Ultra High Precision Z-Foil BGA Surface Mount Resistor
3R Network, Temperature Coefficient Tracking 0.1 ppm/°C and
Load Life Ratio Stability to ± 0.01 % (100 ppm)
VFB1515N
Vishay Foil Resistors
Document Number: 63139
For any questions, contact:
foil@vishaypg.com
www.foilresistors.com
Revision: 26-Mar-10
1
INTRODUCTION
Bulk Metal
®
Z-Foil technology out-performs all other resistor
technologies available today for applications that require
ultra-high precision and ultra-high stability. The Z-Foil
technology provides a significant reduction of the resistive
element’s sensitivity to ambient temperature variations
(TCR) and to self heating when power is applied (power
coefficient).
Model VFB1515N offers low TCR (both absolute and
tracking), low PCR (both absolute and tracking), excellent
load life stability, tight tolerance, excellent ratio stability, and
low current noise, all in one package. 0.05 ppm/°C absolute
TCR removes errors due to temperature gradients.
The VFB1515N ball grid array (BGA) surface mount
3-resistor network provides tight tolerance matching and
TCR tracking between 3 resistors simultaneously etched on
one piece of foil on a common substrate. The electrical
specifications of this integrated construction offers improved
performances and better real estate utilization over discrete
resistors and matched pairs.
Our application engineering department is available to
advise and make recommendations. For non-standard
technical requirements and special applications, please
contact us.
FEATURES
Temperature coefficient of resistance (TCR):
Absolute: ± 0.05 ppm/°C typical (0 °C to + 60 °C)
± 0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C
ref.)
Tracking: 0.1 ppm/°C typical
Power coefficient tracking “
R due to self heating”: 5 ppm
at rated power
Power rating: maximum 0.1 W per resistor at 70 °C,
maximum 0.2 W for entire package
Resistance tolerance match: 0.01 %
Ratio stability: 0.01 % (0.2 W at 70 °C, 2000 h)
Large variety of resistance ratios: 200
to 10 k
Electrostatic discharge (ESD) up to 25 000 V
Short time overload
0.01 % (100 ppm)
Non inductive, non capacitive design
Rise time: 1 ns effectively no ringing
Thermal stabilization < 1 s
Current noise: < - 40 dB
Voltage coefficient: < 0.1 ppm/V
Non inductive: < 0.08 µH
Non hot spot design
Terminal (solder ball) available: lead (Pb)-free
tin/lead alloy
Compliant to RoHS directive 2002/95/EC
Maximum working voltage for entire package: 64 V
For better performances please contact us
Note
(1)
For other values and ratios, please contact sales engineering department: foil@vishay.com
* Pb containing terminations are not RoHS compliant, exemptions may apply
TABLE 1 - POPULAR RESISTANCE VALUES/RATIO AND TCR CHARACTERISTICS
POPULAR VALUES
AVAILABLE
(1)
(R1/R2/R3)
RESISTANCE
VALUE CODE
TCR MAX. (MIL RANGE)
TOLERANCE
ABSOLUTE
TRACKING
ABSOLUTE
MATCH
(R1/R2 and R3/R2)
10K/400R/10K
V0353
2.0 ppm/°C
2.0 ppm/°C
0.1 %
0.05 %
10K/200R/10K
V0354
TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS PER MIL-PRF-55342
TEST
R
RATIO
Thermal shock, 5 x (- 65 °C to + 150 °C)
0.01 % (100 ppm)
0.01 % (100 ppm)
Low temperature operation, - 65 °C at P
nom.
45 min
0.01 % (100 ppm)
0.005 % (50 ppm)
Short time overload, 6.25 x P
nom.
x 5 s
0.01 % (100 ppm)
0.01 % (100 ppm)
High temperature exposure, 100 h at + 150 °C
0.01 % (100 ppm)
0.01 % (100 ppm)
Resistance to soldering heat per MIL-PRF-55342
0.01 % (100 ppm)
0.01 % (100 ppm)
Moisture resistance MIL-STD-202, method 106 without load
0.05 % (500 ppm)
0.02 % (200 ppm)
Load life (ratio stability), + 70 °C for 2000 h
0.01 % (100 ppm)
0.01 % (100 ppm)