Cat.No.C03E
Murata
Manufacturing Co., Ltd.
Chip Monolithic
Ceramic Capacitors
for Automotive
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!
Note
C03E.pdf 04.5.21
Selection Guide of Chip Monolithic Ceramic Capacitors
Temperature Compensating Type GCM15/18/21/31 Series
High Dielectric Constant Type GCM15/18/21/31/32 Series
Specifications and Test Methods
CONTENTS
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Recycled Paper
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Note
C03E.pdf 04.5.21
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
(Part Number)
w
q
Product ID
w
Series
Chip Monolithic Ceramic Capacitors
GC
M
Automotive Tin Plated Layer
Product ID
Code
Series
GC
q
M
e
18
r
8
t
B1
y
1H
u
102
i
K
o
A01
e
Dimension (L
g
W)
!0
K
Code
1.0
g
0.5 mm
1.6
g
0.8 mm
2.0
g
1.25 mm
3.2
g
1.6 mm
3.2
g
2.5 mm
Dimension (L
g
W)
0402
0603
0805
1206
1210
EIA
15
18
21
31
32
B
C
D
E
M
N
R
X
1.25 mm
1.6 mm
2.0 mm
2.5 mm
1.15 mm
1.35 mm
1.8 mm
Depends on individual standards.
r
Dimension (T)
Code
5
6
8
9
0.5 mm
0.6 mm
0.8 mm
0.85 mm
Dimension (T)
Continued on the following page.
o
Part Numbering
-55 to 125
°
C
-55 to 125
°
C
±
15%
±
22%
X7R
X7S
R7
C7
-55 to 125
°
C
-55 to 125
°
C
t
Temperature Characteristics
Code
-55 to 125
°
C
Temperature
Range
0
±
30ppm/
°
C
Capacitance Change or
Temperature Coefficient
C0G
Temperature
Characteristics
5C
-55 to 125
°
C
Operating
Temperature Range
u
Capacitance
Expressed by three figures. The unit is pico-farad (pF). The first
and second figures are significant digits, and the third figure
expresses the number of zeros which follow the two numbers.
If there is a decimal point, it is expressed by the capital letter "
R
".
In this case, all figures are significant digits.
R50
1R0
100
103
Ex.)
0.5pF
1.0pF
10pF
10000pF
Code
Capacitance
i
Capacitance Tolerance
Code
C
D
J
K
M
GCM
GCM
GCM
GCM
GCM
Series
C
∆
C
∆
C
∆
X7R
X7R
TC
±
0.25pF
±
0.5pF
±
5%
±
10%
±
20%
Capacitance Tolerance
V
5pF
6.0 to 9.0pF
U
10pF
* 1pF
* 1pF
E24 Series
Capacitance Step
E12 Series
E6 Series
*
E24 series is also available.
y
Rated Voltage
0G
0J
1A
1C
1E
1H
2A
2D
DC4V
DC6.3V
DC10V
DC16V
DC25V
DC50V
DC100V
DC200V
Code
Rated Voltage
Expressed by three figures.
o
Individual Specification Code
2
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!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
!0
Packaging
Code
L
D
K
J
E
F
B
C
T
ø178mm Plastic Taping
ø178mm Paper Taping
ø330mm Plastic Taping
ø330mm Paper Taping
ø178mm Special Packaging
ø330mm Special Packaging
Bulk
Bulk Case
Bulk Tray
Packaging
3
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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Selection Guide of Chip Monolithic Ceramic Capacitors
4
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Power-train equipment
Comfort equipment
Security equipment
Safety equipment
Entertainment equipment
Information
Automotive PC
Start
Application
Function and Circuit
*
For other automotive equipment such as comfort, security, information,
entertainment, GRM series (for general electronics) are available.
General Electronics
Specific Applications
Oscillation Circuit
Temperature
Compensation
Synchronize Circuit
Filtering
Soldering Electrode
C0G Char.
GRM_5C Series
0.5pF–0.1
µ
F
Capacitor Arrays
C0G Char.
GNM_5C Series
10pF–360pF
Soldering Electrode
for Temperature
Compensation
GRM_ Series
0.5pF–0.1
µ
F
Capacitor Arrays
for Temperature
Compensation
GNM_5C Series
10pF–360pF
Soldering Electrodes
Y5V Char.
GRM_F5 Series
2200pF–10
µ
F
Soldering Electrode
X5R/X7R Char.
GRM_R6, R7 Series
220pF–10
µ
F
High Frequency/
High Power Type
Soldering Electrode
ERF Series
0.75pF–1000pF
High Frequency Type
ERA Series
0.75pF–1000pF
High Frequency
Ribbon Terminal Type
ERD Series
0.75pF–1000pF
High Frequency
for Flow/Reflow
Soldering
GQM Series
0.5pF–100pF
Soldering Electrode
C0G/C0H Char.
GRM_6C Series
0.5pF–47000pF
Microchip Y5V Char.
GMA_F5 Series
4700pF–0.1
µ
F
Capacitor Arrays
Y5V Char.
GNM_F5 Series
22000pF–0.15
µ
F
Low-ESL Y5V Char.
LLL_F5 Series
22000pF–0.68
µ
F
De-coupling
Bypassing
Time Constant Circuits
Coupling
High Frequency
Automotive ( Power-train, Safety equipment )
GCM Series*
0.5pF–10
µ
F
Ultra Thin Circuit
Medium Voltage
Safety Standard
Recognized
630V/1kV/2kV/3.15kV
Low-dissipation
GRM Series
10pF–1000pF
Capacitor Arrays
GNM Series
390pF–1.0
µ
F
Thin type Soldering
Electrode
GRM15X Series
0.5pF–4700pF
Low Dissipation
GJM Series
0.5pF–18pF
Ultrasonic Sensors
ZLM Char.
