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FOUNDRY 

SERVICES

www.ums-rf.com

Create your winning RF Products

thanks to UMS Foundry  

Service Expertise

Broad portfolio  

of proven and robust  

GaN / GaAs processes

Excellent electrical  

model accuracy

On wafer test and

Circuit validation

Industrial low-cost 

packaging service

Express your talent with UMS !

Industrial Technologies 

qualified for 

Space

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FOUND

R

Y

SERVICES

UMS has developed a family of robust and proven GaAs and 
GaN processes for the production of 

state-of-the-art RF 

performance MMICs.

 These processes are extensively used 

by foundry customers and UMS designers to deliver advanced 
MMIC solutions for Defense, Automotive, Space, Telecom and 
ISM markets.
UMS 

Design Manuals

 and 

Design Kits,

 developed in-house, 

help customers create customized circuits. During the design 
phase, the UMS Foundry team assists customers with a 

close 

and interactive support. UMS electrical models

 are 

renowned for 

their accuracy,

 which allows customers to 

succeed in reaching their RF performance targets 

right from 

their first development runs. 

All supplied wafers meet UMS 

Process Control Monitor 

(PCM)

 acceptance criteria specifications and are visually 

inspected, which is a guarantee of UMS manufacturing quality.
Furthermore, UMS offers several optional services including 

foundry training, on-wafer tests

 (DC, RF, noise, power, 

mixer), 

wafer dicing, die sorting, visual inspection, 

MMIC picking and packaging or delivery of Known 
Good Dies (KGD) as well as Space Wafer Acceptance 
and Lot Acceptance services.

This wide range of services completes UMS foundry offer, 
enabling our customers to succeed with their development and 
production, 

from small to very large volumes.

UMS offers a broad portfolio of high-performance and 

high-reliability

 GaAs and GaN-on-SiC processes for MMIC design.

GaN and GaAs processes for RF & mm-wave applications 

Application
Frequency

 1GHz  2GHz 

5GHz  10GHz 

20GHz 

50GHz 

100GHz

PPH25 - 

0.25µm GaAs Power pHEMT

PPH15X - 

0.15µm GaAs High Power pHEMT

HP07 - 

0,70µm GaAs MESFET

BES - 

Schottky Diode

PH10 - 

0.10µm GaAs Low Noise pHEMT

HB20M - 

2µm InGaP VCO HBT

ULRC - 

Passive GaAs 

GH25 - 

0.25µm GaN HEMT

GH15 - 

0.15µm GaN HEMT

PH25 - 

0.25µm GaAs Low Noise pHEMT

PH15 - 

0.15µm GaAs Low Noise pHEMT

GaN

GaAs

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Our processes include:

 

Air bridges

 MIM capacitors

 

TaN and TiWSi resistors

  

Via-holes

  

Coating for packaging

Open processes /  

Wafer fabrication

Process Design Kits

UMS modeling and CAD experts have built complete 
and highly accurate Process Design Kits (PDK). These 
PDKs include active (small and large signal) and passive 
scalable models that are directly linked to auto-layout 
and library options, compatible with your CAD tools.
UMS PDKs include schematic capture, layout generation, 
layout verification (DRC) and 3D view generation for 
EM simulation. They are fully compatible with:

  Pathwave ADS from Keysight (2017 to 2024 

versions) for all processes. 

 Microwave Office from Cadence for GaAs 

and GaN HEMT, HBT and Schottky diodes.

 Cadence Virtuoso (Layout and DRC).

 eDRC and Tape Out via our web portal.

Pathwave ADS  
(Keysight)

Microwave Office  

(Cadence)

Express your talent with UMS

www.ums-rf.com

Process

GH15

GaN

GH25

GaN

PH25

Low Noise

PH15

Low Noise

PH10

Low Noise

PPH25

Power

PPH15X

High Power

HB20M

VCO

HP07

BES

Active device

HEMT

HEMT

pHEMT

pHEMT

pHEMT

pHEMT

pHEMT

HBT

MESFET

Schottky

Power

Density

4.2W/mm

4.5W/mm

250mW/mm

300mW/mm

250mW/mm

700mW/mm

800mW/mm

2W/mm

400mW/mm

-

Gate Length

0.15µm

0.25µm

0.25µm

0.15µm

0.1µm

0.25µm

0.15µm

2µm

Emitter width

0.7µm

1µm

Ids (gm max)

