55
Cal-Chip
Electronics, Incorporated
Multilayer Chip Inductors
F
EATURES
• Internal printed coil structure creates a closed magnetic
circuit which acts as a magnetic shield eliminating cross
talk, thus permitting higher mounting densities.
• Multilayer block structure yields higher reliability.
R
ECOMMENDED
A
PPLICATIONS
• Any general circuit of portable equipment which compact
size and high mounting densities are required.
E
XTERNAL
D
IMENSIONS
GLF
3216
R10 M -T
Type - Multilayer Chip Inductors
Packaging
-T = Tape & Reel
▲
▲
Inductance Tolerance (%)
J = ±5
K = ±10
M = ± 20
Nominal Inductance (µH)
Example:
47N = 0.047
R10 = 0.1
1R0 = 1
100 = 10
R = decimal point
N = 0.0 (nH type)
External Dimensions (LxW) (mm)
1608 (0603) - 1.6 x 0.8
2125 (0805) - 2.0 x 1.25
3216 (1206) - 3.2 x 1.6
GLF S
ERIES
O
RDERING
C
ODE
Type
GLF1608
(0603)
GLF2125
(0805)
GLF3216
(1206)
L
1.6±0.15
(0.063±0.006)
2.0
+0.3
-0.1
(0.079
+0.012
)
-0.004
3.2±0.2
(0.126±0.008)
W
0.8±0.15
(0.031±0.006)
1.25±0.2
(.049±0.008)
1.6±0.2
(0.063±0.008)
T
0.8±0.15
(0.031±0.006)
0.85±0.2
1.25±0.2
(0.033±0.008)
(0.049±0.008)
0.6±0.2
1.1±0.3
(0.024±0.008)
(0.043±.012)
e
0.3±0.2
(0.012±0.008)
0.5±0.3
(0.020±0.012)
0.5±0.3
(0.020±0.012)
Inductance
0.1µH
1µH
10µH
Imax [mA]
50
25
5
Rdcmax [
Ω
]
0.50
0.60
2.55
Imax [mA]
250
50
15
Rdcmax [
Ω
]
0.30
0.40
1.15
Imax [mA]
250
100
25
Rdcmax [
Ω
]
0.25
0.40
1.00
Operating Temperature: -40~85°C