GRM2199E Series
1000pF/1500pF
Low ESL
LLL Series
2200pF–1.0
µ
F
250V/630V/1kV
High-capacitance
GRM Series
220pF–1
µ
F
2kV
Only for
Telecommunication
Devices
GR4 Series
100pF–4700pF
AC250V which meet
Japanese Law
GA2 Series
470pF–0.1
µ
F
UL/IEC
Safety Standard
Recognized
GA3 Series
10pF–33000pF
High Frequency/
High Power
Ribbon Terminal Type
ERH Series
0.75pF–1000pF
Thin Layer
Large Capacitance Type
X5R Char.
GRM_R6 Series
47000pF–100
µ
F
Microchip
GMA_R7 Series
470pF–10000pF
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
5
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Monolithic Ceramic Capacitors for Automotive
for Automotive GCM Series
■
Features
1. The GCM series meet AEC-Q200 requirements.
2. The GCM series is lead free product.
3. The GCM series is a complete line of chip ceramic
capacitors in 16V, 25V, 50V and 100V ratings.
These capacitors have temperature characteristics
of C0G and X7R.
4. A wide selection of sizes is available, from
miniature LxWxT: 1.0x0.5x0.5mm to
LxWxT: 3.2x2.5x2.5mm.
5. Stringent dimensional tolerances allow highly
reliable, high speed automatic chip replacement on
PCBs.
6. The GCM series is available in paper or plastic
embossed tape and reel packaging for automatic
placement.
■
Applications
Automotive electronic equipment (Power-train, safety
equipment)
L
T
W
e
e
g
*
Bulk Case : 1.6
±
0.07(L)
g
0.8
±
0.07(W)
g
0.8
±
0.07(T)
Part Number
L
W
T
Dimensions (mm)
e
g min.
GCM033
GCM155
GCM188*
GCM216
GCM219
GCM21B
GCM319
GCM31M
GCM31C
GCM32N
GCM32R
GCM32D
GCM32E
GCM43R
GCM43E
GCM55R
0.6
±
0.03
1.0
±
0.05
1.6
±
0.1
2.0
±
0.15
3.2
±
0.15
3.2
±
0.2
3.2
±
0.3
4.5
±
0.4
5.7
±
0.4
0.3
±
0.03
0.5
±
0.05
0.8
±
0.1
1.25
±
0.15
1.6
±
0.15
1.6
±
0.2
2.5
±
0.2
3.2
±
0.3
5.0
±
0.4
0.3
±
0.03
0.5
±
0.05
0.8
±
0.1
0.6
±
0.1
0.85
±
0.1
1.25
±
0.15
0.85
±
0.1
1.15
±
0.1
1.6
±
0.2
1.35
±
0.15
1.8
±
0.2
2.0
±
0.2
2.5
±
0.2
1.8
±
0.2
2.5
±
0.2
1.8
±
0.2
0.1 to 0.2
0.15 to 0.3
0.2 to 0.5
0.2 to 0.7
0.3 to 0.8
0.3
0.2
0.4
0.5
0.7
1.5
2.0
1.0
2.0
Temperature Compensating Type GCM15/18/21/31 Series
TC
Part Number
L x W [EIA]
Rated Volt.
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
GCM15
1.00x0.50 [0402]
50
(
1H
)
100
(
2A
)
GCM18
1.60x0.80 [0603]
50
(
1H
)
100
(
2A
)
GCM21
2.00x1.25 [0805]
50
(
1H
)
100
(
2A
)
C0G
(
5C
)
GCM31
3.20x1.60 [1206]
50
(
1H
)
0.5pF(
R50
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.75pF(
R75
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
1.0pF(
1R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
2.0pF(
2R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
3.0pF(
3R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
4.0pF(
4R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
5.0pF(
5R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
6.0pF(
6R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
7.0pF(
7R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
8.0pF(
8R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
9.0pF(
9R0
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
10pF(
100
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
12pF(
120
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
15pF(
150
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
18pF(
180
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
22pF(
220
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
27pF(
270
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
33pF(
330
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
39pF(
390
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
47pF(
470
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
56pF(
560
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
68pF(
680
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
Continued on the following page.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
6
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
TC
Part Number
L x W [EIA]
Rated Volt.
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
GCM15
1.00x0.50 [0402]
50
(
1H
)
100
(
2A
)
GCM18
1.60x0.80 [0603]
50
(
1H
)
100
(
2A
)
GCM21
2.00x1.25 [0805]
50
(
1H
)
100
(
2A
)
C0G
(
5C
)
GCM31
3.20x1.60 [1206]
50
(
1H
)
82pF(
820
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
100pF(
101
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
120pF(
121
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
150pF(
151
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
180pF(
181
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
220pF(
221
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
270pF(
271
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
330pF(
331
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
390pF(
391
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
470pF(
471
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
560pF(
561
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
680pF(
681
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
820pF(
821
)
0.80(
8
)
0.80(
8
)
0.60(
6
)
0.60(
6
)
1000pF(
102
)
0.80(
8
)
0.80(
8
)
0.85(
9
)
0.60(
6
)
1200pF(
122
)
0.80(
8
)
0.85(
9
)
0.60(
6
)
1500pF(
152
)
0.80(
8
)
0.85(
9
)
0.60(
6
)
1800pF(
182
)
0.80(
8
)
0.60(
6
)
0.85(
9
)
2200pF(
222
)
0.80(
8
)
0.60(
6
)
0.85(
9
)
2700pF(
272
)
0.80(
8
)
0.60(
6
)
0.85(
9
)
3300pF(
332
)
0.60(
6
)
0.85(
9
)
3900pF(
392
)
0.60(
6
)
0.85(
9
)
4700pF(
472
)
0.60(
6
)
0.85(
9
)
5600pF(
562
)
0.85(
9
)
0.85(
9
)
6800pF(
682
)
0.85(
9
)
8200pF(
822
)
0.85(
9
)
10000pF(
103
)
0.85(
9
)
12000pF(
123
)
0.85(
9
)
15000pF(
153
)
0.85(
9
)
18000pF(
183
)
0.85(
9
)
22000pF(
223
)
0.85(
9
)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
High Dielectric Constant Type GCM15/18/21/31/32 Series
TC
Part Number
L x W [EIA]
Rated Volt.
