Description
GP2500S20-0.020-02-0816 Bergquist Thermal Interface Products Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material, 8″ x 16″ Sheet, 0.020″ Thickness, Gap Pad TGP 2400 Series / Also Known as Bergquist Gap Pad 2500S20 Series
Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The comfortable nature of Gap Pad allows the pad to fill-in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad is also available with or without adhesive.
Manufacturer:Electronic Components
Datasheet:Others/Sil-Pad_Selection_Guide.pdf