Idss

Ids sat/Ic

-

1200 mA/mm
1450 mA/mm

-

880mA/mm

1000mA/mm

200mA/mm

-

500mA/mm

220mA/mm

-

550mA/mm

280mA/mm

-
-

200mA/mm

-

500mA/mm

350mA/mm

-

575mA/mm

-
-

0.3mA/µm²

300mA/mm

-

450mA/mm

-
-
-

V

BDS

 / V

BCE

>70V

>100V

> 6V

> 4.5V

> 5V

> 12V

> 12V

> 14V

> 14V

< -5V

(Anode/

Cathode

Cut off freq.

> 35 GHz

30GHz

90GHz

110GHz

130GHz

50GHz

70GHz

30GHz

15GHz

3THz

Vpinch

-3.2V

-3.4V

- 0.8V

- 0.7V

-0.45V

- 0.9V

- 0.95V

-

- 4.0V

-

Gm max / 

b

 

405mS/mm

290mS/mm

560mS/mm

640mS/mm

750mS/mm

450mS/mm

480mS/mm

60

110mS/mm

-

Wafer Thickness 

70/50µm

100µm

100/70µm

100µm

70µm

100µm

70µm

100µm

100µm

100µm

Noise / Gain

1.5dB / 11dB

@15GHz

1.8dB / 11dB

@15GHz

0.6dB / 13dB

@10GHz

2dB / 8dB

@40GHz

0.5dB / 14dB

@10GHz

1.9dB / 6dB

@60GHz

2.3dB / 4.5dB

@70GHz

0.6dB / 12dB

@10GHz

1.8dB / 6dB

@40GHz

-

-

-

 ULRC allows filters and matching circuits compatible with GaN

More details on process datasheets on the website

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Pathwave ADS  
(Keysight)

Back-end services:

•  

Automated on-wafer testing solutions 

for circuit characterization over  

1 to 110GHz and MMIC sorting according to your product specifications: 
100% functional on-wafer tests can thus be performed with various purposes 
such as DC tests, S-parameters measurement, noise measurement and 

 

CW-mode or pulsed-mode power measurement.

•  

Laser wafer dicing: 

This dicing technology allows high dicing yields.

•  

Visual inspection: 

with commercial or space screening grades.

•  

Picking in accordance 

with your sorting criteria: Individual die numbering 

allows chip identification. Known Good Dies may be delivered in Gel-Pak® 
or on UV-film.

UMS foundry services

Foundry course

UMS mainstream foundry service offer comes with the delivery of Design Kits and 
Design Manuals, the engineering support needed to get started, the construction 
of the reticle, the fabrication of the mask, and the manufacturing of GaN or GaAs 
wafers. In addition, UMS extensive Back-End services help customers address a 
broad range of requirements”

UMS 3-day Foundry Courses 

bring information about the III-V 
technologies, processes, design 
methods, standards and spirit of UMS 
foundry service. This 3-day training is 
organized on a regular basis. It can 
also be arranged on request.
The foundry course is delivered 
by UMS experienced product line 
designers and engineers. The course 
covers the following topics:

 GaN/GaAs  technologies   

and design rules

 LNA, PA, mixer, VCO design 

examples and design tricks

 CAD tools and electrical 

models demo with Cadence 

and Keysight  CAD support 

engineers

Back-end services:

 Measurement & Packaging 

capabilities for production

 Thermal  methodology   

and simulation

 Reliability 

 Foundry flow and DRC

In addition, UMS foundry users have 
the possibility to access additional 
e-training.

QFN packaging

UMS also propose low-cost 

QFN packaging 

service:

 BCB passivated circuits can be 

encapsulated in plastic molded packages.

Standard QFN packages are offered with various dimensions. 
Electrical models are available in the associated Design Kit for 
packaged MMIC designs.

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MPW runs combine circuits of multiple projects. This foundry offer allows different  
customer projects to be manufactured on a single wafer. This is a cost effective  
foundry approach suited to institutes,… and universities.

UMS is committed to offer full space evaluated processes. UMS is certified ISO 9001, ISO 14001 and ISO TS16949.

