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Table of Contents

About Rochester Electronics

Rochester Electronics is the world’s largest conti nuous source of semiconductors–100% Authorized by

over 70 leading semiconductor manufacturers.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types.

With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly,

Test, Reliability, and IP Archiving providing single soluti ons through to full turnkey manufacturing,

enabling faster ti me-to-market.

Rochester Electronics is registered to manufacture ITAR products.

Rochester Electronics Manufacturing Services

Page Number

Wafer Processing and Storage

Assembly

4-5

Component Lead Finishing

Test

Design Services

7-8

Reliability Services and IP Archiving

Wafer Processing and Storage

• Long-term storage and managed logisti cs manufacturing programs

• Parts management

• Usage reporti ng

• Wafer back-side grind

• Wafer dicing

• Die pick and place

• Die inspecti on

Proven reliable long-term storage of wafer and die

Long-Term Storage

Wafer Processing

Die Banking

Next Generati on Storage Opti on

• ISO-7/10K certi fi ed

• Enhanced ESD controls

• ISO-5 Inspecti on areas
• Relati ve humidity control

• Real-ti me monitoring of temperature and humidity

• Auto-purge on power fail

• Secure room and individual cabinets

Rochester off ers a range of services at our Newburyport facility including:

Assembly

• Automated and semi-automated

assembly equipment

• Eutecti c, Silver Glass and Epoxy Die Att ach

• Frit, Solder Seal and Metal Can Sealing

• Quick-turn prototyping capability with OCPs

• Package replicati ons including leadframes

• DLA certi fi ed

• Multi ple lead fi nishes available including

Sn, SnPb, and RoHS

• Flexible equipment to handle mix of

• Sidebraze DIPs

• Cerdips (includes replicated frames)

• Metal cans

• PGA

• Cerpacks

• CQFP

• Custom/other

• Commercial and military ﬂ ows

• In-house reliability testi ng

• Qualifi cati on services available

Open Cavity Packages

Hermeti c Assembly

We off er a broad range of Open Cavity Packages (OCPs) for quick-turn IC prototyping, enabling a quicker

ti me-to-market for new product introducti ons.

OCPs are ideal for R&D or pre-producti on environments and represent a very cost-eff ecti ve soluti on for low

volume prototypes.

Available IC package types include:

Flexible hermeti c assembly line supporti ng high mix of products with low minimum run requirements.

• QFN – from 3x3 mm to 8x8 mm

• LCC

• PGA

• QFP

• DIP

• TO

• Custom soluti ons also available

• Automated saw, die att ach and wire bond equipment

• Full automold and semi-automated mold equipment

• Flexible manufacturing space supporti ng business plans

from low volume/high mix to full high volume, dedicated

line manufacturing

• Lead fi nish operati ons supporti ng SnPb, Matt e Sn and RoHS

• Leadframe opti ons including:

design/replicati on, pre-plated, spot plated

• Gold ball bond

• Epoxy die att ach

• Custom assembly soluti ons

• Multi ple lead fi nishes available including Sn, SnPb, RoHS

• Qualifi cati on services available

Assembly

• SnPb plati ng

• Matt e Sn plati ng

• Ni Plati ng

• Flexible rack plati ng system

supports plati ng of leadframes

and other electronic components

• Ability to re-introduce

most package technologies

• ROHS/SnPb lead

fi nishes available

• JEDEC and custom

package outlines

• Confi gurable for other

plati ng soluti ons

• Pre-plated RoHs frames

• Solder dip opti ons

• Substrate and leadframe

design services available

• Qualifi cati on services

available

Zero Discharge Waste

Water Treatment

Environmentally-responsible zero

discharge waste water treatment

facility provides re-use of all waste

water without discharging materials

to city drains.

Lead fi nish, or “leadfi nish,” is the process of applying a coat of

metal over the leads of an integrated circuit to protect the leads

against corrosion and abrasion, and to improve solderability.

Rochester Electronics off ers a range of soluti ons to meet the

requirements of a wide variety of applicati ons.

Plasti c Assembly

Component Lead Finishing

Package, Substrate and Leadframe Replicati on

Implementi ng plasti c assembly soluti ons for internal and

external customer needs

In additi on to our in-house faciliti es,

we have strong relati onships with a

number of the world’s leading Off Shore

Assembly and Test (OSATs) houses.

Leveraging their capabiliti es, we can

manage your assembly requirements in

a cost-eff ecti ve manner from low

volume, high mix product portf olios to

high volume producti on.

