4

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High Density
options for up 
to 1200 I/Os 
per interface
including:

• Choice of .025" (0,64mm), 

.050" (1,27mm) and 
2mm (0.0787") pitch

• Soldered and solderless

systems 

Flex Design/Build Expertise

• Standard data links and custom flex circuits

• Double-sided, multi-layer, high speed, shielded 

and complex single-sided

Connector Expertise

• Full line of high speed, high density and 

micro interconnects

• Unmatched application specific interconnect capabilities

• Designs for hot bar or ZIF/LIF termination 

to the board

Signal Integrity Expertise

• In-house SI services for optimum design 

of conductor routing and terminations

• Full line of high speed connector termination options

• Custom system analysis capability from flex circuit

and terminations to complete systems

High speed
variety with
signal integrity
up to 10GHz
including: 

• Low Profile

• Elevated

• Edge Mount

• Right Angle

• Cable Assemblies

• Single-Ended

• Differential Pair 

Signal Integrity Center

A comprehensive, user friendly web site for high-speed
connector models, reports, drawings and searches. 

Signal Integrity Group

Signal Integrity Engineering Support 

For questions on applications that cannot be obtained from the
Signal Integrity Center, Samtec's Signal Integrity Group offers
person-to-person SI engineering support.

Custom Signal Integrity Services

Application specific design, modeling and testing services.

For the ultimate in Signal Integrity Services, Samtec offers
design, modeling and testing of your circuits, subsystems or
complete system.

Signal Integrity Services:

Integrated services for selection, development,
simulation and testing of high speed systems.

High Speed Interfaces:

Wide variety of high speed/high
density connectors and flex
circuit assemblies.

TM

TM

End-to-End Solutions: 

In-house design, analysis and manufacturing
of high speed connectors, circuits and
subsystems.

Flex Circuitry: 

A unique combination of flex circuit design
and construction expertise, connector
expertise and Signal Integrity expertise. 

Sudden Circuits

TM

DIVISION

INTEGRITY

SIGNAL

pgs. 19-29

pgs. 59-65

pgs. 28-29

pgs. 277-281

TM

TM

2.33 GHz

TM

up to 

C

M

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Micro/Board-to-Board

Micro Card

• Micro Edge Card Sockets

• MSA Transceiver Interfaces

• High Speed Interface Cards

• Mini Edge Card Sockets

• Micro Bay

• Smart Card

• Flex Card

Flexible Board-to-Board

• Flex Stack on .050" (1,27mm), 2mm

(.0787") and .100" (2,54mm) pitch

• Standard headers and sockets

• Low Profile and Skyscraper

• PC104 and PC104+

• Right Angle for perpendicular and

coplanar applications

• Shrouded systems for micro-rugged

applications

Micro Pitch and One Piece

• Low profile and skyscraper designs

• Micro Blade & Beam on 0,50mm 

(.0197"), .025" (0,635mm) and 
0,80mm (.0315") pitch

• Micro Pin & Socket on 0,80mm 

(.0315") and 1mm (.0197") pitch

• One Piece systems for low 

profile, micro rugged and 
solderless applications

pgs. 115-122

pgs. 83-88

pgs. 243-250

RISE

C

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Micro-Rugged

Micro-Rugged Power-to-Board

• Systems designed for high cycle & high reliability

• Combination power and signal

• Edge Card power interfaces

• Isolated power pin systems

Micro-Rugged Cable Interfaces

• 2mm (.079") and .050" (1,27mm) pitch systems

• Socket & plug configurations

• Shrouded ejector headers for mating

• Matched impedance micro coax

• Match impedance on flex circuits

• Rugged Tiger Eye systems on flex circuits

• High Speed blade & beam on 0,8mm (.0315") pitch with latches

• Flex jumpers for mating with one-piece interfaces and mini-edge card sockets

High Reliability & High 
Cycle Contacts

• Multi-finger BeCu contact

• Tested to 10,000 cycles

with PdNi plating

• 2mm (.079") pitch, .050"

(1,27mm) pitch IDC
cable and power
applications

• Highest reliability contact system

Micro-Rugged Micro Card 
Interfaces

• Guide posts for blind mating

• 0,80mm (.0315") & 1mm (.0394") pitch systems

• High Speed edge-mount blade & beam

• Mini Edge Card sockets (vertical and horizontal)

• Micro Bay Card Guide systems

Micro-Rugged Board-to-Board

• Tiger Eye & Tiger Buy contacts

• Blind mating & self mating

• Solder lock terminations

• .050" (1,27mm), 2mm (.079") and 

.100" (2,54mm) systems

Micro-Rugged One-piece Interfaces

• Rugged screw down board termination

• Ultra low profile to elevated designs on 1mm (.0394") pitch

• No bent pins

• One-piece power

High Retention
Contacts

• Tuning Fork Phosphor

Bronze contact

• Highest retention

contact system due 
to robust yet cost
effective design

• 2mm (.079") pitch, .100" (2,54mm) 

pitch and Power applications

One-piece
Interfaces

• High shock/high vibration

applications with mechanical
board connections

• Superior alignment/less skew

• No bent pins

Blind and 
Positive Mating

• Shrouded systems on .100"

(2,54mm), 2,00mm (.079")
and .050" (1,27mm) pitch
for blind mating

Align & Latch

• Systems available on .025"

(0,635mm), .050" (1,27mm),
2mm (079"), .100" (2,54mm)
and .165" (4,19mm) 

• Board-to-Board, Power 

and Cable systems

• Keyed systems to polarize 

for error-proof mating

• Friction locks increase

unmating force by two 
to five times that of 
standard systems

• Latching systems prevent

accidental unmating

Rugged contacts and insulators for high reliability
Micro-Rugged applications including: board-to-board,
one-piece, power, cable-to-board, card-to-board, 
flex circuit and micro backplanes.

MICRO

RUGGED

TM

Rugged Insulators

Rugged Contacts

pgs. 115-122

pgs. 275-283

pg. 88

pgs. 243-250

pgs. 211-215

C

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ON THE WEB!

www.samtec.com 

Cable

High Speed Systems

• Mini Coax Cable

• Shielded IDC

• Shielded Flex Jumpers

• Signal Integrity Services Division for

design, testing and support

Micro Rugged/IDC

• Choice of .100" (2,54mm), 2mm (.0787")

and .050" (1,27mm) pitches

• Low Profile

• Single and Double Row

• Ejector Headers with Locking Caps

• Sockets and Plugs

• Wide variety of pin counts

• Discrete Wire Align & Latch

Flex Design /Build Expertise

• Standard data links and custom flex

• Double-sided and Multi-layer

• High Speed and Shielded

• Complex single-sided

• Custom Flex Circuits

Connector Expertise

• Full line of high speed, high density and micro interconnects

• Unmatched application specific interconnect capabilities

• Designs for hot bar or ZIF/LIF termination to the board

• ZIF/LIF Flex Circuits and Connectors

• Flex-Lock Connectors

Signal Integrity Expertise

• In-house SI services for optimum design of

conductor routing and terminations

• Full line of high speed connector termination options

• Custom system analysis capability from flex circuit

and terminations to complete systems

pgs. 278-279

pgs. 28-29

pgs. 280-281

pgs. 276-277

pgs. 282-283

DIVISION

INTEGRITY

SIGNAL

Application Specific

C

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High Speed /
High Density

• Custom differential 

pair configurations

• Ferrite shielding

• Paste In-Hole 

(PIH) designs

• Modified Standards

• LGA interfaces

• Custom Signal 

Integrity Services

Micro Rugged /
Power

• Modified standards

• “Power Blades”

Cable

• High Data Rate cable

• Custom Flex cable

• Custom IDC cable

• Custom connectors

AGILENT

LOGIC ANALYZER

MATE:

ASP-65067-01

One-Piece and
Micro Card

• Interstitial designs

• Battery contacts

• Special features

• Elevated designs

• Special edge mount

• Card rail modifications

DIVISION

INTEGRITY

SIGNAL

More Application Specific

 >

Application Specific

C

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Testing &
Development

• SMT lab for processing

studies

• Stereolithography for

mechanical studies

• Quick-turn prototype

capabilities

• In-house mold design and

fabrication

• Quick change tooling for

every modification

Special Plating

• Custom metals and alloys

• Special thicknesses

• Selective plating

Personal Design Center

• Customer Specific Web Site

• Import, view and print drawings on line

• Modify (“redline”) standard product prints to your specifications

• Work with Samtec Applications Engineer on-line

• Maintain and view a log of all previous correspondence, prints

and technical data

• Check project status, sample availability, ship dates, material

status, etc., in real time

• Find product series that best suits your application

Custom Connectors

• “Hinged” Connectors

• Special pins

• Custom molding

• Automotive

Body Modifications

• Custom material

• Molded pick-and-place pads

• Shrouds

• Modified alignment pin size and position

• Screen printing

• Multiple stacked bodies

• Hardware enhancements for ease of

placement and mechanical stability

Pin Modifications

• Hot pluggable

• Special crimps

• Modified footprints

• Unusual angles

• Special jumpers

• Varied pin height

• Elevated right angles

• Opposing bends

• Multiple polarization/

selectively loaded

• Adaptors

< 

More Application Specific

C

M

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Product Searches

• By part

number

• By picture

• By word

description

• By series

• By board

stacking

• By cross

reference

Build-a-Part
Number

• Automatically validate

part numbers

• Order samples on-line

• Sample Shopping Cart 

• Sudden Samples ship

within 24 hours via
express service

www.samtec.com?logon=psc

• Customer specific information

• Real time 24 hours/7 days

• Quotes and ordering on-line

• Delivery status and expediting

• Shipment tracking

• “Personal Call Back” program available

www.samtec.com?logon=pdc

• Project Management System

• For standard and modified connectors

• Create modified connectors on-line by

“redlining” prints

• “Personal Call Back” program available

Test Reports

• By Series

• Standard specifications

Product Specs

• Engineering prints

• PCB footprints

• PDF catalog pages

• Lead coplanarity

specifications

Flex Processing

• Design options and

recommendations

• Processing literature on-line

Personal Call Back

• Immediate reply from a

Samtec Customer 
Service Representative, or
Signal Integrity Group

• Choose either phone or

private one-on-one chat

• Pick from one of Samtec’s

worldwide service facilities

www.samtec.com

Sudden Information 

ON THE WEB!

www.samtec.com 

PROCESSING AND

DESIGN INFO

Your personal design center to find the best product for your

application and to create-a-part by “redlining” (modifying)

prints on-line.

