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CHEMICALS

For the latest information–www.gcelectronics.com

All quantities are single; BU’s are packages of 10 Unless otherwise noted.

Chem

CHEMICALS & PRINTED CIRCUIT

Contents:
•Newest Products

p42-43

•

Contact Cleaners

p42, 45-46

•

Air Jet

p44

•

Freeze Mist

p44

•

Non-Aerosol Cleaners

p44

•

Flux Removers

p42, 47

•

Glass Cleaners

p47

•

Head Cleaners

p48

•

Lubricants

p48-49

•

Adhesives

p50-53

Epoxy Cements

p50-51

Cyanoacrylates

p51

Solvent Release

p52

RTV

p53

•

Heat Sink Compounds

p54

•

Thinners & Solvents

p55

•

Coatings

p55-56

•

Solder Flux

p57

•

Specialty Chemicals

p57-58

•

Accessories

p58-60

•

Circuit Boards

p60

•

Prototype Boards

p61

•

Drafting Aids

p62

•

PC Developing & Etching

p62

•

PC Repair

p63-64

•

Product Cross Reference

p64

•

Chemical Specification
Matrix

p65-68

•

Chemical Programs

p69-71

CHEMICALS

Phone (815)316-9080•Fax (815)316-9081

All quantities are single; BU’s are packages of 10 Unless otherwise noted.

Chem

Big Bath

Contact Cleaner

Big Bath

Contact Cleaner is the replacement choice for HCFC 141b cleaners (contains no HCFC's or CFC's).

It is non-flammable, non-ozone depleting, and is safe on some plastic. This non-residue cleaner is effective

on switches, PC boards, motors, electrical and electronic components. Big Bath3 helps dissipate moisture,

and is fast drying.

Applications:

Can be used on live circuits, including switches, relays, controls PC boards, motors, electrical and

electronic components. Test for compatibility with sensitive plastics. Incompatible with ABS, PS, and Lexan.
Environmental Data:

CFC: 0% HCFC: 0% ODP: 0 VOC: 56%

Part No. 19-913

16 oz. Aerosol Replaces Part No.

19-624

Part No. 19-907

16 oz. Anti-Static Aerosol Replaces Part No.

19-902-SF & 19-903-SF

Big Bath

Contact Cleaner and Degreaser

Big Bath

Cleaner and Degreaser is an excellent non-flammable general purpose cleaner/degreaser. The

product is non-ozone depleting (contains no HCFC's or CFC's). It is a replacement for cleaner/degreasers

containing HCFC 141b. Big Bath3 Cleaner and Degreaser will dissipate moisture and is safe on some

plastics.

General cleaning and degreasing applications, electronic and electrical equipment. Test for compatibility

with sensitive plastics. Incompatible with ABS, PS, and Lexan. Can be used on energized circuits.
Environmental Data:

CFC: 0% HCFC: 0% ODP: 0 VOC: 58%

Part No. 19-905

12 oz. Aerosol Replaces Part No.

19-902

19-903-6

19-2903-3

Part No. 19-906

16 oz. Aerosol Replaces Part No.

19-903

19-2903-8

GC NPB

— Cleaner and Degreaser

GC NPB

– Cleaner and Degreaser is an aggressive cleaner used for removing a broad range of

contaminants and heavy soils. Highly recommended for metal cleaning. Contains no HCFC's or CFC's
and is non-ozone depleting. Is safe on most surfaces except polycarbonate, polystyrene, ABS and acrylic
materials. (To insure complete compatibility, test before use.)

Heavy soils on metal, motors, machinery and other types of metal cleaning. Can be used on energized cir-

cuits.
Environmental Data:

CFC: 0% HCFC: 0% ODP: 0 VOC: 70%

Part No. 19-802

16 oz. Aerosol Replaces Part No.

19-8669

Flux Solv

Flux Solv

is a fast evaporating, non-ozone depleting flux remover that leaves no residue. It is formulated

to remove R, RA, RMA and SA type fluxes. Flux Solv3 is non-flammable and safe on many plastics. Flux
Solv3 contains no HCFC's or CFC's and is a replacement for HCFC 141b flux removers.