Test

• 100% Authorized test services are traceable

and guaranteed

• Original OCM approved test soft ware

when available

• Current and legacy ATE platf orms

• Flexible equipment uti lizati on

Test services include:

Over 30,000 square foot Test,

program and burn-in facility

• 22 Major ATE platf orms

• Handlers and kits to support over

100 package types

• BP Microsystems and Data I/O

programmers

Test capabiliti es

• Digital, Analog, RF, Memory, ECL, Mixed

Signal, Gate Arrays, ASICs, PLDs, FPGAs

• Tri-temp automati on for package

and wafer

• Creati on of custom high-quality

test soluti ons

• Temperature profi ling: -60º C to +200º C

ATE platf orm conversions
Component programming

• BP microsystems, Data I/O, OCM specifi c

Electrical and mechanical interface design

Overview:

Test/Component Engineering Overview and Capabiliti es

Test development

• Custom DUT load boards and

mechanical interfaces

• Probe interfaces

Full CAD design
Device burn-in

• MIL-STD-883 methods 1005 & 1015

(Conditi ons A, B, C, D)

• Stati c, dynamic and custom burn-in circuits

• Special screening

• Up-screening

• Selected item drawings

• Source Control Documents (SCDs)

• Tier-2 automoti ve testi ng

• Military

• Design centers located in North America - Rockville, MD

and Minneapolis, MN

• DO-254 minor change classifi cati on

• Physical design replicati on from the original archive or die

• Physical process replicati on through device analysis

and selecti on

• Reverse engineering opportuniti es

• Over 200 products successfully put back

into manufacturing

• Industry standard design tools in-house for

complete ﬂ ow

• Design team has direct design experience through

28nm technology nodes

• Majority of current acti viti es are in 250nm

to .8um geometries

• Extensive analog and digital background

• Low touch soluti on: original component manufacturer

(OCM) engineering once archive is transferred

• Extensive experience decoding unique archives from

100% authorized OCMs

• Design closure

• Database forensics

• Test generati on

• Layout, DRC, LVS

• Spice analysis

• Signal integrity

• IO edge-rate matching

• Legacy voltage (3v/5v) ASIC

• Analog and Digital design

• Electrical performance replicati on

• ITAR designs

• Drop-in replacement

• Extensive ASIC background

Design (Physical Clone) Porti ng Experts

Full authorizati on with OCM archives provide the lowest risk

and highest quality product.

Design Capabiliti es

Rochester can replicate the original device avoiding lengthy expensive system re-qualifi cati on, recerti fi cati on,

or redesign. The end-product is a form, fi t, and functi onal replacement guaranteed to the original data sheet

performance.

No soft ware changes required. 100% soft ware compati bility with no errata.

Developing soluti ons for long-term support

Design Service

Rochester Electronics has significant expertise in stress

testing which enables our customers to accelerate

potential failure mechanisms, help identify root cause

and take actions to prevent failure mode. Our in-house

equipment includes thermal, mechanical, moisture and

bond testing for a wide variety of tests.

Data Storage, Recovery and Content Management

Reliability

Archive Services

• Media restoration, translations, conversions and

data recovery

• Content Management System, which is organized,

searchable, with easy deposit

• Secure - controlled access, RAID Storage, fireproof

off-site backup

• MIL-STD-883 TM 5004 & 5005 for Levels B, Q and V

• In-House DLA lab certified for Group A, B, C and D

• Reliability testing to JEDEC standards

Design and Product Replication

Reliability Services and IP Archiving

Rochester’s replication process results in a minimally modified source GDS2

that is DRC clean for a target fab where a commercially available close process node

has been targeted using spice analysis and cross-sectional analysis on the OCM product.

• Netlist-based new layout, new

technology, or new timing

• Synthesis from RTL re-targeting

• Emulation of a product

• Identical die size with same physical structures on the die

• Same edge rates, same power, same voltage, same package

• 100% software compatibility with no errata

• Authorized and enabled by the original semiconductor company

• A drop-in replacement for the customer

Replication Overview

Replication/Porting/Cloning is
NOT any of the following:

Rochester Replication is Porting or Cloning:

Replicated Products - For Critical Applications Demanding Lower Risks than an Emulation

The Semiconductor Lifecycle Solution

™

Rochester Electronics, LLC

16 Malcolm Hoyt Drive

Newburyport, MA 01950

United States
Phone: +1.978.462.9332

Fax: +1.978.462.9512

sales@rocelec.com

www.rocelec.com

Global Headquarters

Contact us with your requirements today.

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