www.samtec.com?logon=pdc

Customer specific web sites so you can find out
everything about your orders… 
Pricing  •  Delivery  •  Order Status
Quote Inquiry  •  Order Entry  •  Expediting

www.samtec.com?logon=psc

Samples shipped 

within 24 hours of order.

www.samtec.com/sudden_service/samples/samples.asp 

Popular connectors 
shipped in three days.

www.samtec.com/sudden_service/lead_time_inquiry.asp 

In-house staff of engineers and a full capabilities electrical test
lab to field your questions and recommend specific Samtec High
Speed interfaces.

www.samtec.com/signal_integrity/capabilities/support/
signal_integrity_group.asp

Sudden Service

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In-house staff of engineers available to field interconnect processing

questions, assist you in improving the processing and

manufacturability of boards and lowering their total applied cost.

www.samtec.com/standard_products/processing_information/ipg.asp 

GROUP

INTEGRITY

SIGNAL

Flexible Design Solutions

Tiger Eye

• High reliability

• High mating cycles

• Multi-finger contact

Z Beam

• High density

• Solderless

Tiger Buy

• High retention

• Cost effective

• Tuning fork contact

Tiger Beam

• Best cost

• Reliable performance

• Post and beam contact

Flex Mold

• Cost effectively add

processing features

• Molded or Modular

Add-On

• Alignment Pins

• Pick & Place Pads

• Shrouds

• Solder Locks

Flex Stack

• Position bodies in .005"

(0,13mm) increments

• Stack three boards

• Bottom entry

• Self-nesting sockets for

stacking unlimited boards

Tiger Claw

• Pass-through

• Ultra low profile

• Dual wipe contact

Blade-and-Beam 

• Micro pitch

• Mating/alignment

“friendly”

• Cost effective

CONTACT

Flex Shroud

• End Shrouds

• Locking Clips

• Ejector Latches

• Guide Posts

• Board Locks

Flexible design solutions from sockets 
and contacts to moldings and shrouds, and 
application specific and processing solutions.

CONTACT

TM

DIVISION

INTEGRITY

SIGNAL

HIGH SPEED

HIGH SPEED 

HIGH

APPLICATIONS

Low Profile Q-Strip

™

to 2.33 GHz  . . . . . . . . . . . . . . . . . . . . . . . .20

Elevated, Shrouded, Mixed Technology  . . . . . . . . . . . . . . . . . . .21
Q-Pairs

™

to 10 GHz  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Right Angle & Edge Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Elevated High Speed   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24-25
High Speed Cable & Data Links  . . . . . . . . . . . . . . . . . . . . . .26-27
Signal Integrity Services  . . . . . . . . . . . . . . . . . . . . . . . . . . . .28-29

STANDARD PRODUCTS

0,5mm Pitch (QTH, QSH)  . . . . . . . . . . . . . . . . . . . . . . . . . . 30-33
.025" (0,635mm) Pitch (QTS, QSS, MIT, MIS) . . . . . 34-35, 42-43
0,8mm Pitch (QTE, QSE)  . . . . . . . . . . . . . . . . . . . . . . . . . . . 44-49
Elevated High Speed (QUP8, QB8, HSEC8, HSC8)  . . . . . . . .50-55
Flex Circuit Assemblies (HFEM)  . . . . . . . . . . . . . . . . . . . . . . . . 56
Shielded IDC Assemblies (RCSD, RCMD) . . . . . . . . . . . . . . . . . 57
Coax Cable Assemblies (EQCD)  . . . . . . . . . . . . . . . . . . . . . . . . 58

Applications

• Blade Servers

• Routers

• Hubs

• Switches

• Network systems

• High end computers

• Test & diagnostic

• Accelerator Boards

• Wireless

• Broadband

• RAID

• System Controllers

• Control Platforms

Signal Integrity Services

• Internet Design Tool

• EE support and advice

• Custom design and testing services

Termination
Flexibility

• Surface Mount

• Right Angle

• Edge Mount

• Mixed Technology 

• Coax Cable

• Flex Cable

Signal/Ground
Flexibility

• Surface mount ground plane

• Differential Pair or Single Ended

• Hot pluggable/Fully shielded

Choice 
of Pitch
& Height

• 0,50mm (.0197")

• .025" (0,635mm)

• 0,80mm (.0315")

• 5mm to 30mm 

board spacings

S

P

E

E

D

TM

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Shielded Option

• EMI Shielding attached to board via

selected signal pins

• Dual stage hot pluggable: Shield and

ground planes first, then signal pins

• .025" (0,635mm) pitch

• Up to 130 I/Os

• Edge mount available

Mixed Technology Footprint

• Discrete ground plane every (12,70mm) .500"

soldered to plated through-holes for added PCB
retention

• 76 signal lines per linear inch (266 total)

• Choice of six mated heights: 5mm, 8mm, 11mm,

16mm, 18,75mm and 22mm

• Tray packaging available as 

standard option

MICRO

RUGGED

TM

AGILENT LOGIC

ANALYZER MATE:

(See page 316)

ASP-65067-01

Solid ground plane can also be used for
power up to 3 amps with no change in
electrical performance

QTH/QSH Near 

End 

Prop. 

Rated 

Rated

(5,03mm Stack)

Crosstalk

Delay

at 5%

at 10%

Single Ended

~5.25% ~10%

42.8pS

775MHz

1.75 GHz

@775MHz

@ 1.75GHz

Differential Pair

~0.8%

~1.1%

@ 585 MHz

@ 1 GHz

42.8pS

585 MHz

1 GHz

QTH/QSH 

Impedance Mismatch (

Ω

)

(5,03mm Stack)

Single Ended

50.0 to 43.5

50.0 to 48.1

50.0 to 48.9

50.0 to 49.1

@ 100pS

@ 250pS

@ 500pS

@ 750pS

Differential Pair

100.0 to 87.6 100.0 to 93.6 100.0 to 95.9 100.0 to 97.1

@ 250pS

@ 500pS

@ 750pS

@ 1nS

QTE/QSE Near 

End 

Prop. 

Rated 

Rated

(5,03mm Stack)

Crosstalk

Delay

at 5%

at 10%

Single Ended

~5% ~9%

35.0pS 1.2GHz

2.33 GHz

@ 1.20 GHz

@ 1.75GHz

Differential Pair

~3%

~4.25%

@ 2.33 GHz

@ 5.00 GHz

35.0pS 2.33 GHz

5.00 GHz

QTE/QSE 

Impedance Mismatch (

Ω

)

(5,03mm Stack)

Single Ended

64.0 to 50.0

56.2 to 50.0

52.9 to 50.0

51.6 to 50.0

@ 50pS

@ 100pS

@ 250pS

@ 500pS

Differential Pair

104.5 to 87.1 102.3 to 92.2 101.6 to 96.4 101.6 to 98.7

@ 50pS

@ 100pS

@ 250pS

@ 500pS

11,03mm

Rated Rated

Stack

at 5%

at 10%

Single 

350 MHz 440 MHz

Ended

Differential

875 MHz 2.30 GHz

Pair

22mm

Rated Rated

Stack

at 5%

at 10%

Single 

220 MHz

460 MHz

Ended

Differential

<350 MHz

350 MHz

Pair

For Complete Test Report see pg. 319 or logon to www.samtec.com?QSE

For Complete Test Report see pg. 319 or logon to www.samtec.com?QSH

Elevated

• 5mm through 30mm board spacing
• 0,50mm, 0,635mm and 0,80mm pitch

0,50mm 
(.0197") Pitch

•  Up to 300 signal pins

•  Mated heights from

5mm to 30mm

• Single ended and

differential pair

0,80mm (.0315") Pitch

•  Up to 200 signal pins

•  Mated heights from 5mm 

to 30mm

• Single ended and 

differential pair

• Edge mount connector sets

• Guide post options

.025" (0,635mm) Pitch

•  Up to 250 signal pins

• Mated heights to 16mm

• Edge mount & right angle designs

• Shielded designs available

pgs. 44-49

pgs. 34-35

pgs. 30-33

pgs. 36-38

pgs. 42-43

pgs. 30-49

QTE/QSE

QTS/QSS

QTH/QSH

QMSS

QFSS

MIT/MIS

QTE/QTS/QTH
QSE/QSS/QSH

HIGH SPEED BOARD STACKING 

HIGH SPEED BOARD STACKING 

0,50mm

0,635mm

0,80mm

QTH/QSH

QTS/QSS

QTE/QSE

5,03mm

5,03mm

5,03mm

8,03mm

8,03mm

8,03mm

11,03mm

11,03mm

11,03mm

14,03mm

16mm

16mm

16mm

19mm

19mm

22mm

22mm

25mm

25mm

30mm

30mm

BOARD

STACKING

PITCH

2.33 GHz

TM

up to 

1.75 GHz

TM

up to 

.025" 

(0,635mm) Pitch

.025" 

(0,635mm) Pitch

Standard Differential Pairs

• Optimized for 100

Ω

applications

• 0,80mm (.0315") and 0,50mm (.0197")

pitch system available now

• Mated heights from 5mm (.197") to

22mm (.866")

Edge Mount

• 0,635mm (.025") and 0,80mm

(.0315") pitch

• Accepts 1,60mm (.062") PCB

• Guide posts available

• Up to 250 I/Os

Application Specific
Differential Pairs

• Mix and match differential pairs with

standard signal pins for partitioned pairs

• Edge mount differential pairs allow

perpendicular and horizontal systems

QTH/QSH Near 

End 

Prop. 

Rated 

Rated

(0,50mm)

Crosstalk

Delay

at 5%

at 10%

0.62% 1.08%

39.0pS 700 MHz

1.33 GHz

@ 700 MHz

@ 1.40 GHz

Impedance Mismatch (

Ω

)

100.0 to 74.4 100.0 to 78.9 100.0 to 89.4 100.0 to 95.0

@ 50pS

@ 100pS

@ 250pS

@ 500pS

For complete Test Report see pg. 319 or logon to www.samtec.com?QSH-DP

5,03mm

Stack

Height

QTE/QSE Near 

End 

Prop. 