Multi Project Wafer (MPW)

Example of mask tiles with  
available die size (mm).

Foundry Service Modes

High Level Foundry Service Flow

Full Wafer mode

 Full mask
 Technical support
 Full wafer / Known Good Dies
  Standard process time
  Full Back-End offering

 

Space screening

 

QFN packaging

 Standard  

 Optional

Multi Project Wafer (MPW)

 

Shared mask

 Limited UMS support
 Low budget opportunity
 Fixed project launch date
 Fixed MMIC dimensions
 16-20 chips per MMIC version
 No On-Wafer Test

• 

1mm, 2mm, 3mm and 4mm for 

GaN

 processes 

(GH25, GH15)

• 

1.4mm, 2mm, 2.4mm, 3.4mm, 4mm and 4.4mm for 

high power GaAs

 

processes 

(PPH25X, PPH15X)

• 

1mm, 1.4mm, 2.4mm, 3.4mm and 4mm for 

low-to-medium power GaAs

 

processes 

(PH25, PH15, PH10, PPH25, HB20M, HP07, BES)

• 

1.4mm, 2mm, 2.4mm and 3.4mm for UMS 

passive GaAs

 process 

(ULRC) 

Prices per square millimeter vary according to the selected process. They can be found, along with additional details and MPW 
launch planning, at 

https://www.ums-rf.com/mpw/

Participants have free access to Design Kits and receive 16-20 untested devices of 
each MMICs version on the MPW tile in Gel-Pak® box. The possible MMIC length 
and width, including dicing streets and with a maximum 1:3 aspect ratio, are:

Before Design

Design to Launch

Fab to Shipment

Process selection 

based on customer 

requirement

MMIC Design

Final Launching 

Review and Sign-off

Mask and Wafer 

Manufacturing

DRC and Tile 

Construction

Back-End Operations

Design and Layout

Shipment

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Contact UMS

For more information about UMS foundry services: 

 foundry@ums-rf.com

In addition to Foundry services, UMS also offers a complete catalogue of RF and mmwave solutions. 

For more information about UMS catalogue RF and mmwave solutions:

mktsales@ums-rf.com

Visit our website:

  

www.ums-rf.com

and

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Example of mask tiles with  
available die size (mm).

Direct sales contacts:

UMS SAS – EMEA

Ph: +33 1 69 86 32 00
pascal.legret@ums-rf.com

UMS USA, Inc. - America

Ph: +1 781 791 5078
philippe.labasse@ums-rf.com

UMS - Asia 

Ph: +65 9298 8316
thomas.vacher@ums-rf.com

www.ums-rf.com

www.linkedin.com/company/ums-united-monolithic-semiconductors/

Preferred Design Center

Since its inception in 2004, MEC has been dedicated to developing high-performance 
MMICs on UMS advanced IIIV processes. Over the years, more than 200 MMICs have 
been designed with UMS, mainly for space, military and telecom applications. Notably, 
MEC and UMS have successfully cooperated on many European strategic programs.
MEC’s strengths are its ability to design very challenging high-power GaAs and GaN 
MMICs up to millimeter bands, its in-house thermal modeling expertise and its on-field 
applicative support.

For customers lacking in-house design resources or with limited MMIC design expertise, but willing to benefit 
from UMS advanced processes and foundry services, UMS recommend its design partners Viper RF and MEC 
who are well-established design houses with a strong experience of using UMS foundry services.

Both design houses have highly skilled engineers with extensive experience in using UMS design tools and processes, as well 
as a proven track record of successfully delivering high-frequency, high-performance UMS-based MMICs. Outsourcing MMIC 
design to those UMS preferred design centers is a highly recommended option for companies seeking design expertise and cost-
effectiveness, and willing to be on target immediately through the first MMIC prototyping run.

VIPER RF is a microwave and millimetre-wave product company with headquarters in the 
United Kingdom. The company was established in 2008 and is now a globally recognized 
MMIC supplier and design center.
VIPER RF custom designs GaAs & GaN MMICs for applications from 1-150GHz and 
has supplied MMICs into some of the most demanding commercial, defence and space 
markets.

https://www.mec-mmic.it/

https://www.viper-rf.com/