TypeCC-html.html

Sales and Corporate Ofﬁce

1717 Chicago Avenue

Riverside, California 92507-2364

Phone: (951) 788-1700

Fax: (951) 369-1151

Applications Engineering

17271 North Umpqua Hwy.

Roseburg, Oregon 97470-9422

Phone: (541) 496-0700

Fax: (541) 496-0408

e-mail: caddock@caddock.com • web: www.caddock.com

For Caddock Distributors listed by country see caddock.com/contact/dist.html

CAD

DOC

CC1512FC Standard Resistance Values:

Tolerance CC1512FC ±1% Standard (except as noted).

CC2015FC Standard Resistance Values:

Tolerance CC2015FC ±1% Standard (except as noted).

CC2520FC Standard Resistance Values:

0.010

0.015

0.020

0.025

0.030

Tolerance CC2520FC ±1% Standard (except as noted).

0.033

0.040

0.050

0.075

0.10

0.15

0.20

0.25

0.30

0.33

0.40

0.50

0.75

1.00

1.50

2.00

2.50

3.00

0.010

0.015

0.020

0.025

0.030

0.033

0.040

0.050

0.075

0.10

0.15

0.20

0.25

0.30

0.33

0.40

0.50

0.75

1.00

1.50

2.00

2.50

3.00

0.020

0.025

0.030

0.033

0.040

0.050

0.075

0.10

0.15

0.20

0.25

0.30

0.33

0.40

0.50

0.75

1.00

1.50

2.00

2.50

3.00

3.30

4.00

5.00

7.50

8.00

10.0

Custom resistance values and non-standard tolerances

can be manufactured for high quantity applications.

Please contact Caddock Applications Engineering.

Recommended Circuit Board Layout

(current and sense connections):

Fig. 1A:

Kelvin layout recom-

mended for values below 0.20

Fig. 1B:

Kelvin layout

recommended for higher

resistance values.

Type CC Low Resistance Precision Chip Resistors

Style FC - Flip Chip Version

is a surface mount version with solderable pads for

ﬂip chip

soldering.

Note 1: General Applications -

The power rating

for general applications is based upon 0.5 sq. in.

(300 mm

) of termination pad or trace area (2 oz.

copper) connected to each end of the resistor.

Maximum chip temperature is 150°C. Use Derating

Curve to derate appropriately for the maximum

ambient temperature and for the temperature

limitations of the adjacent materials.

Note 2: Thermal Resistance -

In High Power Applications where the circuit board

material provides high heat sinking beneﬁts (such as IMS, Alumina, or other) the thermal

resistance of the chip resistor is useful to establish the maximum power capability of the

chip resistor in the application. The ﬁlm temperature is measured at the center of the

resistor element and the solder pad temperature is measured at the center of the

termination pad (point X in the recommended circuit layouts shown below). Maximum

temperature of the chip resistor (at the center of chip) should not exceed 150°C through

the temperature range of the application

Style FC Derating Curve For General Applications

3.30

4.00

5.00

7.50

8.00

10.0

3.30

4.00

5.00

7.50

8.00

10.0

S S

C = Current connection

S = Sense connection

Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown.

0.015

Ω

0.010

Ω

Model

Resistance

Min.

Max.

Power Capability Information

CC1512FC

CC2015FC

CC2520FC

10.0

Ω

0.020

Ω

10.0

Ω

0.020

Ω

10.0

Ω

0.020

Ω

0.010

Ω

0.025

Ω

150

0.75 Watt

Max. Chip

Temperature

General Applications High Power Applications

Thermal Resistance -

Film (J) to Solder Pad (C)

(see note 2)
22.7

C/Watt

Power Rating

at 70

(see note 1)

22.7

C/Watt

16.0

C/Watt

13.0

C/Watt

11.5

C/Watt

150

Dimensions in inches and (millimeters)

.150

.007

(3.81

.18)

.120

.007

(3.05

.18)

.035 min.

(0.89 min.)