Rated 

Rated

(0,80mm)

Crosstalk

Delay

at 5%

at 10%

~1.75% ~2%

35.0pS 6.40 GHz

10 GHz

@ 6.4 GHz

@ 10.00 GHz

Impedance Mismatch (

Ω

)

111.6 to 88.0 103.6 to 94.0

98.8 to 98.2 100.0 to 99.6

@ 30pS

@ 50pS

@ 100pS

@ 250pS

For complete Test Report see pg. 319 or logon to www.samtec.com?QSE-DP

5,03mm

Stack

Height

PERPENDICULAR

APPLICATIONS

PERPENDICULAR

APPLICATIONS

HORIZONTAL

APPLICATIONS

HORIZONTAL

APPLICATIONS

Right Angle

• .025" (0,635mm) pitch

• PCB mounting holes

• Guide Posts

• Up to 200 I/Os

• Locking screw option in design

pgs. 32-33

0,50mm

(.0197") Pitch

QTH/QSH

pgs. 46-47

0,80mm

(.0315") Pitch

QTE/QSE

pgs. 40-41

.025" (0,635mm) Pitch

QTS/QSS

pg. 39

0,635mm 

(.025") Pitch

QTS/QSS

pgs. 48-49

0,80mm 

(.0315") Pitch

QTE/QSE

HIGH SPEED VARIETY

HIGH SPEED VARIETY

TM

High Speed Elevated Stacking

• Parallel high speed boards mate with two modified Q-Strips™

• Ground plane embedded in high speed boards

• “Engineered Electrical System” provides excellent electrical

performance in elevated board stacking applications

• Change stacking height via PCBs is quicker and less expensive

than modifying traditional connector system

• 19mm and 30mm standard stack height. 

Application specific heights on request

• Application specific latches available. 

Call Samtec.

High Speed Elevated
Flexibility

• 25mm standard board spacings

• Mates with vertical, right angle

and edge mount sockets

• Choice of high speed (HSEC8

Series) or standard 
(MEC8 Series) sockets 

• Single-ended or differential pair

signal routing

• 50 or 70 Single Ended I/Os

• 33 or 46 Differential Pair I/Os

• Other sizes available. Call Samtec

pgs. 52-53

HSEC8

pg. 51

QB8

pg. 50

QUP8

pg. 54

pg. 55

HSC8

APPLICATIONS

PERPENDICULAR

APPLICATIONS

HORIZONTAL

PARALLEL

APPLICATIONS

0,80mm

(.0315") Pitch

0,80mm

(.0315") Pitch

0,80mm

(.0315") Pitch

0,80mm 

(.0315") Pitch

MEC8

pg. 252

0,80mm 

(.0315") Pitch

MEC8

pg. 253

0,80mm 

(.0315") Pitch

MEC8

0,80mm

(.0315") Pitch

ELEVATED HIGH SPEED 

ELEVATED HIGH SPEED 

TM

CONFIGURATION

FREQUENCY

IMPEDANCE NEXT

(25mm Stack)

RATING

Single Ended 

2.5 GHz

50

Ω

±10%

9.6%

Differential Pair

3.5 GHz

100

Ω

±10%

2.4%

MEC8 Mated With HSC8

RISE

RISE

PTFE 
Insulation

Signal
Wires

Integrated
Drain
Wires

PTFE 
Ribbon
Cable

Foil 
Shield

High Speed Coax 
Cable Assemblies

• 38 AWG Miniature coax

ribbon cable

• Edge mount or vertical

• 50

Ω

and 100

Ω

systems

• 0,80mm pitch, 0,50mm

pitch in design 

• Application Specific

designs for other pitches
available

• Application Specific micro-

rugged designs available

Standard Flex Data Links

• Terminate with Single-Ended or

Differential Pair High Speed connectors

• Controlled Impedance Shielded 

Flex Circuits

• Wide choice of mating connectors on

0,80mm pitch

• Easy customization of cable lengths, 

pin counts, guide posts, connector
heights, etc

• For complete specifications see

www.samtec.com?HFEM

Modified Flex Data Links

• Micro Rugged features such as

alignment pins, hold downs, etc.

• Special pin routing

• Reverses, daisy chains, etc.

• Non-standard length and breakouts

Sudden Circuits

• End-to-end solutions: In-house design, analysis

and manufacturing of high speed connectors,
circuits and subsystems.

• High speed interfaces: Wide variety of high

speed/high density connectors and flex 
circuit assemblies.

• Signal Integrity Services: Integrated 

services for selection, development, 
simulation and testing of high 
speed systems.

• Samtec Sudden Service: 

Information, samples 
and delivery.

High Speed Shielded 
IDC Assemblies

• Made with Gore R

IBBON

-A

X

®

cable*

• 2x10, 2x20, 2x22 and 2x25 

position standard

• Sockets, terminals and combinations

• BeCu Tiger IDC Contact for 

highest reliability

• Mating ejector headers available

* RIBBON-AX

®

is a 

Registered Trademark
of W.L. Gore Associates

pg. 58

pg. 56

EQCD

HFEM

0,80mm

(.0315") Pitch

0,80mm

(.0315") Pitch

HIGH SPEED CABLE 

HIGH SPEED CABLE 

pg. 57

RCSD

RCMD

2mm

(.0787") Pitch

TM

HFEM – XXX – T – 05.00 – DP SPECIFICATIONS

Environment

Bandwidth

Impedance

NEXT

FEXT

Propagation

Delay*

Insertion Loss

(Longest Path)

* Contact sig@samtec.com for path length map.

Differential signal transmission

100 ps signal rise time (10-90%)

> 6 Gb/sec per pair

> 90 Gb/sec per bank

100 Ohms +/- 10%

<1.5%

<1.0%

Shortest path: 750 ps +/- 30 ps     

Longest path: 830 ps +/- 30 ps

500 MHz

-0.7 dB

1.0 GHz

-1.2 dB

1.5 GHz

-1.3 dB

2.0 GHz

-2.2 dB

2.5 GHz

-2.2 dB

3.0 GHz

-2.5 dB

3.5 GHz

-3.4 dB

Design Considerations

• Prints
• Catalog Pages
• Material Specifications
• Processing Guidelines
• Order Samples On-line
• Recommended PCB Footprints

Product Search

• By Frequency
• By Rise Time
• By Data Rate
• By Description
• By Series
• By Board Spacing

Samtec’s Signal
Integrity Services
Division provides
services at three
levels:

• Signal Integrity

Center (Internet
Design Tool)

• Signal Integrity

Group (EE support
and advice)

• Signal Integrity

Division (Custom
services integrating
Samtec’s SI team with
your team)

All three levels of
service are provided
within the following
boundaries:

Boundary 1 

Models of mated
connector components
(no PCB footprint 
or routing)

Boundary 2 

Models of mated
connector components
soldered to boards with
Samtec recommended
PCB footprint 

Boundary 3

Models of connector
components with Samtec
recommended “final inch”
PCB trace routing to the
connector

Boundary 4 

Design, modeling and
testing of your subsystem
including Samtec mated
connector components,
traces through PCBs,
cabling, other devices and
multiple connectors

Boundary 5 

Design, modeling and
testing of your full system
or subsystem including
the PCB and all passive
and active component

SIGNAL INTEGRITY CENTER

www.samtec.com/signal_integrity

A comprehensive, user friendly web site for high-speed
connector models, reports, drawings and searches

Integrated services for selection, development, simulation
and testing of high speed systems

For questions on applications that cannot be
obtained from the Signal Integrity Center,
Samtec’s Signal Integrity Group offers person-
to-person SI engineering support.

• EE customer interface

• In-house staff

• Interpret test data, performance results,

capabilities

• PCB layout, trace & routing assistance

• Connector ground pin assignment assistance

• Call 1-800-726-8329 or +812-944-6733 

extension 2330

• North American & Korean facilities

• E-mail: sig@samtec.com or

signalintegritygroup@samtec.com

SIGNAL INTEGRITY GROUP

Signal Integrity Engineering Support

For the ultimate in Signal Integrity Services, Samtec offers
design, modeling and testing of your circuits, subsystems or
complete system.

Confidently accelerate your product’s development by 
adding Samtec’s highly qualified engineers to your team. 
You choose the depth of involvement and the breadth of
services that make sense for your project, whether we enter:

• Early in the concept phase supporting your effort with

layout and component strategies

• Midway through the design phase supplying customized

simulation models to better optimize performance and 
enhance signal integrity, or

• During the project’s closing development stages of test

and verification, bringing our Signal Integrity expertise 
to bare once prototypes are in hand.

Specific electrical engineering services are tailored 
to your needs and products, so nothing is wasted,

SUDDEN SERVICE

Please contact a Samtec Signal Integrity
Engineer at 1-800-726-8329 or +812-944-6733
extension 2330 or via email at 

sig@samtec.com

or

signalintegritygroup@samtec.com

for 

more information.

especially valuable time. Simulation models will be 
available in Single-line, Single-pair and Multi-line
versions. Models can be supplied as:

• HSPICE (.sp)

• PSPICE (.cir)

• Cadence SPECCTRAQuest (.dml)

• Mentor ICX (.mmf)

• IBIS Interconnect Specification 

• S-Parameter (Touchstone)

• Others on request

Transmission-line or lumped element models can be
created to predict eye-patterns and other SI-related
effects. 

For customers requiring more advanced design services,
PCB design support will be available. Samtec’s support
ranges from recommending solder pad footprints to
laying out complete system circuits.

Test Reports

• High Speed characterization

• Time & Frequency Domain test data

• Mechanical test data

• Isolated mating connector sets and

connectors on optimized PCB layouts

SIGNAL INTEGRITY SERVICES

SIGNAL INTEGRITY SERVICES

DIVISION

INTEGRITY

SIGNAL

Simulations

• SPICE, IBIS models
• S-parameter data
• Isolated mating connector

sets and connectors on
optimized PCB layouts

CUSTOM SIGNAL INTEGRITY SERVICES

Application specific design, modeling & testing service

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

QTH

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-150)

Suggested Paste Thickness:

For most applications add
(0,05mm) .002" to max SMT
lead coplanarity

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QTH for
recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

OTHER

OPTION

SPECIFICATIONS

–030, –060, –090,

–120, –150

(60 total positions per bank)

–F

= Gold Flash on

Signal Pins and

Ground Plane

–L

= 10

µ

" (0,25

µ

m)

Gold on

Signal Pins and

Ground Plane

(20,00)

.7875

(No. of Positions/30) x (20,00) .7875

(0,20)

.008

(0,50)

.0197

01

02

(7,11)

.280

A

(0,76)

.030

(0,89)

.035

DIA

Mates with:

QSH

(7,62) 

.300

No. of Banks x  (20,00) .7875 – (1,52) .060

(0,64) .025

(2,54) .100

(1,02) 

.040

DIA

(0,31) 

.012

(5,27) .208

(1,19) 

.047

(4,70) .185

(6,35) 

.250

(20,00) .7875

(3,09) .122

(20,00) .7875

(16,89) .665

(14,50) .571

(1,45) 

.057

(1,05) .0415

(0,50) 

.0197

02

01

For complete specifications
see 

www.samtec.com?QTH

Insulator Material:

Liquid Crystal Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Contact: 1.25A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

Voltage Rating:

125 VAC mated with QSH &
5mm Stack Height

0,50

mm

  HI-SPEED  HEADER

QTH
SERIES

A

LEAD

STYLE

Specify

LEAD

STYLE

from

chart.