Applications:

PC boards, electronic and electrical components. Test for compatibility with sensitive plastics.

Incompatible with ABS, PS, and Lexan.
Environmental Data:

CFC: 0% HCFC: 0% ODP: 0 VOC: 60%

Part No. 19-272

16 oz. Aerosol Replaces Part No.

19-328-22

NEW PRODUCTS

Applications:

CHEMICALS

All quantities are single; BU’s are packages of 10 Unless otherwise noted.

For the latest information–www.gcelectronics.com

Chem

NEWEST PRODUCTS (Cont.)

Electronic Grade Silicone

Sealant/Adhesive

One part non-corrosive, neutral cure electronic grade silicone
sealant. Will remain flexible from -70º F to +400º F. (-57º C
to +204º C) An excellent adhesive for many electrical and
electronic applications where corrosion to metals is a problem.
Good dielectric properties, high surface resistivity and resists
electrical tracking.

Part No. 19-158

10.2 fl. oz. Caulk Tube Color: White

Part No. 19-159

2.8 fl. oz. Cartridge Color: White

Part No. 19-158

Part No. 19-159

GC Electronic Grade Self Leveling

Potting Silicone Sealant

Electronic Grade Self Leveling Silicone is a one-compo-

nent, RTV (room temperature vulcanizing) product

that uses new cross-linking mechanism as a cure

method. No acetic or other corrosive by-products

are generated during the curing process. It can be

used in corrosion sensitive electrical or electronic

equipment with no adverse effect and cures at

room temperature.

Temperature Range

-57

C to +204

(after cure):

(-70˚F to + 400˚F)

Dielectric Strength:

452 V/mil (173 KV/cm)

Thermal Expansion

9 x 10

1/K

Coefficient:

0˚C to 100˚C (32˚F to 212˚F)

Volume Resistivity:

>2.19 x 1015 Ohm/cm

Part No. 19-160

10.2 fl. oz. Caulk Tube Clear

Thermally Conductive Potting

Epoxy and Adhesive

This potting Epoxy and adhesive is a highly

filled medium viscosity black casting

resin formulated for application requiring a

high degree of thermal conductivity. Mix

ratio 1:1. It contains abrasive aluminum

oxide filler which can introduce wear

considerations. Cure is normally achieved at

room temperature, although an elevated cure

schedule can be used to reach final

properties quickly.

Temperature Range:

-40˚C to 150˚C
(40˚F to 300˚F)

Dielectric Strength:

430 V/mil

Thermal Conductivity:

7.34 (Btu * in/ft 2 hr ˚F)

Thermal Expansion
Coefficient:

44 (x 106 ˚C)

Volume Resistivity:

2.14 x 1012 Ohm/cm

Part No. 19-161

2-4 oz. Containers

Part B

Part A

Silicone (Z9)

Industry standard zinc oxide filled silicone heat
sink grease for most applications. Will not
soften at elevated temperatures or dry out or
harden.

Part No. 10-8108

6.5g tube

Part No. 10-8109

1 oz. tube

Part No. 10-8106

1 lb. can

Clear

ELECTRONICS

PRODUCT SPECIFICATIONS SHEET

CAT NO.

PRODUCT NAME

19-158

GC Electronic Grade Silicone Sealant Adhesive – White

19-159

DESCRIPTION:

GC Electronic Grade Silicone Sealant/Adhesive is a one-part, moisture-curing RTV (room temperature
vulcanizing) silicone sealant/adhesive that is non-slump and cures to form a tough, permanently flexible
rubber.

The non-corrosive curing system of these products makes it ideally suited for protecting, sealing and
insulating corrosion-sensitive electronic and electrical materials such as copper, brass, silver, etc.

It has been specifically formulated for use in electrical/electronic production and assembly because it

•

has good dielectric properties

•

has high surface resistivity

•

resists electrical tracking

•

repels water to protect electrical properties

These products are a neutral-cure silicone that emits no objectionable odors during cure and is ideally
suited for use in confined areas. However, adequate ventilation should be provided when they are used in
large-scale production.