.027

.005

(.69

.13)

.250

.007

(6.35

.18)

.200

.007

(5.08

.18)

.065 min.

(1.66 min.)

.032

.005

(.81

.13)

.250

.007

(6.35

.18)

.200

.007

(5.08

.18)

.040 min.

(1.02 min.)

.041

.004

(1.04

.10)

.200

.007

(5.08

.18)

.150

.007

(3.81

.18)

.050 min.

(1.27 min.)

.027

.003

(.69

.08)

.150

.007

(3.81

.18)

.120

.007

(3.05

.18)

.035 min.

(0.89 min.)

.022

.003

(.56

.08)

Comments

Solder Coated Pads

Solderable Pads
Solderable Pads

Solder Coated Pads

Solderable Pads

0.75 Watt

1.0 Watt

1.5 Watts

AMBIENT TEMPERATURE, C

TED LOAD, %

100

80
60
40

100

150

•

Style FC

- Flip Chip version for surface mount applications.

Style WB

- Wire Bond version for hybrid applications with metallized back

surface for solder down heat sinking of the chip, includes bondable termination

pads to receive aluminum wire bonds.

• Thermal resistance is provided to optimize high power designs when utilizing

higher thermal conductivity circuit board substrates such as IMS or Alumina.

• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,

and 0.10 ohm at ±1%.

• Low inductance provides excellent high frequency and pulse response.

• High pulse handling and overload capability.

• Best choice for switching power supplies, motor speed controls, and high

current sensing applications.

Page 1 of 2

28_IL106.1004

Sales and Corporate Ofﬁce

1717 Chicago Avenue

Riverside, California 92507-2364

Phone: (951) 788-1700

Fax: (951) 369-1151

Applications Engineering

17271 North Umpqua Hwy.

Roseburg, Oregon 97470-9422

Phone: (541) 496-0700

Fax: (541) 496-0408

e-mail: caddock@caddock.com • web: www.caddock.com

For Caddock Distributors listed by country see caddock.com/contact/dist.html

CAD

DOC

CC 2520 FC - 0.10 - 1%

Type CC

Physical Size

1512 = 0.150” x 0.120”

2015 = 0.200” x 0.150”

2520 = 0.250” x 0.200”

Style:

FC or WB

Resistor Value (

Ω

)

See charts for availability

Tolerance:

5% below 0.050

Ω

2% 0.050

Ω

to 0.099

Ω

1% 0.10

Ω

and above

Speciﬁcations:

Temperature Coefﬁcient:

TC referenced to

+25°C,

R taken at +150°C.

0.50 ohm and above, -20 to +80 ppm/°C

0.050 ohm to 0.49 ohm, 0 to +200 ppm/°C

below 0.050 ohm, 0 to +300 ppm/°C.

Inductance:

Less than 5 nH typical.

Load Life:

1000 hours at rated power, based

upon 150°C max. chip temperature,

R ± (0.5% + 0.0005 ohm).

Momentary Overload:

1.5 times rated power,

for 5 seconds,

R ± (0.5% + 0.0005 ohm).

Operating Temperature:

-55°C to +150°C.

Measurement Note:

All measurements are

taken using Kelvin connections per the

recommended connection locations.

Ordering

Information:

Ko signifies tape thickness and dimension

12mm

0.473”

7” dia.

(178 mm)

.512” arbor hole

(13mm)

Packaging information:
Style FC

, ﬂip chip resistors, are shipped with the bare

ceramic side up in the pocket, with the solderable pads fac-

ing down.

Style WB

, wire bondable resistors, are shipped with the

wire bondable pads facing up in the pocket.
The illustration shows the orientation of the CC1512 and

CC2015 chip resistors in the tape. The CC2520 chip resistors

are rotated 90° from what is shown in the illustration.

