Description
Laird Technologies offers Thermal Interface Solutions for today’s challenges with electronics that are smaller, but more powerful. Laird ‘s TIM s are designed to fill in air gaps and microscopic irregularities to provide more efficient cooling. Tgard Electrical Insulators are thermally conductive for use where electrical isolation and thermal conductivity is critical. Tpcm High-Performance product line is ideal for applications in which reliability, repeatability, and handling must be controlled to optimize the performance as part of the total thermal solution. Tgrease High-Performance product is used in applications where a minimum bond line, constant pressure, and ease of screen printing is desired for optimal performance. Tgrease is designed to maximize reliability by eliminating pump out inmost applications. Tflex Gap Fillers are used to bridge the interface between hot components and a chassis or heat sink assembly. The combination of good thermal conductivity and softness reduces mechanical stress, but maintains thermal performance. Tlam and Tpreg Thermal Printed Circuit Boards are thermally conductive circuit boards designed with Laird’s unique dielectric materials 1KA, HTD and LLD. Tputty Gap Filler is used to bridge the interface between hot components and a chassis or heat sink assembly when elimination of mechanical stress or bulk dispensing are critical design considerations. Tpli Gap Filler is used where high thermal conductivity and low pressures are required. Tgon 800 Gap Filler is a high-performance, cost-effective TIM that can be used where electrical isolation is not required.
Manufacturer Part Number: A15028-01
Laird Technologies