These products are 100% silicone and have excellent resistance to:

•

ozone

•

airborne chemicals

•

temperature changes from -57

C to +204

C (-70

F to +400

TYPICAL USES:

19-158 and 19-159 are excellent sealants/adhesives for many electrical and electronic applications where
corrosion to metals, particularly copper, brass, silver, etc., is a problem. Such applications include:

•

lead-wire entries

•

conduit terminal boxes

•

component mounting

•

electrical connections

•

conduit ends

•

splices

•

cover plates

•

coaxial cable connectors

•

printed circuit boards

•

conductor entry holes

Clear

SURFACE PREPARATION;

All surfaces should be clean and dry. It is recommended that bonding surfaces be solvent wiped with oil-
free solvents such as xylol, toluol naphtha or non-flammable chlorinated solvents. Do not wipe with oil-
based solvents such as Varsol. Allow surface to dry thoroughly before applying sealants.

DIRECTIONS:

19-158 and 19-159 are ready to use and require no mixing or additives. The cure mechanism begins as
soon as the sealant comes in contact with the air. At conditions of 25

C (77

F) and 50% relative humidity,

the sealant will skin in 15 minutes and fully cure within 48 hours (1/8” bead).

Higher humidity accelerates cure. Tooling should be done before skinning takes place.

In applications where partial total confinement of sealant is prevalent, the time required for proper cure is
lengthened by the degree of confinement.

PRIMING:

Priming of these products is normally not required for application to most substrates.

Unprimed adhesion can be readily tested by applying a small trial bead and allowing 7 days for maximum
adhesion to occur.

COLORS:

These products are available in white.

MILITARY SPECIFICATIONS:

19-158 and 19-159 meet the requirements of MIL-A-46146A Type 1.

FDA STATUS:

19-158 and 19-159 are permitted under regulations of the Food and Drug Administration where incidental
food contact might be involved. FDA Regulation number is 177.2600.

TYPICAL PROPERTIES:

CHARACTERISTIC

TEST METHOD

RESULTS

Shore

Hardness ASTM

D2240

Tensile @ Break

ASTM D412

250

25 psi

Elongation

Break

ASTM

D412

400

25%

Modulus

100%

Elongation

ASTM

D412

10 psi

Tear

Strength

ASTM

624

(Die

10 ppi

Adhesion

Strength

(Peel)

TT-S-001543,

3.5.9

Glass

2 ppi

Aluminum

(Primed)

2 ppi

Mortar (Primed)

2 ppi

Sag,

Slump

TT-S-001543,

3.5.2

Nil

Shrinkage

(Weight

Loss)

TT-S-001543,

3.5.5

<5%

Extrusion

Rate

1/8”

orifice

psi

130

5 gm/min

CHARACTERISTIC

TEST METHOD

RESULTS

Service

Temperature

-18

C to +50

F to + 120

Tack

Free

Time

TT-S-001543,

3.5.6

minutes

Time

Full

Cure

(1/8”

Bead)

hours

Joint Movement Capability

4:1 Safety Factor

25%

Chemical

Resistance

List

Available

Excellent

Color

Retention

Excellent

Weatherability

Excellent

Reactivity

Byproducts

Non-corrosive

Most substrates

Electrical Properties @ 72

F (22

Dissipation

Factor ASTM

D150

–

0.0009

kHz

–

0.0004

1 MHz – 0.0002

Dielectric

Constant

ASTM

D150

–

2.7

1 kHz – 2.7

1 MHz – 2.7

Volume Resistivity,

.cm

ASTM

D257

1014

Surface Resistivity,

ASTM D257

3 x 10

Dielectric

Strength,

KV/mm

ASTM

D149

SAFETY PRECAUTIONS:

Since GC Electronic Grade Sealant/Adhesive is a neutral-cure system, no acetic or objectionable
byproducts are evolved during cure. On direct contact, uncured sealant may irritate eyes. Flush well with
water and call physician if irritation persists. Avoid prolonged contact with skin.