STACK HEIGHTS

–01
–02
–03

–09

–04
–05
–06
–07
–08

(5,03) .198

(8,03) .316

(11,03) .434

(14,03) .552

(16,00) .630

(19,00) .748

(22,00) .866

(25,00) .984

(30,00) 1,181

LEAD

STYLE

MATED HEIGHT

WITH QSH

LEAD

STYLE

A

(4,27)

.168

(7,26)

.286

(10,26)

.404

(15,24)

.600

(18,24)

.718

(21,23)

.836

(24,23)

.954

(29,23)

1,151

(13,27)

.523

–01

–02

–03

–04

–05

–06

–07

–08

–09

APPLICATION

SPECIFIC

30

µ

" (0,76

µ

m) Gold

and Guide Posts

available.

Call Samtec.

Edge Mount.
Contact Samtec Interconnect
Processing Group:
www.samtec.com/standard_
products/processing_information/ipg.asp

APPLICATION SPECIFIC

Rated

at 5%

Configuration

(5,03mm Stack)

Near End

Crosstalk

Prop.

Delay

For complete Test Report logon to www.samtec.com?QTH

Impedance Mismatch (

Ω

)

Rated

at 10%

~10%

@ 1.75 GHz

~1.1%

@ 1 GHz

~5.25%

@ 775 MHz

~0.8%

@ 585 MHz

42.8pS

42.8pS

775 MHz

585 MHz

1.75 GHz

1 GHz

50.0 to 48.9

@ 500pS

100.0 to 95.9

@ 750pS

50.0 to 48.1

@ 250pS

100.0 to 93.6

@ 500pS

50.0 to 43.5

@ 100pS

100.0 to 87.6

@ 250pS

50.0 to 49.1

@ 750pS

100.0 to 97.1

@ 1nS

Single Ended

Differential Pair

Single Ended

Differential Pair

Configuration

(5,03mm Stack)

–K

= (7,00mm) .275" DIA

Polyimide film Pick & Place

Pad

(Not available on

lead style – 05, –06,

– 07 and – 08)

–TR

= Tape & Reel

(–090 positions maximum)

Not available on lead style

– 05, – 06, – 07 and – 08

–TY

= Tray Packaging

Processing conditions will
affect mated height.

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-150)

Suggested Paste Thickness:

For most applications add
(0,05mm) .002" to max SMT
lead coplanarity

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QSH for
recommended PCB layout.

SPECIFICATIONS

(20,00)

.7875

(No. of Positions/30) x (20,00) .7875 + (1,27) .050

01

02

(7,49)

.295

(0,15)

.006

(0,50)

.0197

(3,25)

.128

(0,76) 

.030

(7,24)

.285

(0,89)

.035

DIA

(3,05)

.120

Mates with:

QTH

(0,43) .017

No. of Banks x  (20,00) .7875 +(0,13) .005

(0,81)

 .032

(2,54) .100

(1,02) 

.040 

DIA

(4,89) .193

(4,70) .185

(6,35) .250

(20,00) .7875

(20,00) .7875

(14,50) .571

(16,13) .635

(8,00) 

.315

(2,86) 

.113

(2,29) 

.090

(0,20) 

.008

(0,50) .0197

01

02

(0,28) .011

For complete specifications
see www.samtec.com?QSH

Insulator Material:

Liquid Crystal Polymer

Contact Material:

Phosphor Bronze

Current Rating:

Contacts: 1.25A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

Voltage Rating:

125 VAC mated with QTH &
5mm Stack Height

0,50

mm

  HI-SPEED  SOCKET

QSH
SERIES

QSH

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

OTHER

OPTION

–030, –060, –090,

–120, –150

(60 total positions per bank)

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

01

A

–K

= (8,25mm) .325" DIA

Polyimide Film Pick

& Place Pad

–TR

= Tape & Reel

(–090 positions maximum)

–TY

= Tray Packaging

STACK HEIGHTS

–01
–02
–03

–09

–04
–05
–06
–07
–08

(5,03) .198

(8,03) .316

(11,03) .434

(14,03) .552

(16,00) .630

(19,00) .748

(22,00) .866

(25,00) .984

(30,00) 1,181

LEAD

STYLE

MATED HEIGHT

WITH QTH

Edge Mount.
Contact Samtec
Interconnect Processing
Group: www.samtec.com/standard_
products/processing_information/ipg.asp

APPLICATION SPECIFIC

APPLICATION

SPECIFIC

30

µ

" (0,76

µ

m) Gold

and Guide Posts available.

Call Samtec.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

Rated

at 5%

Configuration

(5,03mm Stack)

Near End

Crosstalk

Prop.

Delay

For complete Test Report logon to www.samtec.com?QSH

Impedance Mismatch (

Ω

)

Rated

at 10%

~10%

@ 1.75 GHz

~1.1%

@ 1 GHz

~5.25%

@ 775 MHz

~0.8%

@ 585 MHz

42.8pS

42.8pS

775 MHz

585 MHz

1.75 GHz

1 GHz

50.0 to 48.9

@ 500pS

100.0 to 95.9

@ 750pS

50.0 to 48.1

@ 250pS

100.0 to 93.6

@ 500pS

50.0 to 43.5

@ 100pS

100.0 to 87.6

@ 250pS

50.0 to 49.1

@ 750pS

100.0 to 97.1

@ 1nS

Single Ended

Differential Pair

Single Ended

Differential Pair

Configuration

(5,03mm Stack)

Processing conditions will
affect mated height.

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

(20,00)

.7875

(No. of Positions/20) x (20,00) .7875

(0,20)

.008

(0,50)

.0197

01

02

(7,11)

.280

(1,50)

.0591

(5,97)

.235

(0,76)

.030

(4,27)

.168

(0,89)

.035

DIA

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080-100)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QTH-DP
for recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

Mates with:

QSH (-DP)

(7,62) .300

No. of Banks x  (20,00) .7875 – (1,52) .060

(0,64) 

.025

(2,54) .100

(1,02) 

.040

DIA

(2,49) 

.098

(0,31) 

.012

(5,27) .208

(1,19) 

.047

(4,70) .185

(6,35) 

.250

(20,00) .7875

(3,09) .122

(1,98) 

.078

(20,00) .7875

(16,89) .665

(1,45) 

.057

(1,05) .0415

(0,50) 

.0197

02

01

For complete specifications
see www.samtec.com?QTH-DP

Insulator Material:

Liquid Crystal Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Contacts: 1.25A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

Voltage Rating:

125 VAC mated with QSH-DP
& 5mm Stack Height

0,50

mm

  DIFFERENTIAL  PAIR

QTH (-DP)
SERIES

QTH

NO. OF PAIRS

D

PLATING

OPTION

OTHER

OPTION

–020, –040, –060,

–080, –100

(20 pairs per bank)

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

A

–K

= (7,00mm) .275" DIA

Polyimide Film

Pick & Place Pad

–TR

= Tape & Reel

(–060 positions maximum)

–TY

= Tray Packaging

DP

01

STACK HEIGHT

–01

(5,03) .198

LEAD

STYLE

STANDARD

MATED HEIGHT

APPLICATION SPECIFIC OPTION

• 30

µ

" (0,76

µ

m) Gold

• 8,03mm, 11,03mm, 14,03mm, 16mm, 19mm, 22mm,

25mm and 30mm stack height.

• Edge Mount

(Contact Samtec Interconnect Processing Group)

• Guide Posts

“Partitionable” -
combine differential
& single-ended
banks in same
connector. Call Samtec
ASP Group.

Single
Ended

Differential

APPLICATION SPECIFIC

Rated

at 5%

Configuration

5,03mm

Stack

Height

Near End

Crosstalk

Prop.

Delay

For complete Test Report logon to www.samtec.com?QTH-DP

Impedance Mismatch (

Ω

)

Rated

at 10%

1.08%

@ 1.40 GHz

0.62%

@ 700 MHz

39.0pS

700 MHz

1.33 GHz

100.0 to 89.4

@ 250pS

100.0 to 78.9

@ 100pS

100.0 to 74.4

@ 50pS

100.0 to 95.0

@ 500pS

Processing conditions will
affect mated height.

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

(20,00)

.7875

(No. of Positions/20) x (20,00) .7875 + (1,27) .050

01

02

(7,49)

.295

(0,15)

.006

(0,50)

.0197

(1,50)

.0591

(7,24)

.285

(3,25)

.128

(0,76) 

.030

(0,89)

.035

DIA

(3,05)

.120

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080-100)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QSH-DP
for recommended PCB layout.

SPECIFICATIONS

Mates with:

QTH (-DP)

(0,43) .017

No. of Banks x  (20,00) .7875 +(0,13) .005

(0,81)

 .032

(2,54) .100

(1,02) 

.040 

DIA

(4,89) .193

(4,70) .185

(6,35) .250

(20,00) .7875

(20,00) .7875

(8,00) 

.315

(3,30) 

.130

(2,86) 

.113

(16,13) .635

(2,29) 

.090

(0,20) 

.008

(2,82) 

.111

(0,50) 

.0197

01

02

(0,28) .011

For complete specifications
see www.samtec.com?QSH-DP

Insulator Material:

Liquid Crystal Polymer

Contact Material:

Phosphor Bronze

Current Rating:

Contacts: 1.25A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

Voltage Rating:

125 VAC mated with QTH-DP
& 5mm Stack Height

0,50

mm

  DIFFERENTIAL  PAIR

QSH (-DP)
SERIES

QSH

NO. OF PAIRS

D

PLATING

OPTION

OTHER

OPTION

–020, –040, –060,

–080, –100

(20 pairs per bank)

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

01

A

–K

= (8,25mm) .325" DIA

Polyimide Film

Pick & Place Pad

–TR

= Tape & Reel

(–060 positions maximum)

–TY

= Tray Packaging

DP

STACK

HEIGHT

–01

(5,03)

.198

LEAD

STYLE

MATED

HEIGHT

“Partitionable” -
combine differential
& single-ended banks
in same connector
Call Samtec.
ASP Group.

