16Mb-64Mb**
127 = 128 Mb***
01G-64G = 1 Gb-64Gb

Packaging Type

0 = Tray
1 = Tube
2 = 7" Tape & Reel
3 = 13" Tape & Reel

Prefix

S = Spansion

Package Type (Family)

Package Material Set
(Varies by Package Type)

A = Leaded
F = Lead (Pb)-Free
H = Low Halogen Lead

(Pb)-Free

Core Volatge

L = 3-volt VCC
D = 2.5-volt VCC
S = 1.8-volt VCC

Process Technology

J = 110nm, Floating Gate

Technology
K = 90nm, Floating Gate

Technology
N = 110nm, MirrorBit

Technology
P = 90nm, MirrorBit

Technology
R = 65nm, MirrorBit

Technology
S = 65nm, MirrorBit

Technology (Eclipse)
1 = NAND Revision 1

(4X nm)
2 = NAND Revision 2

(3X nm)

Flash Interface and
Simultaneous Read-write

Standard
Page
Burst (ADP)
Burst (ADM)
Burst (AADM)
Serial (SPI)

srw

N/V

no srw

A
G

Speed Option (Parallel NOR and SPI)

Asynchronous (no CLK input)

“Speed Option” represents random access time (ns). If greater than

100ns, use the two leftmost digits.

Synchronous (CLK input)

“Speed Option” represents clock frequency (MHz). First character

represents the data rate, combined with the speed in 100s of MHz:

SDR, <100 MHz

SDR, 100 MHz

DDR, <100 MHz

Second character represents the speed between 0 and 99 MHz:

Bus Width (NAND)

00 = x8 NAND, single die

04 = x16 NAND, single die

01 = x8 NAND, dual die

05 = x16 NAND, dual die

0-4
5-9
10-14

15-19
20-24
25-29

30-34
35-39
40-44

45-49
50-54
55-59

60-64
65-69
70-74

75-79
80-84
85-89

90-94
95-99
100-108

A
B
C

E
F

G
H

R
S
T

For FL2-K

For FL1-K

***

For FL127S

A = BGA-0.5mm pitch
B = BGA-0.8mm pitch (PNOR),

D = Fortified BGA, 9mm x 9mm
F = Fortified BGA, 11mm x 13mm
M = SOIC/SOP
N = SON
Q = PQFP
T = TSOP

Varies for each generic OPN (characters
00-ZZ). Meaning is defined in each
datasheet.

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Product Series

25 = Serial Peripheral Interface (SPI) Flash memory
26 = HyperFlash Memory

1.0mm pitch (SPI, HyperFlash,
NAND)

Burst (ADM)

Automotive

Burst (Demux)
NAND

ADP = Address data parallel
ADM = Address data mux
AADM = Address-address

data mux