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
50
(
1H
)
GCM15
1.00x0.50 [0402]
25
(
1E
)
100
(
2A
)
50
(
1H
)
GCM18
1.60x0.80 [0603]
25
(
1E
)
50
(
1H
)
25
(
1E
)
GCM21
2.00x1.25 [0805]
16
(
1C
)
100
(
2A
)
50
(
1H
)
25
(
1E
)
GCM31
3.20x1.60 [1206]
16
(
1C
)
X7R
(
R7
)
GCM32
3.20x2.50
[1210]
16
(
1C
)
220pF(
221
)
0.50(
5
)
270pF(
271
)
0.50(
5
)
330pF(
331
)
0.50(
5
)
390pF(
391
)
0.50(
5
)
470pF(
471
)
0.50(
5
)
560pF(
561
)
0.50(
5
)
680pF(
681
)
0.50(
5
)
820pF(
821
)
0.50(
5
)
1000pF(
102
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
Continued on the following page.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
7
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
TC
Part Number
L x W [EIA]
Rated Volt.
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
50
(
1H
)
GCM15
1.00x0.50 [0402]
25
(
1E
)
100
(
2A
)
50
(
1H
)
GCM18
1.60x0.80 [0603]
25
(
1E
)
50
(
1H
)
25
(
1E
)
GCM21
2.00x1.25 [0805]
16
(
1C
)
100
(
2A
)
50
(
1H
)
25
(
1E
)
GCM31
3.20x1.60 [1206]
16
(
1C
)
X7R
(
R7
)
GCM32
3.20x2.50
[1210]
16
(
1C
)
1200pF(
122
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
1500pF(
152
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
1800pF(
182
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
2200pF(
222
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
2700pF(
272
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
3300pF(
332
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
3900pF(
392
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
4700pF(
472
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
5600pF(
562
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
6800pF(
682
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
8200pF(
822
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
10000pF(
103
)
0.50(
5
)
0.80(
8
)
0.80(
8
)
0.6(
6
)
12000pF(
123
)
0.50(
5
)
0.80(
8
)
0.6(
6
)
15000pF(
153
)
0.50(
5
)
0.80(
8
)
0.6(
6
)
18000pF(
183
)
0.50(
5
)
0.80(
8
)
0.6(
6
)
22000pF(
223
)
0.50(
5
)
0.80(
8
)
0.6(
6
)
27000pF(
273
)
0.50(
5
)
0.80(
8
)
0.85(
9
)
33000pF(
333
)
0.50(
5
)
0.80(
8
)
0.85(
9
)
39000pF(
393
)
0.50(
5
)
0.80(
8
)
0.85(
9
)
47000pF(
473
)
0.50(
5
)
0.80(
8
)
1.25(
B
)
56000pF(
563
)
0.80(
8
)
1.25(
B
)
68000pF(
683
)
0.80(
8
)
1.25(
B
)
82000pF(
823
)
0.80(
8
)
1.25(
B
)
0.10
µ
F(
104
)
0.80(
8
)
1.25(
B
)
0.12
µ
F(
124
)
1.25(
B
)
0.15
µ
F(
154
)
0.80(
8
)
1.25(
B
)
1.15(
M
)
0.18
µ
F(
184
)
0.80(
8
)
1.25(
B
)
1.15(
M
)
0.22
µ
F(
224
)
0.80(
8
)
1.25(
B
)
1.15(
M
)
0.27
µ
F(
274
)
1.25(
B
)
1.15(
M
)
0.33
µ
F(
334
)
1.25(
B
)
1.15(
M
)
0.39
µ
F(
394
)
1.25(
B
)
1.15(
M
)
0.47
µ
F(
474
)
1.25(
B
)
1.15(
M
)
0.56
µ
F(
564
)
1.25(
B
)
1.6(
C
)
0.68
µ
F(
684
)
1.25(
B
)
1.6(
C
)
0.82
µ
F(
824
)
1.25(
B
)
1.6(
C
)
1.0
µ
F(
105
)
1.25(
B
)
1.15(
M
)
1.15(
M
)
1.5
µ
F(
155
)
1.25(
B
)
1.15(
M
)
2.2
µ
F(
225
)
1.15(
M
)
3.3
µ
F(
335
)
1.6(
C
)
4.7
µ
F(
475
)
1.6(
C
)
10
µ
F(
106
)
2.00(
D
)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
The tolerance will be changed to L: 3.2
±
0.2, W: 1.6
±
0.2, T: 1.15
±
0.15 for GCM31 25V 2.2
µ
F type.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
No.
AEC-Q200
Test Item
Temperature Compensating Type
High Dielectric Type
Specifications
AEC-Q200 Test Method
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
–
Pre-and Post-Stress
Electrical Test
High Tempersture
Exposure (Storage)
Appearance
Within ±2.5% or ±0.25pF
(Whichever is larger)
Within ±10.0%
Capacitance
Change
1
2
3
4
Sit the capacitor for 1000±12 hours at 150±3°C. Let sit for 24±2
hours at room temperature, then measure
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 1000 cycles
according to the four heat treatments listed in the following table.
Let sit for 24±2 hours at room temperature, then measure
30pFmin. : Q
U
1000
30pFmax. : Q
U
400+20C
C : Nominal Capacitance (pF)
W.V. : 25Vmin. : 0.03 max.
W.V. : 16V : 0.05 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
Continued on the following page.
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150
°C for one hour and then
let sit for 48±4 hours at room temperature.
Perform the initial measurement.
W
0
Y
10
Per EIA-469
Apply the 24-hour heat (25 to 65°C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2 hours at room temperature, then measure.
Step
Temp. (°C)
Time (min.)
-55+0/-3
15±3
1
Room
Temp.
125+3/-0
15±3
1
Room
Temp.