Single
Ended

Differential

APPLICATION SPECIFIC

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

APPLICATION SPECIFIC OPTION

• 30

µ

" (0,76

µ

m) Gold

• 8,03mm, 11,03mm, 14,03mm, 16mm, 19mm, 22mm,

25mm and 30mm stack height.

• Edge Mount

(Contact Samtec Interconnect Processing Group)

• Guide Posts

Rated

at 5%

Configuration

5,03mm

Stack

Height

Near End

Crosstalk

Prop.

Delay

For complete Test Report logon to www.samtec.com?QSH-DP

Impedance Mismatch (

Ω

)

Rated

at 10%

1.08%

@ 1.40 GHz

0.62%

@ 700 MHz

39.0pS

700 MHz

1.33 GHz

100.0 to 89.4

@ 250pS

100.0 to 78.9

@ 100pS

100.0 to 74.4

@ 50pS

100.0 to 95.0

@ 500pS

Processing conditions
will affect mated height.

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

QTS

NO. OF POSITIONS

PER ROW

A

PLATING

OPTION

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (025-075)
(0,15mm) .006" max (100-125)

Suggested Paste
Thickness:

For most applications add
(0,05mm) .002" to max SMT
lead coplanarity

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QTS
for recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

–K

= (7,00mm)

.275" DIA

Polyimide

film

Pick &

Place Pad

–TR

= Tape &

Reel

(–075

positions

maximum)

–TY

= Tray

Packaging

OTHER

OPTION

SPECIFICATIONS

–025, –050, –075,

–100, –125

(50 total positions per bank)

–F

= Gold Flash on Signal Pins and

Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

(20,00)

.7875

(No. of Positions/25) x (20,00) .7875

(0,20)

.008

(0,635)

.025

01

02

(7,11)

.280

(0,76)

.030

(5,97)

.235

(0,89)

.035

DIA

A

Mates with:

QSS

0,635

mm

  HI-SPEED  HEADER

QTS
SERIES

(0,64) .025

(7,62) 

.300

No. 

of 

Banks 

x  

(20,00) 

.7875 

-(1,52) 

.060

(2,54) .100

(1,02) 

.040

DIA

(0,46) 

.018

(6,35) 

.250

(0,83) 

.0325

(16,89) 

.665

(20,00) 

.7875

(4,70) .185

(1,45) 

.057

02

01

(1,05) 

.0415

(0,635) 

.025

BODY

STYLE

Specify

LEAD

STYLE

from

chart.

For complete specifications
see www.samtec.com?QTS

Insulator Material:

Liquid Crystal
Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Contacts: 1.6A @ 80

°

C

Ground Plane: 7.9A @ 80

°

C

Operating Temp:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

LEAD

STYLE

A

(4,27)

.168

(7,26)

.286

(10,26)

.404

(15,24)

.600

–01

–02

–03

–04

STACK HEIGHTS

–01
–02
–03
–04

(5,03) .198

(8,03) .316

(11,03) .434

(16,00) .630

LEAD

STYLE

MATED HEIGHT

WITH QSS

Differential Pair
and “Partitionable”
(combine differential
& single-ended
banks in same
connector) available.
Call Samtec ASP
Group.

Single
Ended

Differential

APPLICATION

SPECIFIC OPTION

D

APPLICATION

SPECIFIC OPTION

30

µ

" (0,76

µ

m) Gold.

Call Samtec.

Processing conditions will
affect mated height.

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (025-075)
(0,15mm) .006" max (100-125)

Suggested Paste
Thickness:

For most applications add
(0,05mm) .002" to max SMT
lead coplanarity

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QSS
for recommended PCB layout.

Note:

 Some lengths,

styles and options
are non-standard,
non-returnable.

SPECIFICATIONS

Mates with:

QTS

For complete specifications
see www.samtec.com?QSS

Insulator Material:

Liquid Crystal Polymer

Contact Material:

Phosphor Bronze

Current Rating:

Contacts: 1.6A @ 80

°

C

Ground Plane: 7.9A @ 80

°

C

Operating Temp:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

0,635

mm

  HI-SPEED  SOCKET

QSS
SERIES

QSS

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

–025, –050, –075,

–100, –125

(50 total positions per bank)

–F

= Gold Flash on Signal Pins and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

OTHER

OPTION

A

–GP

= Guide

Holes

–K

= (8,25mm)

.325" DIA

Polyimide

Film Pick &

Place Pad

–TR

= Tape

and Reel

(–075

positions

maximum)

–TY

= Tray

Packaging

01

APPLICATION

SPECIFIC OPTION

30

µ

" (0,76

µ

m) Gold.

Call Samtec.

Differential Pair
and “Partitionable”
(combine differential
& single-ended
banks in same
connector) available.

Call Samtec ASP
Group.

–GP OPTION

Single
Ended

Differential

APPLICATION

SPECIFIC OPTION

(2,29) 

.090

01

02

(0,21) 

.0082

(0,43) .017

(8,00) 

.315

No. 

of 

Banks 

x  

(20,00) 

.7875

(2,79) .110

(4,90) .193

(1,02) 

.040

DIA

(0,41) 

.016

(6,35) .250

(0,45) .0175

(15,24) .600

(20,00) .7875

(4,70) .185

(0,635) 

.025

01

02

(No. of Positions/25) x (25,00) .7875 + (10,90) .429

(No. of Positions/25) x (25,00) .7875 + (5,72) .225

(3,56).140 DIA

(20,00)

.7875

(No. of Positions/25) x (20,00) .7875 + (1,27) .050

01

02

(7,49)

.295

(0,15)

.006

(0,635)

.025

(3,63)

.143

(7,24)

.285

(0,89)

.035

DIA

TM

PERPENDICULAR

APPLICATIONS

QTS

(-RA)

QSS

(-GP)

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (026-078)
(0,15mm) .006" max (104)
lead coplanarity

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QMSS
for recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

Mates with:

QFSS

0,635

mm

  SHIELDED  HEADER

QMSS
SERIES

For complete specifications
see www.samtec.com?QMSS

Insulator Material:

Liquid Crystal
Polymer

Terminal, Ground
Plane & Shield Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

(Tin on Ground Plane Tail)

(0,23)

.009

01

02

(7,26)

.286

(No. of Banks) x (21,34) .840 - (0,51) .020 

(0,635)

.025

(21,35) .840

(2,29) .090

(6,35)

.250

(6,35)

.250

(7,52)

.296

(0,25)

.010

(1,02)

.040

DIA

(0,89)

.035

DIA

(3,18)

.125

(6,73)

.265

01

02

(0,51) .020

(1,91) 

.075

(21,34) .840

(8,13) 

.320

(1,40) .055

(17,27) 

.680

No. of Banks x (21,34) .840 - (2,67) .105

No. of Pins /26 x (21,34) .840 - (5,46) .215

–A = 

(1,09 -0,00

          +0,08) 

.043 -.000

        +.003

DIA (2)

(0,635) .025

(0,41) 

.016

 (16,13) 

.625

QMSS

NO. OF PINS

PER ROW

PLATING

OPTION

OPTION

–026, –052,  –078, –104

(52 total pins per bank)

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins,

Shield and Ground Plane

–H

= 30

µ

" (0,76

µ

m) Gold on Signal Pins,

10

µ

" (0,25

µ

m) Gold on Shield and

Ground Plane

(Gold flash on Signal Pin tails,

Tin on Ground Plane tails)

D

–GP

= Guide Post

–K

= (5,50mm)

.217" DIA

Polyimide

film

Pick &

Place Pad

11

A

APPLICATION

SPECIFIC

OPTION

Headers without

Alignment Pins.

Call Samtec.

APPLICATION

QFSS

QMSS

(11,00)

.433

TM

MICRO

RUGGED

TM

DIVISION

INTEGRITY

SIGNAL

Contact Samtec
Signal Integrity Group
for test data

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (026-078)
(0,15mm) .006" max (104)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QFSS for
recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

Mates with:

QMSS

For complete specifications
see www.samtec.com?QFSS

Insulator Material:

Liquid Crystal
Polymer

Contact, Ground
Plane & Shield Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

(Tin on Ground Plane tails)

QFSS

NO. OF PINS

PER ROW

PLATING

OPTION

–026, –052, –078, –104

(52 total pins per bank)

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins,

Shield and Ground Plane

–H

= 30

µ

" (0,76

µ

m) Gold on Signal Pins,

10

µ

" (0,25

µ

m) Gold on Shield

and Ground Plane

(Gold flash on Signal Pin tails,

Tin on Ground Plane tails)

D

01

0,635

mm

  SHIELDED  SOCKET

QFSS
SERIES

(21,34) .840

(2,10) 

.083

(No. of Banks x (21,34) .840 + (1,02) .040 

(0,23)

.009

02

01

(0,635)

.025

(8,13)

.320

(7,06)

.278

(3,35) .132 DIA

(7,44)

.293

(8,13)

.320

(1,02)

.040

DIA

(0,89)

.035

DIA

(3,33)

.131

(0,10)

.004

(No. of Banks) x (21,34) .840 + (5,33) .210 

(No. of Banks) x (21,34) .840 + (12,45) .490 

02

01

(0,51) .020

(2,03) 

.080

(0,41) 

.016

(0,635) .025

(21,34) .840

(8,64) 

.340

(2,16) .085

(18,03) 

.710

 (16,13) 

.625

No. of Banks x (21,34) .840 - (0,76) .030

No. of Banks x (21,34) .840 - (5,46) .215

(1,09 -0,00

          +0,08) 

.043 -.000

        +.003

DIA (2)

TM

A

MICRO

RUGGED

TM

APPLICATION

SPECIFIC

OPTION

Headers without

Alignment Pins.

Call Samtec.