STORAGE:

GC Electronic Grade Sealant/Adhesive,should be stored in original unopened container at or below 32

(90

F),.

SHELF LIFE, CLOSED CONTAINERS:

12 months

ELECTRONICS

PRODUCT SPECIFICATIONS SHEET

CAT NO.

PRODUCT NAME

19-160 GC Electronic Grade Self-Leveling Potting Silicone Sealant

DESCRIPTION:

Electronic Grade Self-Leveling Silicone is a one-component, RTV (room temperature vulcanizing) product
that uses a new cross-linking mechanism as a curing method. No acetic acid or other corrosive by-products
are generated during its cure. Thus, 19-0160 can be used in corrosion-sensitive electrical and/or electronic
equipment with no adverse effect.

Supplied ready to use, 19-160 cures at room temperature to form a tough, high-modulus rubber.

TYPICAL USES:

19-160 is primarily used in applications where a flowable, self-leveling silicone sealant is required to fill
small gaps or voids. Applications include potting electrical terminals and coating electrical devices.

Since no undesirable odors are released during cure, 19-160 is ideal where applications must be done
under confined conditions. Adequate ventilation should be provided with extensive use of this product.

DIRECTIONS:

19-160 is ready to use and requires no mixing or additives. The cure mechanism begins as soon as the
sealant comes in contact with the air. Uncured sealant will flow until a cured skin is formed.

At conditions of 25

C (77

F) and 50% relative humidity, the sealant will skin in 30 minutes and cure

within 24 hours (1/8” thickness). Higher humidity accelerates cure.

In applications where partial or total confinement of sealant is prevalent, the time required for proper cure
is generally lengthened by the degree of confinement.

SURFACE PREPARATION;

All surfaces should be clean and dry. It is recommended that bonding surfaces be solvent wiped with a
naphtha, ketone or chlorinated solvent. Suitable solvents include xylol, toluol and mineral spirits. Do not
solvent wipe with alcohols or oil-containing solvents such as Varsol. Allow surface to dry thoroughly
before applying sealant.

PAINTING:

19-160 should not be applied to surfaces that will be painted, as painting over sealant is not recommended.
The paint film does not stretch and the adhesion of paint to 19-0160 is not adequate.

COLORS:

19-160 is available in clear.

FDA STATUS:

19-160 is permitted under regulations of the Food and Drug Administration where incidental food contact
might be involved. FDA Regulation number is 177.2600.

MILITARY SPECIFICATIONS:

19-160 meets the requirements of MIL-A-46106A Type II.

TYPICAL PROPERTIES:

UNCURED:

Type

One-part,

self-levelling

RTV

Appearance

Smooth,

thick

liquid

Specific

Gravity

Clear

1.02

Application

Temperature

Range

-18

C to +50

C (0

F to +120

Cure

Method

Neutral,

non-corrosive,

moisture

cure

Skin Over Time

40 minutes

Cure

Time

hours

(1/8”

thickness)

Slump/Sag

Flowable

CURED:

At 25

C (77

F) and 50% R.M. for 7 days (1/8” thick)

Durometer Hardness (shore A) (ASTM D2240)

Tensile

Strength

(ASTM

D412)

230

psi

(1.6

MPa)

Elongation at Break (ASTM D412)

400%

Tear Resistance (ASTM D624, Die B)

6 ppi (4.6 kN/m)

Temperature Range After Cure

-57

C to 204

C (-70

F to +400

Shrink Factor

Nil

Thermal

Expansion

Coefficient

10-

1/K

C to 100

C (32

F to 212

Dielectric

Strength

(ASTM

D149)

452

V/mil

(173

KV/cm)

Volume Resistivity (ASTM D257)

>2.19 x 10

ohm/cm

Dissipation

Factor

(ASTM

D150)

0.00106

kHz

0.00022

100

Dielectric Constant (ASTM D150)

71 at 100 Hz

2.71 at 10 kHz

SAFETY PRECAUTIONS:

19-160 is a neutral cure system, no acetic acid is released during cure.

STORAGE:

19-160 should be stored in original unopened container at or below 32

C (90

F).