1
2
3
4
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8k
Ω
resister)
at 85±3°C and 80 to 85% humidity for 1000±12 hours.
Remove and let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Temperature
Cycle
No defects or abnormalities
Destructive
Phisical Analysis
Appearance
Within ±2.5% or ±0.25pF
(Whichever is larger)
Within ±10.0%
Capacitance
Change
30pFmin. : Q
U
1000
30pFmax. : Q
U
400+20C
C : Nominal Capacitance (pF)
W.V. : 25Vmin. : 0.03 max.
W.V. : 16V : 0.05 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
5
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Moisture
Resistance
Appearance
Within ±3.0% or ±0.30pF
(Whichever is larger)
Within ±12.5%
Capacitance
Change
30pFmin. : Q
U
350
10pF and over, 30pF and below:
Q
U
275+
C
10pFmax. : Q
U
200+10C
C : Nominal Capacitance (pF)
5
Y
2
W.V. : 25Vmin. : 0.03 max.
W.V. : 16V : 0.05 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
6
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Biased Humidity
Appearance
Within ±3.0% or ±0.30pF
(Whichever is larger)
Within ±12.5%
Capacitance
Change
30pF and over : Q
U
200
30pF and below : Q
U
100+
C
C : Nominal Capacitance (pF)
10
Y
3
W.V. : 25Vmin. : 0.035 max.
W.V. : 16V : 0.05 max.
Q/D.F.
More than 1,000
Ω
or 50
Ω
• F
(Whichever is smaller)
I.R.
°
C
70
65
60
65
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Humidity
90-98%
Humidity
80-98%
Humidity
90-98%
Humidity
80-98%
Humidity
90-98%
+10
-2
°
C
Initial measurement
Temparature
One cycle 24 hours
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
Specifications and Test Methods
8
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Continued from the preceding page.
No.
AEC-Q200
Test Item
Temperature Compensating Type
High Dielectric Type
Specifications
AEC-Q200 Test Method
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Operational Life
Appearance
Within ±3.0% or ±0.30pF
(Whichever is larger)
Within ±12.5%
Capacitance
Change
7
8
Apply 200% of the rated voltage for 1000±12 hours at
125±3°C. Let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.
• Initial measurement for high dielectric constant type.
Apply 200% of the rated DC voltage for one hour at the maximum
operating temperature ±3°C. Remove and let sit for 48±4 hours
at room temperature. Perform initial measurement.
Visual inspection
30pFmin. : Q
U
350
10pF and over, 30pF and below:
Q
U
275+
C
10pFmax. : Q
U
200+10C
C : Nominal Capacitance (pF)
5
Y
2
W.V. : 25Vmin. : 0.035 max.
W.V. : 16V : 0.05 max.
Q/D.F.
More than 1,000M
Ω
or 50
Ω
• F
(Whichever is smaller)
I.R.
Continued on the following page.
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration : 0.5ms, peak value: 1500g and velocity change: 4.7m/s.
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2000Hz. The
frequency range, from 10 to 2000Hz and return to 10Hz, should
be traversed in approximately 20 minutes. This motion should be
applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).
No defects or abnormalities
External Visual
9
Using calipers
Within the specified dimensions
Phisical Dimension
10
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol
monomethylether
1 part (by volume) of monoethanolomine
Resistance
to Solvents
No marking defects
Appearance
Within the specified tolerance
Capacitance
Change
30pFmin. : Q
U
1000
30pFmax. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
11
Mechanical
Shock
No marking defects
Appearance
Within the specified tolerance
Capacitance
Change
30pFmin. : Q
U
1000
30pFmax. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
12
Vibration
No defects or abnormalities
Appearance
Within the specified tolerance
Capacitance
Change
30pFmin. : Q
U
1000
30pFmax. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Resistance to
Soldering Heat
Appearance
Within the specified tolerance
Capacitance
Change
13
Immerse the capacitor in a eutectic solder solution at 260±5°C for
10±1 seconds. Let sit at room temperature for 24±2 hours, then
measure.
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150
°C for one hour and then let
sit for 48±4 hours at room temperature.
Perform the initial measurement.
W
0
Y
10
30pFmin. : Q
U
1000
30pFmax. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
Specifications and Test Methods
9
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Continued from the preceding page.
No.
AEC-Q200
Test Item
Temperature Compensating Type
High Dielectric Type
Specifications
AEC-Q200 Test Method
14
16
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 300 cycles
according to the two heat treatments listed in the following table
(Maximum transfer time is 20 seconds). Let sit for 24±2 hours at
room temperature, then measure
Continued on the following page.
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150
°C for one hour and then
let sit for 48±4 hours at room temperature.
Perform the initial measurement.
W
0
Y
10
(a) Preheat at 155°C for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-
K-5902) (25% rosin in weight proportion). Immerse in eutectic
solder solution for 5+0/-0.5 seconds at 235±5°C.
(b) Shall be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for
5+0/-0.5 seconds at 235±5°C.
(c) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for 120
±5 seconds at 260±5°C.
Per AEC-Q200-004
The capacitance/Q/D.F. should be measured at 25°C at the
frequency and voltage shown in the table.
The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 25°C and 125°C and within 2
minutes of charging.
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/ discharge current is less than 50mA.
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Thermal Shock
95% of the terminations is to be soldered evenly and
continuously.
Solderability
Appearance
Within ±2.5% or ±0.25pF
(Whichever is larger)
R7
Within ±10.0%
Capacitance
Change
30pF min. : Q
U
1000
30pF max. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
15
No marking defects
ESD
Appearance
Within the specified tolerance
Capacitance
Change
30pF min. : Q
U
1000
30pF max. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
17
No defects or abnormalities
Visual inspection.
Electrical
Chatacteri-
zation
Appearance
Within the specified tolerance
Capacitance
Change
30pF min. : Q
U
1000
30pF max. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25V min. : 0.025 max.
W.V. : 16V : 0.035 max
Q/D.F.