APPLICATION

QFSS

QMSS

(11,00)

.433

OTHER

OPTION

–GP

= Guide

Holes

–GP OPTION

DIVISION

INTEGRITY

SIGNAL

Contact Samtec
Signal Integrity Group
for test data

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

QMSS

NO. OF PINS

PER ROW

PLATING

OPTION

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (026-078)
(0,15mm) .006" max (104)

lead coplanarity

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QMSS-EM
for recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

–026, –052, –078, –104

(52 total pins per bank)

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins,

Shield and Ground Plane

–H

= 30

µ

" (0,76

µ

m) Gold on Signal Pins,

10

µ

" (0,25

µ

m) Gold on Shield and Ground Plane

Mates with:

QFSS

0,635

mm

  SHIELDED  HEADER

QMSS (-EM)
SERIES

For complete specifications see
www.samtec.com?QMSS-EM

Insulator Material:

Liquid Crystal
Polymer

Terminal, Ground
Plane & Shield Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

(Tin on Ground Plane Tails)

D

(No. of Banks) x (21,34) .840 + (5,33) .210

(0,23)

.009

(7,26)

.286

(No. of Banks) x (21,34) .840 + (12,45) .490

(0,635)

.025

(6,10)

.240

(21,34)

.840

(4,32)

.170

01

02

(6,73)

.265

(5,59)

.220

01

EM2

(0,64)

.025

(0,36)

.014

(1,52) 

.060

(1,78)

.070

(1,38)

.015

(1,40)

.055

(1,52)

.060

(0,95) 

.0375

(18,80)

.740

(1,97) 

.0775

(1,07) 

.042

(5,27) 

.208

(1,40).055

(3,24) .128

(15,88)

.625

Contact Samtec
Signal Integrity Group
for test data

TM

MICRO

RUGGED

TM

DIVISION

INTEGRITY

SIGNAL

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

SPECIFICATIONS

Mates with:

QSS

(4,27)

.168

(4,06)

.160

(4,45)

.175

(1,02) .040

(20,00) .7875

No. of Banks x (20,00) .7875 + (9,91) .390

(0,20) .008

(0,635) .025

(5,97)

.235

(1,70)

.067

QTS

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

–025, –050, –075,

–100, –125

(50 total positions per bank)

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

01

CARD

SLOT

For complete specifications
see www.samtec.com?QTS-EM
or www.samtec.com?QSS-EM

Insulator Material:

Liquid Crystal
Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp Range:

-65

°

C to +125

°

C

Max Processing Temp:

230

°

C for 60 seconds

Plating:

 Au over 50

µ

"

(1,27

µ

m) Ni

0,635

mm

  EDGE  MOUNT

QTS (-EM),
QSS (-EM) SERIES

–EM2

= (1,60mm)

.062" Card

(3,43)

.135

(1,68)

.066

(3,63) .143

(4,45)

.175

(1,02)

.040

(20,00) .7875

No. of Banks x (20,00) .7875 + (11,18) .440

01

02

(7,24)

.285

(0,15)

.006

(0,635)

.025

QSS

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

–025, –050, –075, –125

(50 total positions per bank)

–L

= 10

µ

" (0,25

µ

m) Gold

–F

= Gold Flash

–H

= 30

µ

" (0,76

µ

m) Gold

01

CARD

SLOT

Mates with:

QTS

–EM2

= (1,60mm)

.062" Card

Differential Pair
and “Partitionable”
(combine differential &
single-ended banks in same
connector) available.

Call Samtec ASP Group.

Single Ended

Differential

APPLICATION

SPECIFIC OPTION

APPLICATION

SPECIFIC OPTION

30

µ

" (0,76

µ

m) Gold

and Tray Packaging.

Call Samtec.

Processing:

Please contact Samtec
Interconnect Processing
Group at www.samtec.com/
standard_products/processing
_information/ipg.asp

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

TM

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

QTS

NO. OF POSITIONS

PER ROW

PLATING

OPTION

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (025-075)
(0,15mm) .006" max (100)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QTS-RA
for recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

–025, –050, –075, –100

(50 total positions per bank)

–F

= Gold Flash on Signal Pins and

Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins

and Ground Plane

(Gold flash on Signal Pin tails,

Tin on Ground Plane tails)

Mates with:

QSS (-GP),
QSS (-RA)

0,635

mm

  HI-SPEED  HEADER

QTS (–RA)
SERIES

For complete specifications
see www.samtec.com?QTS-RA

Insulator Material:

Liquid Crystal
Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp Range:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

D

01

RA

APPLICATION

SPECIFIC OPTION

30

µ

" (0,76

µ

m) Gold

and Tray Packaging

Call Samtec.

No. 

of 

Banks 

x  

(20,00) 

.7875

+

(8.38)

.330

(0,41) 

.016

(2,03) 

.080

(1,40) 

.055

(2,01) 

.079

(optional)

(5,08) 

.020

(1,778) 

.070

(20,00) 

.7875

(3,17) 

.125

DIA (2)

NPTH

(0,61) 

.024

DIA

PTH

(1,02) 

.040

DIA

PTH

(3,35) 

.132

(2,45) 

.097

(4,610) 

.1815

(0,635) 

.025

(No. of Positions/25) x (20,00) .7875 + (8,38) .330

(3,18)

.125 DIA

(6,35)

.250 DIA

(No. of Positions/25) x (20,00) .7875 + (14,73) .580

(No. of Positions/25) x 

(20,00) .7875 + (5,72) .225

(0,20).008

(3,18)

.125 DIA

(0,635)

 .025 SQ

(0,635)

 .025

(0,30)

 .012

(0,38).015

(2,03).080

(1,50)

.059

(9,42)

.371

(5,97)

.235

(7,11)

.280

(10,29)

.405

(3,05)

.120

(1,73)

.068

(0,10)

.004

(5,08)

.200

–WT

= Weld Tab

(Not

available on

25 positions)

Differential Pair
and “Partitionable”
(combine differential &
single-ended banks in same
connector) available.

Call Samtec ASP Group.

Single Ended

Differential

APPLICATION

SPECIFIC OPTION

OTHER

OPTION

PERPENDICULAR

HORIZONTAL

APPLICATIONS

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (025-075)
(0,15mm) .006" max (100)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QSS-RA.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

Mates with:

QTS (-RA)

For complete specifications
see www.samtec.com?QSS-RA

Insulator Material:

Liquid Crystal
Polymer

Contact Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

0,635

mm

  HI-SPEED  SOCKET

QSS(-RA)
SERIES

QSS

NO. OF POSITIONS

PER ROW

PLATING

OPTION

–025, –050, –075, –100

(50 total positions per bank)

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

(Gold flash on Signal Pin tails,

Tin on Ground Plane tails)

D

01

RA

(0,635)

 .025 SQ

(2,03)

 .080

(6,35)

.250 DIA

(3,56)

.140 

DIA

(No. of Positions/25) x (20,00) .7875 + (13,97) .550

(No. of Positions/25) x (20,00) .7875 + (7,62) .300

(No. of Positions/25) x 

(20,00) .7875 + (5,72) .225

(0,25)

 .010

(3,18)

.125 DIA

(0,30).012

(1,50)

.059

(8,33)

.328 (4,71)

.186

(6.22)

.245

(11,05)

.435

(14,22)

.560

(1,47)

.058

(7,11)

.280

(6,35)

.259
TYP

No. 

of 

Positions

x  

(20,00) 

.7875

+

(7,62)

.300

(0,41) 

.016

(2,03) 

.080

(1,27) 

.050

(5,08) 

.020

(20,00) 

.7875

(3,17) 

.125

DIA (2)

NPTH

(0,21) 

.053

DIA

PTH

(3,75) 

.148

(1,73) 

.068

(3,81) 

.150

(1,02) 

.040

DIA

PTH

(0,635) 

.025

(1,52) 

.060

APPLICATION

SPECIFIC OPTION

30

µ

" (0,76

µ

m) Gold

and Tray Packaging.

Call Samtec.

TM

HORIZONTAL

APPLICATIONS

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

MIT

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

LEAD

STYLE

Specify

LEAD

STYLE

from

chart

below.

(12,70)

.500

(No. of Positions/19) x (12,70) .500 + (11,43) .450

(0,20)

.008

(0,64)

.025

(0,58).023

A

(5,97)

.235

(7,11)

.280

(0,38) 

.015

(1,40)

.055

01

02

SPECIFICATIONS

–019, –038, –057,

–076, –095, –114, –133

(38 total positions per bank)

0,635

mm

  HI-SPEED  HEADER

MIT
SERIES

(1,27) 

.050

(0.81) 

.032

DIA

THRU

(1,07) 

.042

DIA

RING

(0,43) 

.017

(6,35) 

.250

(0,64) 

.025

(0,64) 

.025

(1,27) 

.050

(2,54) 

.100

(2,39) 

.094

DIA

(8,33) 

.328

02

01

Mates with:

MIS

OTHER

OPTION

STACK HEIGHTS

–01
–02
–03
–04
–05
–06

(5,00) .197

(8,00) .315

(11,00) .433

(16,00) .630

(18,75) .738

(22,00) .866

LEAD

STYLE

MATED HEIGHT

WITH MIS

LEAD

STYLE

A

(4,27)

.168

(7,26)

.286

(10,26)

.404

(15,24)

.600

(17,98)

.708

(21,21)

.835

–01

–02

–03

–04

–05

–06

Differential
Pair and
“Partitionable”
(combine
differential &
single-ended
banks in same
connector)
available.
Call Samtec ASP Group.

Single
Ended

Differential

APPLICATION

SPECIFIC OPTION

APPLICATION SPECIFIC

30

µ

" (0,76

µ

m) Gold.

Call Samtec

SIGNAL INTEGRITY REPORT

htpp://www.samtec.com/ftppub/testrpt/mitmisel.pdf

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (019-076)
(0,15mm) .006" max (095-133)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?MIT for
recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

For complete specifications
see www.samtec.com?MIT

Insulator Material:

Liquid Crystal
Polymer

Contact Material:

Phospher Bronze

Current Rating:

Contacts: 1.6A @ 80

°

C

Ground Plane: 8.7A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

Processing conditions will
affect mated height.

–K

= (7,00mm) .275" DIA

Polyimide film

Pick & Place Pad

–TR

= Tape & Reel

(–076 positions

maximum)

Not available on lead

styles –05 & –06

–TY

= Tray Packaging

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

SPECIFICATIONS

Mates with:

MIT

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (019-076)
(0,15mm) .006" max (095-133)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?MIS for
recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

MIS

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

–F

= Gold Flash on

Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m)

Gold on Signal Pins

and Ground Plane

01

–019, –038, –057, –076,

–095, –114, –133

(38 total positions per bank)

OTHER

OPTION

–K

= (8,25mm)

.325" DIA

Polyimide

film

Pick &

Place Pad

–TR

= Tape & Reel

(–076

positions

maximum)

–TY

= Tray

Packaging

For complete specifications
see www.samtec.com?MIS

Insulator Material:

Liquid Crystal
Polymer

Contact Material:

Phospher Bronze

Current Rating:

Contacts: 1.6A @ 80

°

C

Ground Plane: 8.7A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

MIS
S E R I E S

Differential
Pair and
“Partitionable”
(combine
differential &
single-ended
banks in same
connector)
available.
Call Samtec ASP Group.

