Description
UA-2605 Zymet Reworkable Edgebond Adhesive good hardness, good abrasion resistance and good leveling enhances^Board Level Reliability of Large WLCSP
Zymets reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. With the reworkable adhesive, no failures were encountered at 2000 cycles, end of test.
Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is reduced by the elimination of board preheat and capillary flow. Quality is improved because voids and incompatibility with flux residues are moot. Rework is far easier, further reducing cost. Zymet’s reworkable edgebond adhesives provide all this, as they ruggedize and enhance the board level reliability of challenging electronic assemblies, even for enterprise and automotive applications.
Manufacturer:Electronic Components
Datasheet:zymet-ua-2605-b-may2016.pdf
