Description
W25Q128FWSIQ Winbond 128Mb Flash NOR Memory 16M x 8 8-SOIC SMD
echnical Specifications
EU RoHS Compliant
ECCN (US)
Package Length 5.28
Package Width 5.28
Mounting Surface Mount
Lead Shape Gull-wing
PCB changed 8
Package Height 1.8
Cell Type NOR
Chip Density (bit) 128M
Architecture Sectored
Boot Block No
Block Organization Symmetrical
Address Bus Width (bit) 24
Sector Size 4Kbyte x 4096
Page Size 256byte
Number of Bits/Word (bit) 8
Number of Words 16M
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 6
Maximum Erase Time (s) 200/Chip
Maximum Programming Time (ms) 5/Page
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V)1.65
Typical Operating Supply Voltage (V)1.8
Maximum Operating Supply Voltage (V)1.95
Programming Voltage (V)1.65 to 1.95
Operating Current (mA)20
Program Current (mA)25
Minimum Operating Temperature (C)-40
Maximum Operating Temperature (C)85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Packaging Tube
Standard Package Name SOP
Pin Count 8
Supplier Package SOIC
Manufacturer Part Number: W25Q128FWSIQ
Manufacturer: Electronic Components