Heat Sinks

IBS Electronics is a distributor of heat sinks, heat sink compounds, including thermally conductive adhesives, encapsulants, compounds, and greases, which rapidly transfer heat from heat generator to heat sink for applications including computers, telecommunications devices, audio/video devices, avionics, aerospace, automotive manufacturing, interactive circuitry & semiconductor equipment. Compounds include epoxies, silicones, polyurethanes, acrylics & latex compounds. Types include electrically insulative, thermally conductive & electrically conductive systems.

Heat sinks are passive cooling components designed to dissipate heat from electronic devices or systems that produce high heat loads, such as computers, servers, and industrial equipment. They typically consist of a base and a series of fins, which are made from materials with high thermal conductivity, like aluminum or copper. The primary function of a heat sink is to transfer heat to the surrounding air, thereby ensuring optimal thermal performance and preventing system failure or damage.

These components act as passive heat exchangers, moving the heat generated by electronic components to a fluid medium—commonly air or a liquid coolant. This process helps maintain the devices at a safe operating temperature. Heat sinks are designed to maximize the surface area in contact with the cooling medium, which enhances heat dissipation. Materials such as copper or aluminum are preferred for their high thermal conductivity.

Heat sinks operate through conduction, convection, and radiation. The base of the heat sink conducts heat away from the electronic component and distributes it to the fins. The increased surface area provided by the fins facilitates heat transfer to the surrounding air. As air flows over the fins, it absorbs the heat and carries it away, either naturally or with the aid of a fan or blower for forced convection.