More than 100,000M
Ω
or 1,000
Ω
• F
(Whichever is smaller)
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
More than 10,000M
Ω
or 100
Ω
• F
(Whichever is smaller)
More than 1,000M
Ω
or 10
Ω
• F
(Whichever is smaller)
I.R. 25°C
I.R. 125°C
No failure
Dielectric
Strength
Char.
Item
Frequency
Voltage
1±0.1MHz
0.5 to 5Vrms
1±0.1kHz
1±0.2Vrms
∆
C
(1000pF and below)
∆
C
(more than 1000pF)
R7 (C
V
10µF)
Step
Temp. (°C)
Time (min.)
-55+0/-3
15±3
125+3/-0
15±3
1
2
Specifications and Test Methods
10
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Continued from the preceding page.
No.
AEC-Q200
Test Item
Temperature Compensating Type
High Dielectric Type
Specifications
AEC-Q200 Test Method
19
20
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1sec. The soldering should be done either
with an iron or using the reflow method and should be conducted
with care so that the soldering is uniform and free of defects such
as heat shock.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply *18N force in parallel
with the test jig for 60sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*2N (GCM15)
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip Length : 2.5mm max. >
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : 2.5mm / sec.
No marking defects
Terminal
Strength
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness
G
0.5mm rank : 20N
Chip thickness
V
0.5mm rank : 8N
< Chip L dimension : 3.2mm min. >
Chip thickness
F
1.25mm rank : 15N
Chip thickness
U
1.25mm rank : 54.5N
Beam Load Test
Appearance
Within the specified tolerance
Capacitance
Change
30pF min. : Q
U
1000
30pF max. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
18
No marking defects
Board
Flex
Appearance
Within ±5.0% or ±0.5pF
(Whichever is larger)
R7 : Within ±10.0%
Capacitance
Change
30pF min. : Q
U
1000
30pF max. : Q
U
400+20C
C : Nominal Capacitance (pF)
R7
W.V. : 25Vmin. : 0.025 max.
W.V. : 16V : 0.035 max.
Q/D.F.
More than 10,000M
Ω
or 500
Ω
• F
(Whichever is smaller)
I.R.
(in mm)
Type
GCM15
GCM18
GCM21
GCM31
GCM32
0.4
1.0
1.2
2.2
2.2
a
1.5
3.0
4.0
5.0
5.0
b
0.5
1.2
1.65
2.0
2.9
c
(in mm)
Type
GCM15
GCM18
GCM21
GCM31
GCM32
0.5
0.6
0.8
2.0
2.0
a
1.5
2.2
3.0
4.4
4.4
b
0.6
0.9
1.3
1.7
2.6
c
Iron Board
0.6
L
40
b
C
100
a
t : 1.6mm
(GCM15 : 0.8mm)
45
45
R4
20
114
Pressunzing
speed : 1.0mm/sec
Pressurize
Capacitance meter
Flexure :
V
2
(High Dielectric Type)
Flexure :
V
3
(Temperature
Compensating Type)
c
Baked electrode or
copper foil
Solder resist
(t=1.6mm
GCM15 : 0.8mm)
a
b
Fig. 1
Fig. 2
Fig. 3
Fig. 4
Continued on the following page.
Specifications and Test Methods
11
1
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!
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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Continued from the preceding page.
No.
AEC-Q200
Test Item
Temperature Compensating Type
High Dielectric Type
Specifications
AEC-Q200 Test Method
The capacitance change should be measured after 5 min. at
each specified temperature stage.
(1) Temperature Compensating Type
The temperature coefficient is determind using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 (
∆
C: +25°C to
+125°C : other temp. coeffs.: +25°C to +85°C) the capacitance
should be within the specified tolerance for the temperature
coefficient and capacitance change as Table A. The
capacitance drift is caluculated by dividing the differences
between the maximum and minimum measured values in the
steps 1, 3 and 5 by the capacitance value in step 3.
(2) High Dielectric Constant Type
The ranges of capacitance change compared with the above
25°C value over the temperature ranges shown in the table
should be within the specified ranges.
· Initial measurement for high dielectric constant type.
Perform a heat treatment at 150+0/-10°C for one hour and then
set for 48±4 hours at room temperature.
Perform the initial measurement.
21
Within the specified tolerance.
(Table A)
Capacitance
Temperature
Character-
istics
Capacitance
Change
Within the specified tolerance.
(Table A)
R7 : Withn ±15%
(-55°C to +125°C)
Temperature
Coefficent
Within ±0.2% or ±0.05 pF
(Whichever is larger.)
* Not apply to 1X/25V
Capacitance
Drift
Step
1
2
3
4
5
25±2
-55±3 (for
∆
C to R7)
25±2
125±3 (for
∆
C / R7), 85±3 (for other TC)
25±2
Temperature (°C)
Note 1 : Nominal values denote the temperature coefficient within a range of 25°C to 125°C (for
∆
C)/85°C (for other TC).
5C
0
T
30
0.25
0.40
0.58
-0.11
-0.17
-0.24
Char.
Nominal Values (ppm/°C) Note1
Capacitance Change from 25°C (%)
Max.
Min.
-30
-10
Max.
Min.
Table A
-55
Max.
Min.
Specifications and Test Methods
12
1
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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Part Number
Dimensions (mm)
W
T
Bulk Bag
Bulk Case
ø180mm reel
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
ø330mm reel
L
Quantity (pcs.)
Minimum Quantity Guide
Packaging Code
Packaging Type
Bulk Packaging in a bag
Tape Carrier Packaging
Bulk Case Packaging
Bulk Packaging
Packaging Code
B
D, L, K, J
C
Continued on the following page.
Tape Carrier Packaging
1. Dimensions of Reel
2.0
±
0.5
φ
180mm Reel
10
±
1.5 for 8mm wide tape
14
±
1.5 for 12mm wide tape
178
±
2.0
50 min.