Single
Ended

Differential

APPLICATION

SPECIFIC OPTION

APPLICATION SPECIFIC

30

µ

" (0,76

µ

m) Gold.

Call Samtec

SIGNAL INTEGRITY REPORT

htpp://www.samtec.com/ftppub/testrpt/mitmisel.pdf

0,635

mm

  HI-SPEED  SOCKET

STACK HEIGHTS

–01
–02
–03
–04
–05
–06

(5,00) .197

(8,00) .315

(11,00) .433

(16,00) .630

(18,75) .738

(22,00) .866

LEAD

STYLE

MATED HEIGHT

WITH MIT

Processing conditions will
affect mated height.

(1,27) 

.050

(0.81) 

.032

DIA

THRU

(1,07) 

.042

DIA

RING

(0,43) 

.017

(6,35) 

.250

(0,64) 

.025

(0,64) 

.025

(1,27) 

.050

(2,54) 

.100

(2,39) 

.094

DIA

(8,33) 

.328

02

01

(12,70) .500

(No. of Positions/19) x (12,70) .500 + (12,70) .500

(7,24)

.285

(0,64)

.025

(0,15)

.006

(3,63) 

.143

(7,49)

.295

(0,18)

.007

(0,69)

.027

(1,40)

.055

02

01

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

TM

QTE

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080-100)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QTE
for recommended PCB layout.

Note:

 Some lengths, styles

and options are non-standard,
non-returnable.

OTHER

OPTION

SPECIFICATIONS

i

–020, –040, –060,

–080, –100

(40 total positions per bank)

–F

= Gold Flash

on Signal

Pins and

Ground Plane

–L

= 10

µ

"

(0,25

µ

m)

Gold on

Signal Pins

and Ground

Plane

LEAD

STYLE

Specify

LEAD

STYLE

from

chart.

(0,20)

.008

(0,80)

.0315

02

02

01

01

(20,00)

.7875

(No. of Positions/20) x (20,00) .7875

(7,11)

.280

(5,97)

.235

A

A

(3,18)

.125

DIA

(7,62)

.300

(9,22)

.363

(No. of Positions/20) x (20,00) .7875 + (5,72) .225

(No. of Positions/20) x (20,00) .7875 + (13,15) .5175

(0,76) 

.030

(0,89)

.035

DIA

Mates with:

QSE

0,80

mm

  HI-SPEED  HEADER

QTE SERIES

Styles –01, –02, –03

Styles –04, –05, –06, –07, –08

(0,64) 

.025

No. of Banks x  (20,00) .7875 –(1,52) .060

(2,54) 

.100

 (1,02) 

.040 

DIA

(0,46) 

.018

(5,27) 

.208

(6,35) 

.250

(4,70) .185

(20,00) .7875

(1,05) 

.042

(6,17) .243

(20,00) .7875

(16,89) .665

(0,84) .033

(1,64) .065

(1,45) 

.057

02

01

(0,80) 

.0315

For complete specifications
see www.samtec.com?QTE

Insulator Material:

Liquid Crystal
Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Contacts: 2A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Voltage Rating:

225 VAC mated with QSE
& 5mm Stack Height

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

–GP OPTION

A

APPLICATION

SPECIFIC

OPTION

30

µ

" (0,76

µ

m) Gold

and –GP–TY.

Call Samtec.

–GP

= Guide Posts

(Style –01 only)

–K

= (7,00mm) .275" DIA Polyimide

Film Pick & Place Pad

–TR

= Tape & Reel Packaging

(–060 positions maximum; –040

positions maximum with –GP)

Styles –05, –06, –07, –08

not available

–TY

= Tray Packaging

(Style –GP not available)

Rated

at 5%

Configuration

(5,03mm Stack)

Near End

Crosstalk

Prop.

Delay

For complete Test Reports logon to www.samtec.com?QTE

Impedance Mismatch (

Ω

)

Rated

at 10%

~9%

@ 2.33 GHz

~4.25%

@ 5.00 GHz

~5%

@ 1.20 GHz

~3%

@ 2.33 GHz

35.0pS

35.0pS

1.2GHz

2.33GHz

2.33 GHz

5.00 GHz

52.9 to 50.0

@ 250pS

101.6 to 96.4

@ 250pS

56.2 to 50.0

@ 100pS

102.3 to 92.2

@ 100pS

64.0 to 50.0

@ 50pS

104.5 to 87.1

@ 50pS

51.6 to 50.0

@ 500pS

101.6 to 98.7

@ 500pS

Single Ended

Differential Pair

Single Ended

Differential Pair

Configuration

(5,03mm Stack)

Rated

at 5%

11,03mm

Stack

Rated

at 10%

350 MHz

875 MHz

440 MHz

2.30 GHz

Single

Ended

Differential

Pair

Rated

at 5%

22mm

Stack

Rated

at 10%

220 MHz

<350 MHz

460 MHz

350 MHz

Single

Ended

Differential

Pair

LEAD

STYLE

A

(4,27) .168

(7,26).286

(10,26) .404

(15,34) .604

(18,33) .722

(21,33) .840

(24,23) .954

(29,23) 1.151

–01
–02
–03
–04
–05
–06
–07
–08

HEIGHT

WITH QSE

(5,03) .198

(8,03) .316

(11,03) .434

(16,00) .630

(19,00) .748

(22,00) .866

(25,00) .984

(30,00) 1.181

Processing conditions will affect
mated height.

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

TM

QSE

01

NUMBER OF

POSITIONS PER ROW

D

PLATING

OPTION

OTHER

OPTION

–F

= Gold Flash on Signal Pins and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins

and Ground Plane

Mates with:

QTE

–020, –040, –060,

–080, –100

(40 total positions per bank)

QSE SERIES

(20,00) .7875

(No. of Positions/20) x (20,00) .7875 + (1,27) .050

01

02

(7,49)

.295

(0,15)

.006

(0,80)

.0315

(3,25)

.128

(3,05)

.120

(0,76) 

.030

(7,24)

.285

(0,89)

.035

DIA

01

(No. of Positions/20) x (20,00) .7875 + (10,85) .429

(No. of Positions/20) x (20,00) .7875 + (5,72) .225

02

(3,81).150 DIA

SPECIFICATIONS

0,80

mm

  HI-SPEED  SOCKET

–GP OPTION

A

–GP

= Guide Holes

–K

= (8,25mm) .325"

DIA Polyimide

Film Pick &

Place Pad

–TR

= Tape & Reel

Packaging

(–060 positions

maximum;

–040 positions

maximum
with –GP)

–TY

= Tray Packaging

(Style –GP not

available)

For complete specifications
see www.samtec.com?QSE

Insulator Material:

Liquid Crystal
Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Contacts: 2A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Voltage Rating:

225 VAC mated with QTE
& 5mm Stack Height

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm).004" max (020-040)
(0,15mm).006" max (060-100)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QSE for
recommended PCB layout.

Note:

 Some lengths, styles

and options are non-standard,
non-returnable.

(0,43) 

.017

No. of Banks x  (20,00) .7875 + (0,13) .005

(2,79) 

.110

(0,41) .016

(4,89) .193

(6,35) .250

(4,70) .185

(20,00) .7875

(2,87) 

.113

(0,19)
.0078

(5,74) 

.226

(20,00) .7875

(16,13) .635

(2,27) 

.0895

01

02

(0,80) .0315

(1,02) 

.040

DIA

(2,46)

 .097

(0,46) .018

APPLICATION

SPECIFIC

OPTION

30

µ

" (0,76

µ

m) Gold

and –GP–TY.

Call Samtec.

Rated

at 5%

Configuration

(5,03mm Stack)

Near End

Crosstalk

Prop.

Delay

For complete Test Reports logon to www.samtec.com?QSE

Impedance Mismatch (

Ω

)

Rated

at 10%

~9%

@ 2.33 GHz

~4.25%

@ 5.00 GHz

~5%

@ 1.20 GHz

~3%

@ 2.33 GHz

35.0pS

35.0pS

1.2GHz

2.33GHz

2.33 GHz

5.00 GHz

52.9 to 50.0

@ 250pS

101.6 to 96.4

@ 250pS

56.2 to 50.0

@ 100pS

102.3 to 92.2

@ 100pS

64.0 to 50.0

@ 50pS

104.5 to 87.1

@ 50pS

51.6 to 50.0

@ 500pS

101.6 to 98.7

@ 500pS

Single Ended

Differential Pair

Single Ended

Differential Pair

Configuration

(5,03mm Stack)

Rated

at 5%

11,03mm

Stack

Rated

at 10%

350 MHz

875 MHz

440 MHz

2.30 GHz

Single

Ended

Differential

Pair

Rated

at 5%

22mm

Stack

Rated

at 10%

220 MHz

<350 MHz

460 MHz

350 MHz

Single

Ended

Differential

Pair

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

TM

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm).004" max (014-042)
(0,15mm).006" max (056-070)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QTE-DP
for recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

Mates with:

QSE (-DP)

0,80

mm

  DIFFERENTIAL  PAIRS

QTE (-DP)
SERIES

(0,64) 

.025

No. of Banks x  (20,00) .7875 –(1,52) .060

(2,54) 

.100

(1,02) 

.040 

DIA

(0,46) 

.018

(5,27) 

.208

(6,35) 

.250

(4,70) .185

(20,00) .7875

(6,17) 

.243

(0,37) 

.0415

(20,00) .7875

(16,89) .665

(0,84) .033

(1,64) .065

(1,64) .065

(1,45) 

.057

02

01

(0,80) 

.0315

For complete specifications
see www.samtec.com?QTE-DP

Insulator Material:

Liquid Crystal
Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Contacts: 2A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Voltage Rating:

225 VAC mated with QSE(-DP)
& 5mm Stack Height

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

QTE

NO. OF

PAIRS

D

PLATING

OPTION

OTHER

OPTION

–014, –028, –042,

–056, –070

(14 pairs per bank)

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on

Signal Pins and Ground Plane

–K

= (7,00mm) .276" DIA

Polyimide Film

Pick & Place Pad

–TR

= Tape & Reel

Packaging

(–042 positions

maximum)

–TY

= Tray Packaging

DP

(2,40)

.0945

(5,97)

.235

(0,76) 

.030

(4,27) 

.168

(0,89)

.035

DIA

(0,20)

.008

(0,80)

.0315

02

01

(20,00)

.7875

(No. of Positions/14) x (20,00) .7875

(7,11)

.280

STACK HEIGHT

CAPABILITY

–01

(5,03) .198

LEAD

STYLE

HEIGHT

WITH QSE(-DP)

A

8,03mm, 11,03mm,

16,00mm, 19,00mm and

22,00mm Stack

Height Capability.