0.135” (3.43mm)

Carrier Tape and pocket dimensions:

Tape is 12mm Carrier Tape (8mm pitch)

0.167” (4.24mm)

0.037” (0.94mm)

0.189” (4.80mm)

Size 2015

0.209” (5.31mm)

0.087” (2.21mm)

0.271” (6.88mm)

Size 2520

0.216” (5.49mm)

0.066” (1.68mm)

Size 1512

Full reel quantities:

1500 pieces per reel for CC1512

1000 pieces per reel for CC2015 and CC2520
Quantities of less than 250 will be shipped in tape without reel and

without tape leader at the option of Caddock.
Tape dimensions and materials will be consistent with EIA-481-1.

Reels will be marked with a label containing Caddock logo, part

number, resistor value, tolerance, packaging date, and quantity.

CC2015WB Standard Resistance Values:

Tolerance CC2015WB ±1% Standard (except as noted).

CC2520WB Standard Resistance Values:

0.025

0.030

0.033

0.040

Tolerance CC2520WB ±1% Standard (except as noted).

0.050

0.075

0.10

0.15

0.20

0.25

0.30

0.33

0.40

0.50

0.75

1.00

1.50

2.00

2.50

3.00

3.30

4.00

5.00

7.50

8.00

10.0

0.020

0.025

0.030

0.033

0.040

0.050

0.075

0.10

0.15

0.20

0.25

0.30

0.33

0.40

0.50

0.75

1.00

1.50

2.00

2.50

3.00

3.30

4.00

5.00

7.50

8.00

10.0

Custom resistance values and non-standard tolerances

can be manufactured for high quantity applications.

Please contact Caddock Applications Engineering.

Style WB - Wire Bond Version

Model

Resistance

Min.

Max.

Power Capability Information

CC2015WB

CC2520WB

10.0

Ω

10.0

Ω

0.020

Ω

0.025

Ω

Max. Chip

Temperature

Thermal Resistance

Film (J) to Solder Pad (C)

(see note 3)
13.9

C/Watt

8.33

C/Watt

150

Dimensions in inches and (millimeters)

.250

.007

(6.35

.18)

.200

.007

(5.08

.18)

.040 min.

(1.02 min.)

.200

.007

(5.08

.18)

.150

.007

(3.81

.18)

.050 min.

(1.27 min.)

.027

.003

(.69

.08)

Comments

Aluminum wire to be used for bonding

.027

.003

(.69

.08)

Aluminum wire to be used for bonding

Note 3: Thermal Resistance -

In High Power Applications where the circuit board material

provides high heat sinking beneﬁts (such as IMS, Alumina, or other) the thermal resistance of

the chip resistor is useful to establish the maximum power capability of the chip resistor in the

application. The ﬁlm temperature is measured at the center of the resistor element and the

solder pad temperature is measured at the soldered interface with the circuit board. Maximum

temperature of the chip resistor (at the center of chip) should not exceed 150°C through the

temperature range of the application.

WB Resistor mounting

Circuit board: IMS, Ceramic (Alumina) , or other.

Sense Wire

Current Wire

Film Temperature

Measuring Point

Solder pad, soldered

interface with circuit board.

Sense Wire

Current Wire

Sense connection shall be

made in the crosshatched

portion of the termination

pad.

.055 (1.40) centered

Location for Sense (Potential) Connection:

General Information for Type CC - Style FC and Style WB - Chip Resistors

Solder attachment note:
Style FC

has a bare ceramic back surface.

The recommended solders for ﬂip chip

solder attachment are 62Sn / 36Pb / 2Ag,

96.5Sn / 3.5Ag, or standard Sn / Ag / Cu

solder alloys.

Style WB

has a metallized back surface for

soldering to a substrate or a heat sink. The

recommended solders to be used are

62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or

standard Sn / Ag / Cu solder alloys.

Dimensions in inches and (millimeters)

is a hybrid mountable version with metallized pads for wire bonding utilizing

aluminum wire

and

a metallized back surface for solder attachment of the back surface to a heat sinking substrate.

Type CC Low Resistance Precision Chip Resistors

Page 2 of 2

28_IL106.1004