Description
The DP27 series Scotch-Weld™ Epoxy Potting Compound/Adhesive is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing and encapsulation of many electronic components and is available in clear or black. Scotch-Weld™ epoxy potting compound/adhesive DP270 is noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions. The Scotch-Weld™ DP270 epoxy potting compound/adhesive has a work life of approximately 70 minutes, a tack-free time of about 3 hours and is fully cured after 48 hours at 73°F (23°C). This product produces no exotherm in 5 to 10g masses and a very slight exotherm in larger masses. The Scotch-Weld™ epoxy potting compound/adhesive is ideal for the potting and encapsulation of many heat sensitive or delicate components such as glass diodes and sensors as well as for transformers, coils, chokes and relays.
- Good thermal shock resistance
- Long work life
- Excellent electrical properties
- Negligible exotherm
- Formula is ideal for potting and bonding electronic and electrical components
- Non-exothermic reaction safeguards heat-sensitive components
- Extended work-time allows for positioning and adjustment to fit prior to setting
- Non-corrosiveness to copper preserves conductivity and retention of insulation properties
- Effective adhesive system for potting, bonding, joining, gluing, attaching, assembling, encapsulating, and sealing applications
Typical Use: | Ideal for the potting and encapsulation of many heat sensitive of delicate components such as glass diodes and sensors as well as for transformers, coils, chokes, relays, etc. |
Brand: | Scotch-Weld |
Chemical Composition: | Epoxy/amine |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature |
Cure Time: | 48h @ 23 °C |
Dielectric Strength: | 850 V/mil |
Hardness: | 83 D |
Key Specifications: | UL rating: 94 HB (File No. E61941) |
Mix Ratio: | 1:1 by volume; 100:85 by weight |
Specific Gravity: | 1.15 |
Tack Free Time: | 3h |
Thermal Conductivity: | 0.177 W/mC |
Viscosity: | Base: 7,000 to 16,000; Accelerator: 6,000 to 12,000 |
Volume Resistivity: | 4.1 x 10^14 ohm-cm |
Working Time: | 60 to 70min |
Manufacturer:3M Electronic Solutions
Datasheet:3M/270.pdf