φ
13.0
±
0.5
φ
21.0
±
0.8
(in mm)
φ
330mm Reel
2.0
±
0.5
2.5
±
0.5
10
±
1.5 for 8mm wide tape
14
±
1.5 for 12mm wide tape
φ
328
±
2.0
φ
50 min.
φ
13.0
±
0.5
φ
21.0
±
0.8
1) 68000pF/0.1
µ
F of R7 50V are not available by bulk case.
For Flow/Reflow
For Reflow
GCM18
GCM21
GCM31
GCM03
GCM155
GCM32
GCM43
GCM55
1.6
2.0
3.2
0.6
1.0
3.2
4.5
5.7
0.8
1.25
1.6
0.3
0.5
2.5
3.2
5.0
0.8
0.6
0.85
1.25
0.85
1.15
1.6
0.3
0.5
1.15
1.35
1.8/1.6
1.15
1.15
2.5
3.2
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
500
15,000
1)
10,000
-
5,000
-
-
-
-
50,000
-
-
-
-
-
-
-
-
-
10,000
10,000
10,000
-
10,000
-
-
50,000
50,000
-
-
-
-
-
-
-
-
-
-
-
-
10,000
-
10,000
6,000
-
-
10,000
8,000
4,000
5,000
4,000
5,000
4,000
2,000
1,500
4,000
4,000
4,000
-
4,000
-
-
15,000
10,000
-
-
-
-
-
-
-
-
-
-
-
-
3,000
-
3,000
2,000
-
-
3,000
2,000
1,000
1,000
1,000
1,000
1,000
500
300
1.35/1.6
1.8/2.0
1.35/1.6
1.8/2.0
Package
13
1
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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
2. Dimensions of Paper Tape
4.0
±
0.1
8mm width 4mm pitch Tape
8mm width 2mm pitch Tape
φ
1.5
+0.1
-
0
4.0
±
0.1
1.75
±
0.1
1.1 max.
8.0
±
0.3
Direction of Feed
A
B
3.5
±
0.05
2.0
±
0.05
A
Part Number
B
GCM18
GCM32
(T=0.85mm)
GCM31
(T
V
0.85mm)
GCM21
(T
V
0.85mm)
1.05
±
0.1
2.0
±
0.2
2.8
±
0.2
1.55
±
0.15
1.85
±
0.1
3.6
±
0.2
3.6
±
0.2
2.3
±
0.15
A*
Part Number
B*
GCM03
GCM15
0.37
0.65
0.67
1.15
*Nominal Value
(in mm)
2.0
±
0.05
φ
1.5
+0.1
-0
A
3.5
±
0.05
4.0
±
0.1
2.0
±
0.05
8.0
±
0.3
1.75
±
0.1
0.8 max.
Direction of Feed
B
Continued on the following page.
Continued from the preceding page.
3. Dimensions of Plastic Tape
8mm width 4mm pitch Tape
12mm width 8mm pitch Tape
A
Part Number
B
GCM21
(T=1.25mm)
GCM31
(T
U
1.15mm)
GCM32
(T
U
1.15mm)
1.45
±
0.2
2.8
±
0.2
1.9
±
0.2
2.25
±
0.2
3.5
±
0.2
3.5
±
0.2
A*
Part Number
B*
GCM43
GCM55
3.6
4.9
5.2
6.1
*Nominal Value
*Nominal Value
(in mm)
4.0
±
0.1
4.0
±
0.1
1.75
±
0.1
8.0
±
0.3
Direction of feed
A
B
2.0
±
0.1
0.2
±
0.1
2.5 max.
φ
1.5
+0.1
-0
3.5
±
0.05
(3.0 max. T=1.8/2.0 rank)
8.0
±
0.1
4.0
±
0.1
1.75
±
0.1
12.0
±
0.3
Direction of feed
5.5
±
0.1
2.0
±
0.1
0.3
±
0.1
2.5 max.
φ
1.5
+0.1
-0
A
B
Package
14
1
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Note
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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
4. Taping Method
(1) Tapes for capacitors are wound clockwise. The
sprocket holes are to the right as the tape is pulled
toward the user.
(2) Part of the leader and part of the empty tape shall be
attached to the end of the tape as follows.
(3) The top tape and base tape are not atteached at the
end of the tape for a minimum of 5 pitches.
(4) Missing capacitors number within 0.1% of the number
per reel or 1 pc, whichever is greater, and are not
continuous.
(5) The top tape and bottom tape shall not protrude
beyond the edges of the tape and shall not cover
sprocked holes.
(6) Cumulative tolerance of sprocket holes, 10 pitches :
±
0.3mm.
(7) Peeling off force : 0.1 to 0.6N* in the direction shown
below.
*GCM03 : 0.05 to 0.5N
165 to 180˚
Base Tape
Top Tape
Direction of Feed
160 min.
190 min.
210 min.
(Top Tape alone)
(in mm)
Vacant Section Chip-mounting Unit
Vacant Section
Leader unit
Continued from the preceding page.
Dimensions of Bulk Case Packaging
The bulk case used antistatic materials. Please contact
Murata for details.
6.8
8.8
12.0
2.0
3.0
1.5
110
(in mm)
36.0
31.5
Package
15
1
!
Note
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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
!
Caution
16
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
■
Storage and Operating Condition
Chip monolithic ceramic capacitors (chips) can
experience degradation of termination solderability
when subjected to high temperature or humidity, or if
exposed to sulfur or chlorine gases.
Storage environment must be at an ambient temperature
of 5-40 degree C and an ambient humidity of 20-70%RH.
Use chip within 6 months. If 6 months or more have
elapsed, check solderability before use.
(Reference Data 1. Solderability)
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
Please read rating and
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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
■
Soldering and Mounting
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
Locate chip
horizontal to the
direction in which
stress acts.
Chip arrangement
Worst A-C- (B, D)
Best
[Component direction]
[Chip Mounting Close to Board Separation Point]
A
B
D
C
Perforation
Slit
2. Solder
1. Mounting Position
Overly thick application of solder paste results in
excessive fillet height solder.
