DP270 3M Epoxy Potting Compound Black, 50 mL

Description

3M DP270 Adhesive, Scotch-Weld, Epoxy, Cartridge, Black, 50 ml, Scotch-Weld™ Series

3M Scotch-Weld Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage making it well-suited for potting and bonding electronic and electrical components.

Features a 70 minute work life
Rigid potting compound is non-corrosive to copper
Minimal exotherm and very low shrinkage
Flammability testing per UL94 HB

The DP27 series Scotch-Weld™ Epoxy Potting Compound/Adhesive is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing and encapsulation of many electronic components and is available in clear or black. Scotch-Weld™ epoxy potting compound/adhesive DP270 is noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions. The Scotch-Weld™ DP270 epoxy potting compound/adhesive has a work life of approximately 70 minutes, a tack-free time of about 3 hours and is fully cured after 48 hours at 73°F (23°C). This product produces no exotherm in 5 to 10g masses and a very slight exotherm in larger masses. The Scotch-Weld™ epoxy potting compound/adhesive is ideal for the potting and encapsulation of many heat sensitive or delicate components such as glass diodes and sensors as well as for transformers, coils, chokes and relays.