Description
2 Mil tapes are made of high temperature polyimide film. These tapes are used in masking of circuit boards during wave soldering or other electronic manufacturing processes. They can be used in powder coating, automotive and transformer manufacturing. They have a high dielectric strength. tapes offer excellent performance in electrical and thermal insulation.
2 Mil tapes are made of 2 Mil thick Polyimide material with 1.5 mil of silicone adhesive and do not leave any residue. They can withstand temperature up to 500°F/260°C and conforms to MIL SPEC MIL-P-46112 Type I. They are packaged in 3″ core and are 36 yards long.
Applications: Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering, transformer and capacitor insulation, powder coating and high temperature applications.
P-222 AMB is for heavy-duty, high temperature applications where a 1-mil polyimide will not provide adequate strength or physical protection.
- Superior physical and electrical properties are retained at higher temperatures.
- Aggressive, high temperature silicone adhesive is solvent resistant and compliments the polyimide backing to produce a tape with exceptional high temperature properties.
- Tough backing provides the ultimate in tensile, tear, puncture and abrasion resistance when used with medium-gauge and heavy-gauge magnet wire.
- Very high dielectric strength for critical insulating requirements.
- High performance Kapton® backing ensures consistent quality.
BACKING | 2-MIL Kapton® Polyimide Film |
---|---|
COLOR | Amber |
INSULATION CLASS UL | 356°F -180°C |
CERTIFICATIONS | UL-510 |
GOVERNMENT SPECIFICATIONS | MIS 31631A Type II/ASTM D5213 TYPE 1, CLASS A (Replaces obsolete MIL-P-46112B) |
IMPERIAL | METRIC | |
---|---|---|
TOTAL TAPE THICKNESS | 3.7 mils | 0.094 mm |
TENSILE STRENGTH | 71 lbs/in | 124 N/10mm |
ELONGATION | 90% | 90% |
ADHESION TO STEEL | 26 oz/in | 2.8 N/10mm |
DIELECTRIC STRENGTH | 13,000 volts | 13.0 kV |
Manufacturer:Electronic Components
Datasheet:ETPRP222_tds.pdf