This makes the chip more susceptible to mechanical and
thermal stress on the board and may cause cracked
chips.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in chips
breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
[Optimum Solder Amount for Reflow soldering]
0.2mm min.
3. Chip Placing
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction bottom dead point must be set on
the upper surface of the board. Nozzle pressure for chip
mounting must be a 1 to 3N static load.
Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during, causing cracked chips. And the locating claw,
when worn out, imposes uneven forces on the chip when
positioning, causing cracked chips. The suction nozzle
and the locating claw must be maintained, checked and
replaced periodically.
Board Guide
[Correct]
Suction Nozzle
Board
Support Pin
[Incorrect]
Deflection
Continued on the following page.
!
Caution
17
1
!
Note
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!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
4. Reflow Soldering
Sudden heating of the chip results in distortion due to
excessive expansion and construction forces within the
chip causing cracked chips. So when preheating, keep
temperature differential,
∆
T, within the range shown in
Table 1. The smaller the
∆
T, the less stress on the chip.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(
∆
T) between the component and solvent within the
range shown in the above table.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock
on the PCB.
GCM03/15/18/21/31
GCM32/43/55
∆
T
V
190
°
C
∆
T
V
130
°
C
Part Number
Temperature Differential
Table 1
,
,
Q
Q
RR
R
SS
TT
¢
¢
££
£
¤¤
¥¥
,,
R
R
SS
S
T
T
¢¢
£
£
¤¤
¤
¥
¥
Soldering
60 seconds min.
120 seconds max.
20 - 40 seconds
Temperature (
°
C)
200
°
C
∆
T
Temperature (
°
C)
∆
T
60 seconds min.
120 seconds max.
20 seconds max.
Soldering
Time
Time
,,
R
R
S
SS
T
T
¢¢
£
£
¤
¤¤
¥
¥
Soldering temperature (
°
C)
Soldering time (sec.)
260
270
250
240
230
0
30
60
90
120
280
220
[Standard Conditions for Reflow Soldering]
[Allowable Soldering Temperature and Time]
In case of repeated soldering, the accumulated
Soldering time must be within the range shown
above.
Infrared Reflow
Vapor Reflow
Continued from the preceding page.
5. Leaded Component Insertion
If the PCB is flexed when leaded components (such as
transformers and lCs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs prevent warping.
Gradual
cooling
(in the air)
Gradual
cooling
(in the air)
Preheating
Preheating
Continued on the following page.
!
Caution
18
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Optimum Solder Amount for Flow Soldering
Adhesive
Up to Chip Thickness
6. Flow Soldering
Sudden heating of the chip results in thermal distortion
causing cracked chips. And an excessively long soldering
time or high soldering temperature results in leaching of
the outer electrodes, causing poor adhesion or a
reduction in capacitance value due to loss of contact
between electrodes and end termination.
When preheating, keep temperature differential between
solder temperature and chip surface temperature,
∆
T,
within the range shown in Table 2. The smaller the
∆
T,
the less stress on the chip.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Don't apply flow soldering to chips not listed in Table 2.
GCM18/21/31
∆
T
V
150
°
C
Part Number
Temperature Differential
Table 2
[Standard Conditions for Flow Soldering]
[Allowable Soldering Temperature and Time]
In case of repeated soldering, the accumulated
Soldering time must be within the range shown above.
,
,
Q
Q
R
RRSS
S
TT
¢
¢
£
££¤¤
¤
¥¥
Soldering
Preheating
60 - 120 seconds
Temperature (
°
C)
∆
T
5 seconds max.
Time
,,
,
Q
RR
R
S
SS
T
TT
¢¢
¢
££
£
¤
¤¤
¥
¥¥
Soldering temperature (
°
C)
Soldering time (sec.)
260
270
250
240
230
0
10
20
30
40
280
220
Continued from the preceding page.
Gradual
cooling
(in the air)
Continued on the following page.
!
Caution
19
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Optimum Solder Amount when Corrections Are Made
Using a Soldering Iron
Up to Chip Thickness
7. Correction with a Soldering Iron
(1) For Chip Type Capacitors
Sudden heating of the chip results in distortion due to a
high internal temperature differential, causing cracked
chips. When preheating, keep temperature differential,
∆
T, within the range shown in Table 3. The smaller the
∆
T, the less stress on the chip.
[Standard Conditions for Soldering Iron Temperature]
GCM15, GCM18/21/31
GCM32/43/55
∆
T
V
190
°
C
∆
T
V
130
°
C
Part Number
Temperature Differential
Table 3
,
,
Q
Q
R
RRSS
S
TT
¢
¢
£
££¤¤
¤
¥¥
Soldering
Preheating
Gradual
cooling
(in the air)
60 - 120 seconds
20 seconds max.
∆
T
Time
[Allowable time and Temperature for Making
Corrections with a Soldering Iron]
,
,
Q
Q
RRS
S
TT
¢
¢
££¤
¤
¥¥
Soldering time (sec.)
260
270
250
240
230
0
30
60
90
120
280
220
8. Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked
chips or broken solder. Take note not to vibrate PCBs.
Failure to follow the above cautions may result, worst
case, in a short circuit and fuming when the products is
used
Temperature (
°
C)
Soldering temperature (
°
C)
Continued from the preceding page.
!
Caution
20
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
!
Caution
21
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
■
Handling
1. Inspection
Thrusting force of the test probe can flex the
PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of
the PCB to prevent warping or flexing.
2. Board Separation (or Depane-lization)
• Board flexing at the time of separation causes
cracked chips or broken solder.
• Severity of stresses imposed on the chip at the
time of board break is in the order of :
Pushback<Slitter<V Slot<Perforator.
• Board separation must be performed using special
jigs, not with hands.
3.Reel and bulk case
• In the handling of reel and case, please pay
attentionnot to drop it.
Please do not use chip of the case which dropped.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
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Note
C03E.pdf 04.5.21
■
Soldering and Mounting
(1) Notice for Pattern Forms
1. PCB Design
Unlike leaded components, chip components are
susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal
stresses than leaded components.