SHELF LIFE, CLOSED CONTAINERS

12 months

2014 REV. A

19-161

Page

PRODUCT SPECIFICATIONS SHEET

CAT NO.

PRODUCT NAME

19-161

GC Thermal Conductive Potting Epoxy and Adhesive
8 oz. Kit (2 – 4 oz. Containers)

DESCRIPTION:

GC Thermal Conductive Potting Epoxy and Adhesive is a highly filled, medium viscosity black casting
resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE.
It was especially formulated to a 1:1 mix ratio for use in MMD equipment. It contains abrasive aluminum
oxide filler which can introduce wear considerations for wetted components. Cure is normally achieved at
room temperature although an elevated cure schedule can be used to reach final properties quickly. This
product was designed to be cured in less than 2 hours at 65



C for ease of processing and also to reduce

viscosity.

It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and
meter/mix and dispense equipment. Times and temperatures from 3 hours at 65



C to 30 minutes at 100



are typical for small castings (less than 50 grams).

TYPICAL PROPERTIES:

Color

Black

Viscosity Part

44,000

cPs

(Low

Shear)

35,000 cPs (High Shear)

Part B

34,000 cPs (Low Shear)

25,500 cPs (High Shear)

Mixed

39,000

cPs

(Low

Shear)

30,000 cPs (High Shear)

Specific

Gravity

Part

1.92

Part B

1.98

Mixed

1.95

Pot

Life

120

minutes

Mass

200 grams

CURED PHYSICAL PROPERTIES:

Hardness 75

Shore-D

Lap

Shear

1500

psi

ELECTRONICS

Discontinued

2014 REV. A

19-161

Page

Tensile

Strength

(Yield)

450

psi

Elongation @ Break

15%

Compressive

PSI

Yield

Strength

1,500

Ultimate

Strength

7,500

Modulus

24,000

Coefficient of Thermal Expansion

45*ppm/



C (below Tg)

Thermal

Conductivity

7.2

(Btu*in/ft



Temperature Range **

-40



to 150



Onset

Temperature



Exothermic

Energy

63.3

J/g

Glass Transition Temperature



ELECTRICAL PROPERTIES:

Dielectric

Constant

5.0*

(25



C, 100 Hz)

Dielectric

Strength 400

v/mil*

Volume

Resistivity

7.6

Ohm-Cm*

MIX RATIO: (Pa

rt A to B)

Weight

By Volume

1 to 1

CURE SCHEDULE:

24 – 72 hours at 25



Or 3 hours @ 65



minutes

100



SHELF LIFE, CLOSED CONTAINERS:

12 months

INSTRUCTIONS:

Bring both components to room temperature and stir individually before use. Mix equal parts A
and B thoroughly.

Weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not
pour from mixing container; transfer to a new container as residual unmixed material may cause a
tacky spot on the surface of casting.

Discontinued

2014 REV. A

19-161

Page

Allow product to cure undisturbed until it is fully gelled or tack-free to the touch.

Clean up uncured resin with a suitable organic solvent such as MEK, acetone or other organic
solvent.

*Asterisk denotes values considered typical to associated resin systems or extrapolated from other test
results.

**General use guideline, based on weight loss at elevated temperature.

Notes: Values presented above are considered to be typical properties, not to be used for specification
purposes. Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This
condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this
state will not usually cure to normal and expected properties. In extreme cases it may appear solid and
cured. Fluctuating temperatures (within 5-50



C) may aggravate this phenomena. Heating the individual

component to 50 to 60



C while stirring can usually restore the product to original state. Storage at 25+/-



C is optimum for most products.

GC Electronics makes no express or implied warranties or merchantability, fitness or otherwise with respect to its products. In
addition, while the information contained herein is believed to be reliable, no warranty is expressed or implied regarding the accuracy
of the data or the results to be obtained from the use thereof. All recommendations or suggestions for use are made without guarantee
inasmuch as conditions of use are beyond our control. The properties given are typical values and are not intended for use in
preparing specifications. Users should make their own test to determine the suitability of this product for their own purposes.

Discontinued