“Partitionable”-
combine
differential &
single-ended
banks in same
connector.

Call Samtec
ASP Group.

Single
Ended

Differential

APPLICATION

SPECIFIC OPTION

01

APPLICATION

SPECIFIC

OPTION

30

µ

" (0,76

µ

m)

Gold and Guide
Posts available.

Call Samtec.

Rated

at 5%

Configuration

5,03mm

Stack

Height

Near End

Crosstalk

Prop.

Delay

For complete Test Report logon to www.samtec.com?QTE-DP

Impedance Mismatch (

Ω

)

Rated

at 10%

~2%

@ 10.00 GHz

~1.75%

@ 6.40 GHz

35.0pS 6.40 GHz

10.0 GHz

98.8 to 98.2

@ 100pS

103.6 to 94.0

@ 50pS

111.6 to 88.0

@ 30pS

100.0 to 99.6

@ 250pS

Processing conditions will
affect mated height.

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

TM

Processing:

Max Processing Temp:

230

°

C for 60 seconds

SMT Lead Coplanarity:

(0,10mm).004" max (014-042)
(0,15mm).006" max (056-070)

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QSE-DP for
recommended PCB layout.

Note:

 Some lengths,

styles and options are
non-standard, non-returnable.

SPECIFICATIONS

Mates with:

QTE (-DP)

(0,43) 

.017

No. of Banks x  (20,00) .7875 + (0,13) .005

(2,79) 

.110

(0,41) .016

(5,02) .1975

(6,35).250

(4,70) .185

(20,00) .7875

(2,87) 

.113

(0,19) 

.0078

(5,74) 

.226

(20,00) .7875

(16,13) .635

(2,27) 

.0895

01

02

(0,80) .0315

(2,46)

 .097

(2,46)

 .097

(0,46) .018

(1,02) 

.040

DIA

For complete specifications
see www.samtec.com?QSE-DP

Insulator Material:

Liquid Crystal
Polymer

Contact Material:

Phosphor Bronze

Current Rating:

Contacts: 2A @ 80

°

C

Ground Plane: 9.5A @ 80

°

C

Operating Temp Range:

-65

°

C to +125

°

C

Voltage Rating:

225 VAC mated with QTE(-DP)
& 5mm Stack Height

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

0,80

mm

  DIFFERENTIAL  PAIRS

QSE (-DP)
SERIES

QSE

NO. OF

PAIRS

D

PLATING

OPTION

OTHER

OPTION

–014, –028, –042,

–056, –070

(14 pairs per bank)

–F

= Gold Flash on Signal Pins and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins

and Ground Plane

–K

= (8,25mm)

.325" DIA

Polyimide

film

Pick &

Place Pad

–TR

= Tape &

Reel

Packaging

(–042

positions

maximum)

–TY

= Tray

Packaging

DP

(20,00) .7875

01

02

(7,49)

.295

(0,15)

.006

(0,80)

.0315

(2,40)

.0945

(3,25)

.128

(3,05)

.120

(0,76) 

.030

(7,24)

.285

(0,89)

.035

DIA

(No. of Positions/14) x (20,00) .7875 

+ (1,27) .050

01

A

STACK HEIGHT

CAPABILITY

8,03mm, 11,03mm,

16,00mm, 19,00mm
and 22,00mm Stack

Height Capability.

“Partitionable”-
combine
differential &
single-ended
banks in same
connector.

Call Samtec
ASP Group.

Single
Ended

Differential

APPLICATION

SPECIFIC OPTION

–01

(5,03) .198

QTE

LEAD

STYLE

HEIGHT

WITH

QTE(-DP)

APPLICATION

SPECIFIC

OPTION

30

µ

" (0,76

µ

m)

Gold and Guide
Posts available.

Call Samtec.

Rated

at 5%

Configuration

5,03mm

Stack

Height

Near End

Crosstalk

Prop.

Delay

For complete Test Report logon to www.samtec.com?QSE-DP

Impedance Mismatch (

Ω

)

Rated

at 10%

~2%

@ 10.00 GHz

~1.75%

@ 6.40 GHz

35.0pS 6.40 GHz

10.0 GHz

98.8 to 98.2

@ 100pS

103.6 to 94.0

@ 50pS

111.6 to 88.0

@ 30pS

100.0 to 99.6

@ 250pS

Processing conditions will
affect mated height.

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

PERPENDICULAR

HORIZONTAL

APPLICATIONS

QTE

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

Processing:

Max Processing Temp:

230

°

C for 60 seconds

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QTE-EM
for recommended PCB layout.

Note:

 Some lengths, styles

and options are non-standard,
non-returnable.

SPECIFICATIONS

–020, –040,

–060, –080, –100

(40 total positions per bank)

–F

= Gold Flash on Signal Pins and

Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins

and Ground Plane

Mates with:

QSE

01

(0,80)

.0315

(4,27)

.168

(3,00)

.118

(5,97)

.235

(0,20)

.008

(1,02)

.040

(3,18)

.125

DIA

(7,62)

.300

(0,38)

.015

(20,00) .7875

(No. of Positions/20) x (20,00) .7875 + (5,72) .225

(No. of Positions/20) x (20,00) .7875 + (9,90) .390

(No. of Positions/20) x (20,00) .7875 + (20,00) .7875

A

(4,45)

.175

(2,03) .080

(1,40) 

.055

(4,70) 

.185

(0,25) 

.010

(2,67) 

.105

Score 

Line

(1,09) 

.043

(3,239) 

.1275

(0,80) 

.0315

(0,36) 

.014

No. of

Banks

X

(20,00)

.7875

+

(0,318)

.0125

Score 

Line

Disposable

Stencil 

Support

Area

Paste

(0,38) 

.015

(0,15) 

.006

(0,25) 

.010

(0,12) 

.045

(0,13) 

.005

OTHER

OPTION

–GP

= Guide

Post

–GP OPTION

For complete specifications
see www.samtec.com?QTE-EM

Insulator Material:

Liquid Crystal
Polymer

Terminal Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp Range:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

0,80

mm  

HI-SPEED  HEADER

QTE (-EM)
SERIES

CARD

SLOT

–EM2

= (1,60mm)

.062" Card

CARD

SLOT

A

(1,70)

.067

– EM2

APPLICATION

SPECIFIC OPTION

30

µ

" (0,76

µ

m) Gold, Edge Mount

Differential Pair and Tray Packaging.

Call Samtec.

Please contact Samtec

Interconnect Processing

Group at www.samtec.com/

standard_products/

processing_information/ipg.asp

TM

WWW.SAMTEC.COM

 SAMTEC USA

 • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047      

SAMTEC UK 

• Tel: 01236 739292 • Fax: 01236 727113      

SAMTEC GERMANY

 • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 

SAMTEC FRANCE

 • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61     

SAMTEC ITALY

 • Tel: 39 039 6890337 • Fax: 39 039 6890315     

SAMTEC ASIA PACIFIC

 • Tel: 65 6745-5955 • Fax: 65 6841-1502      

SAMTEC CHINA

 • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047      

SAMTEC JAPAN 

• Tel: 81-424-42-8318 • Fax: 81-424-42-8319 

SAMTEC TAIWAN 

• Tel: 886-02-2364-6077 • Fax: 886-02-2367-9531      

SAMTEC HONG KONG 

• Tel: 852-26904858 • Fax: 852-26904842      

SAMTEC ANZ • 

Tel:  613 9512 7747 • Fax: 613 9512 7745   

Due to technical progress, all designs, specifications and components are subject to change without notice.

F-203

Mates with:

QTE

QSE

NO. OF POSITIONS

PER ROW

D

PLATING

OPTION

–020, –040,

–060, –080, –100

(40 total positions per bank)

–F

= Gold Flash on Signal Pins

and Ground Plane

–L

= 10

µ

" (0,25

µ

m) Gold on Signal Pins

and Ground Plane

01

For complete specifications
see www.samtec.com?QSE-EM

Insulator Material:

Liquid Crystal Polymer

Contact Material:

Phosphor Bronze

Current Rating:

Testing Now!

Operating Temp Range:

-65

°

C to +125

°

C

Plating:

Au over 50

µ

" (1,27

µ

m) Ni

SPECIFICATIONS

(20,00) .7875

(No. of Positions/20) x (20,00) .7875 + (11,18) .440

01

02

(0,15)

.006

(0,80)

.0315

(3,05)

.120

(0,18)

.007

(1,68)

.066

(3,50)

.138

(4,45)

.175

(1,02)

.040

(7,24)

.285

0,80

mm  

EDGE  MOUNT  SOCKET

QSE (-EM)
SERIES

Processing:

Max Processing Temp:

230

°

C for 60 seconds

Suggested PCB Layouts:

For reference only. Please
contact Samtec or go to
www.samtec.com?QSE-EM
for recommended PCB layout.

(3,43) 

.135

(2,41) 

.095

(2,03) .080

(4,70) 

.185

(0,25) 

.010

Score 

Line

(1,09) 

.043

(3,924) 

.1545

(0,80) 

.0315

(0,31) 

.012

Score 

Line

Disposable

Stencil 

Support

Area

Paste

(0,38) 

.015

(0,15) 

.006

(0,25) 

.010

(0,12) 

.045

(0,13) 

.005

No. of

Banks

X

(20,00)

.7875

+

(0,572)

.0225

–EM2

= (1,60mm)

.062" Card

CARD

SLOT

Please contact Samtec

Interconnect Processing

Group at www.samtec.com/

standard_products/

processing_information/ipg.asp

Note:

 Some lengths, styles

and options are non-standard,
non-returnable.

OPTION

–GP

= Guide

Post

(60

positions

Max.)

APPLICATION SPECIFIC

OPTION

30

µ

" (0,76

µ

m) Gold, Edge Mount,

Differential Pair and Tray Packaging.

Call Samtec.

TM

PERPENDICULAR

HORIZONTAL

APPLICATIONS