Excess solder fillet height can multiply these stresses and
cause chip cracking. When designing substrates, take
land patterns and dimensions into consideration to
eliminate the possibility of excess solder fillet height.
Pattern Forms
Incorrect
Correct
Lead Wire
Solder Resist
Chassis
Solder (Ground)
Electrode Pattern
Solder
Resist
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
Placing Close to Chassis
Placing of Chip Components
and Leaded Components
Placing of Leaded Components
after Chip Component
Lateral Mounting
Continued on the following page.
Notice
22
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
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!
Note
C03E.pdf 04.5.21
GCM18
GCM21
GCM31
1.6
g
0.8
0.6
e
1.0
0.8
e
0.9
0.6
e
0.8
2.0
g
1.25
1.0
e
1.2
0.9
e
1.0
0.8
e
1.1
3.2
g
1.6
2.2
e
2.6
1.0
e
1.1
1.0
e
1.4
(in mm)
(2) Land Dimensions
Part Number
Dimensions
Dimensions (L
g
W)
a
b
c
Table 1 Flow Soldering Method
GCM15
GCM18
GCM21
GCM31
GCM32
GCM43
GCM55
1.0
g
0.5
1.6
g
0.8
2.0
g
1.25
3.2
g
1.6
0.3
e
0.5
0.6
e
0.8
1.0
e
1.2
2.2
e
2.4
2.0
e
2.4
3.0
e
3.5
4.0
e
4.6
0.35
e
0.45
0.6
e
0.7
0.6
e
0.7
0.8
e
0.9
1.0
e
1.2
1.2
e
1.4
1.4
e
1.6
0.4
e
0.6
GCM03
0.6
g
0.3
0.2
e
0.3
0.2
e
0.35
0.2
e
0.4
0.6
e
0.8
0.8
e
1.1
1.0
e
1.4
1.8
e
2.3
2.3
e
3.0
3.5
e
4.8
3.2
g
2.5
4.5
g
3.2
5.7
g
5.0
(in mm)
Part Number
Dimensions
Dimensions (L
g
W)
a
b
c
Table 2 Reflow Soldering Method
Chip Capacitor
Land
Solder Resist
Continued from the preceding page.
Continued on the following page.
a
b
c
2. Adhesive Application
Thin or insufficient adhesive causes chips to loosen or
become disconnected when flow soldered.
The amount of adhesive must be more than dimension c
shown in the drawing below to obtain enough bonding
strength.
The chip's electrode thickness and land thickness must
be taken into consideration.
Low viscosity adhesive causes chips to slip after
mounting. Adhesive must have a viscosity of
5000pa-s (500ps) min. (at 25
°
C)
Land
Adhesive
Board
Chip Capacitor
a
b
c
c : 50 to 105
µ
m
b : 30 to 35
µ
m
a : 20 to 70
µ
m
3. Adhesive Curing
Insufficient curing of the adhesive causes chips to
disconnect during flow soldering and causes deteriorated
insulation resistance between outer electrodes due to
moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Notice
23
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
4. Flux Application
An excessive amount of flux generates a large quantity of
flux gas, causing deteriorated solderability.
So apply flux thinly and evenly throughout.
(A foaming system is generally used for flow soldering) .
Flux containing too high a percentage of halide may
cause corrosion of the outer electrodes unless sufficiently
cleaned. Use flux with a halide content of 0.2w% max.
But do not use strongly acidic flux.
Wash thoroughly because water-soluble flux causes
deteriorated insulation resistance between outer
electrodes unless sufficiently cleaned.
Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown below) and 25% of the length A-B shown below as
mounted on substrate.
[As a Single Chip]
[As Mounted on Substrate]
5. Flow Soldering
A
B
C
D
Outer Electrode
B
A
Continued from the preceding page.
Notice
24
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
!
Note
C03E.pdf 04.5.21
Notice
25
1
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
■
Other
1. Resin Coating
When selecting resin materials, select those with
low contraction.
2. Circuit Design
These capacitors on this catalog are not safety
recognized products
3. Remarks
The above notices are for standard applications
and conditions. Contact us when the products are
used in special mounting conditions. Select optimum
conditions for operation as they determine the
reliability of the product after assembly.
The data here in are given in typical values, not
guaranteed ratings.
Please read rating and
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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
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Note
C03E.pdf 04.5.21
Head Office
2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone: 81-75-951-9111
International Division
3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan
Phone: 81-3-5469-6123 Fax: 81-3-5469-6155 E-mail: intl@murata.co.jp
http://www.murata.com/
Please read rating and
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CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
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Note
C03E.pdf 04.5.21
Note:
1. Export Control
<
For customers outside Japan
>
Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive
weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons.
<
For customers in Japan
>
For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required
for export.
2. Please contact our sales representatives or product engineers before using the products in this catalog for the applications listed below, which require especially
high reliability for the prevention of defects which might directly damage to a third party's life, body or property, or when one of our products is intended for use
in applications other than those specified in this catalog.
q
Aircraft equipment
w
Aerospace equipment
e
Undersea equipment
r
Power plant equipment
t
Medical equipment
y
Transportation equipment (vehicles, trains, ships, etc.)
u
Traffic signal equipment
i
Disaster prevention / crime prevention equipment
o
Data-processing equipment
!0
Application of similar complexity and/or reliability requirements to the applications listed in the above
3. Product specifications in this catalog are as of April 2004. They are subject to change or our products in it may be discontinued without advance notice. Please
check with our sales representatives or product engineers before ordering. If there are any questions, please contact our sales representatives or product
engineers.
4. Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
5. This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or
transact the approval sheet for product specifications before ordering.
6. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect
of our and/or a third party's intellectual property rights and other related rights in consideration of your use of our products and/or information described or
contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned
above under licenses without our consent.
7. No ozone depleting substances (ODS) under the Montreal Protocol are used in our manufacturing process.